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News tagged Ibiden
  • Last update: Friday 13 June 2014 [8 news items]

Supply of any-layer HDI boards to remain in 2H14, says Compeq chairman

Jun 13, 14:16

The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufactur...

Compeq chairman Wu Chien

IC substrate suppliers to compete for 20nm and below process orders in 2015

Apr 25, 14:33

IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...

Taiwan makers begin to ship FPCBs, HDI boards for new iPhone

Sep 13, 01:10

Taiwan-based Flexium Interconnect and Zhen Ding Technology Holding have begun shipments of flexible PCBs (FPCBs) for use in the new iPhone, while Taiwan-based Unimicron Technology,...

Sources reveal some PCB suppliers for iPad 2

Nov 19, 01:30

Ibiden, Tripod Technology and TTM Technologies have been named as the initial PCB suppliers for a second-generation Apple tablet PC, which is expected to be launched in the first...

Nanya PCB to get more FC substrate backend orders from Intel on better yields

Oct 21, 01:10

Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...

Topoint, Key Ware enter Japan drill bit supply chain

Oct 27, 16:40

Taiwan-based drill bit maker Topoint Technology has entered the supply chain of Japan-based substrate maker Ibiden Electronics, while Key Ware Electronics has also received orders...

Key Ware drill bits

Taiwan IC substrate supply chain seeing more outsourcing and material orders from Japan

Jan 12, 12:17

Due to the appreciating Japanese yen, Japan's first-tier IC substrate makers have increased their outsourcing, benefiting Taiwan companies, according to market watchers.

Semco becomes top-two FC-CSP substrate supplier

Nov 13, 01:00

Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...

Realtime news
  • North American semiconductor equipment industry posts US$1.86 billion in January billings

    Bits + chips | 6min ago

  • Globalfoundries announces availability of 45nm RF SOI to advance 5G mobile communications

    Bits + chips | 13min ago

  • MediaTek-Richtek deal probed for possible insider trading

    Bits + chips | 19min ago

  • UMC to pay NT$0.50 cash dividend for 2016

    Bits + chips - Stockwatch | 20min ago

  • PTI to deal out cash dividend of NT$4 for 2016

    Bits + chips | 57min ago

  • Diode maker Eris to hand out NT$3.46 in dividends for 2016

    Bits + chips - Newswatch | Feb 22, 21:36

  • Epistar to produce VCSELs

    LED | Feb 22, 21:34

  • Memory module maker Apacer to hand out cash dividend of NT$2.40 for 2016

    Bits + chips - Newswatch | Feb 22, 21:30

  • Toshiba to begin mass production of 64-layer, 512-gigabit 3D flash in 2H17

    Bits + chips | Feb 22, 18:19

  • Pegatron subsidiary acquires equipment for plants in China

    Before Going to Press | Feb 22, 21:35

  • MediaTek gross margin unlikely to rebound

    Before Going to Press | Feb 22, 21:18

  • Industrial robot makers expanding capacity for upcoming competition

    Before Going to Press | Feb 22, 21:16

  • AMD to release Ryzen in March with initial shipments to top 1 million

    Before Going to Press | Feb 22, 21:14

  • Diode maker Eris to hand out NT$3.46 in dividends for 2016

    Before Going to Press | Feb 22, 21:10

  • Transition to 18-inch wafers unlikely to happen over next 3 years, says Applied

    Before Going to Press | Feb 22, 21:09

  • MediaTek-Richtek deal probed for possible insider trading

    Before Going to Press | Feb 22, 21:08

  • Elan expects to post 6-9% decrease in 1Q17 revenues

    Before Going to Press | Feb 22, 21:06

  • WPG expects sales to recover starting 2Q17

    Before Going to Press | Feb 22, 21:06

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Tags: Ibiden
Global notebook shipment forecast, 2017 and beyond
Wireless broadband developments in Southeast Asia markets

23-Feb-2017 09:45 (GMT+8)

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Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.