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News tagged Ibiden
  • Last update: Friday 13 June 2014 [8 news items]

Supply of any-layer HDI boards to remain in 2H14, says Compeq chairman

Jun 13, 14:16

The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufactur...

Compeq chairman Wu Chien

IC substrate suppliers to compete for 20nm and below process orders in 2015

Apr 25, 14:33

IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...

Taiwan makers begin to ship FPCBs, HDI boards for new iPhone

Sep 13, 01:10

Taiwan-based Flexium Interconnect and Zhen Ding Technology Holding have begun shipments of flexible PCBs (FPCBs) for use in the new iPhone, while Taiwan-based Unimicron Technology,...

Sources reveal some PCB suppliers for iPad 2

Nov 19, 01:30

Ibiden, Tripod Technology and TTM Technologies have been named as the initial PCB suppliers for a second-generation Apple tablet PC, which is expected to be launched in the first...

Nanya PCB to get more FC substrate backend orders from Intel on better yields

Oct 21, 01:10

Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...

Topoint, Key Ware enter Japan drill bit supply chain

Oct 27, 16:40

Taiwan-based drill bit maker Topoint Technology has entered the supply chain of Japan-based substrate maker Ibiden Electronics, while Key Ware Electronics has also received orders...

Key Ware drill bits

Taiwan IC substrate supply chain seeing more outsourcing and material orders from Japan

Jan 12, 12:17

Due to the appreciating Japanese yen, Japan's first-tier IC substrate makers have increased their outsourcing, benefiting Taiwan companies, according to market watchers.

Semco becomes top-two FC-CSP substrate supplier

Nov 13, 01:00

Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...

Realtime news
  • ECS suffers net loss per share of NT$1.70 for 2016

    Before Going to Press | 2h 43min ago

  • HTC teams up with Qingdao Publishing to tap educational VR market in China

    Before Going to Press | 2h 44min ago

  • Compal expects to ship 40 million PCs in 2017

    Before Going to Press | 2h 45min ago

  • Digitimes Research: Sony launches Bravia OLED TVs, Samsung beefs up marketing of QLED TVs in March

    Before Going to Press | 2h 45min ago

  • MediaTek to merge with affiliate Airoha

    Before Going to Press | 2h 46min ago

  • Lenovo talking with Fujitsu about buying PC business, says Nikkei

    Before Going to Press | 2h 56min ago

  • Mitac Holdings to deal out 2016 dividend of NT$2.50

    Before Going to Press | 3h 29min ago

  • Quanta to deal out 2016 dividend of NT$3.50

    Before Going to Press | 3h 35min ago

  • PChome Online to deal out 2016 dividend of NT$5.583

    Before Going to Press | 3h 40min ago

  • Clevo to hand out 2016 dividend of NT$0.70

    Before Going to Press | 3h 46min ago

  • Competition in AI platform market intensifying

    Before Going to Press | 3h 51min ago

  • Inventec expects 10% growth in 2017 revenue from servers

    Before Going to Press | 4h 8min ago

  • Hua Hong seeing robust smart card chip demand

    Before Going to Press | 4h 9min ago

  • Invetec net profits stay flat in 2016

    Before Going to Press | 4h 9min ago

  • Twinhead International to not hand out 2016 dividend

    Before Going to Press | 4h 10min ago

  • Unitech Computer to deal out 2016 dividend of NT$1.30

    Before Going to Press | 4h 10min ago

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Global notebook shipment forecast, 2017 and beyond
Trends and forecasts for the China FPD industry, 2014-2017

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