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News tagged Ibiden
  • Last update: Friday 13 June 2014 [8 news items]

Supply of any-layer HDI boards to remain in 2H14, says Compeq chairman

Jun 13, 14:16

The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufactur...

Compeq chairman Wu Chien

IC substrate suppliers to compete for 20nm and below process orders in 2015

Apr 25, 14:33

IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...

Taiwan makers begin to ship FPCBs, HDI boards for new iPhone

Sep 13, 01:10

Taiwan-based Flexium Interconnect and Zhen Ding Technology Holding have begun shipments of flexible PCBs (FPCBs) for use in the new iPhone, while Taiwan-based Unimicron Technology,...

Sources reveal some PCB suppliers for iPad 2

Nov 19, 01:30

Ibiden, Tripod Technology and TTM Technologies have been named as the initial PCB suppliers for a second-generation Apple tablet PC, which is expected to be launched in the first...

Nanya PCB to get more FC substrate backend orders from Intel on better yields

Oct 21, 01:10

Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...

Topoint, Key Ware enter Japan drill bit supply chain

Oct 27, 16:40

Taiwan-based drill bit maker Topoint Technology has entered the supply chain of Japan-based substrate maker Ibiden Electronics, while Key Ware Electronics has also received orders...

Key Ware drill bits

Taiwan IC substrate supply chain seeing more outsourcing and material orders from Japan

Jan 12, 12:17

Due to the appreciating Japanese yen, Japan's first-tier IC substrate makers have increased their outsourcing, benefiting Taiwan companies, according to market watchers.

Semco becomes top-two FC-CSP substrate supplier

Nov 13, 01:00

Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...

Realtime news
  • China December mobile communication user base grows to 1.322 billion, says MIIT

    Mobile + telecom | 1h 17min ago

  • China software revenues reach CNY4.851 trillion in 2016, says MIIT

    IT + CE | 1h 32min ago

  • SPIL posts EPS of NT$3.19 for 2016

    Bits + chips | 1h 34min ago

  • Winbond nets NT$0.23 per share for 4Q16

    Bits + chips | 1h 38min ago

  • Google develops meldCX via cooperation with AOpen

    Before Going to Press | 1h 49min ago

  • Digitimes Research: Samsung, LG beefing up development of digital signage technology

    Before Going to Press | 1h 52min ago

  • Eversol asks for compensation of NT$295 million from GET

    Before Going to Press | 1h 53min ago

  • Chilisin eyeing top-3 spot in passive component segment

    Before Going to Press | 1h 56min ago

  • Diode maker Eris to post 30% profit growth in 2017

    Before Going to Press | 2h 1min ago

  • Silicon Motion posts record revenue and profits for 2016

    Before Going to Press | 2h 1min ago

  • Over 260 million TV panels shipped globally in 2016, says WitsView

    Before Going to Press | 2h 2min ago

  • Increasing sales of Nvidia graphics cards to affect profitability of other suppliers

    Before Going to Press | 2h 3min ago

  • Samsung, LG new flagship smartphones to feature 5.7-inch displays

    Before Going to Press | 2h 21min ago

  • Taiwan market: CHT expects profits to edge down 8% in 2017

    Before Going to Press | 3h 37min ago

  • LG Display 4Q16 net operating profit hits record

    Before Going to Press | 5h 27min ago

  • Shuttle buys back 2.01% stake

    Before Going to Press | 5h 30min ago

  • Pegatron China subsidiary acquires 2 factory buildings

    Before Going to Press | 5h 30min ago

  • China software revenues reach CNY4.851 trillion in 2016, says MIIT

    Before Going to Press | 5h 32min ago

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Taiwan server shipment forecast and industry analysis, 2016
Display panels for wearable devices

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Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.