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News tagged Ibiden
  • Last update: Friday 13 June 2014 [8 news items]

Supply of any-layer HDI boards to remain in 2H14, says Compeq chairman

Jun 13, 14:16

The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufactur...

Compeq chairman Wu Chien

IC substrate suppliers to compete for 20nm and below process orders in 2015

Apr 25, 14:33

IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...

Taiwan makers begin to ship FPCBs, HDI boards for new iPhone

Sep 13, 01:10

Taiwan-based Flexium Interconnect and Zhen Ding Technology Holding have begun shipments of flexible PCBs (FPCBs) for use in the new iPhone, while Taiwan-based Unimicron Technology,...

Sources reveal some PCB suppliers for iPad 2

Nov 19, 01:30

Ibiden, Tripod Technology and TTM Technologies have been named as the initial PCB suppliers for a second-generation Apple tablet PC, which is expected to be launched in the first...

Nanya PCB to get more FC substrate backend orders from Intel on better yields

Oct 21, 01:10

Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...

Topoint, Key Ware enter Japan drill bit supply chain

Oct 27, 16:40

Taiwan-based drill bit maker Topoint Technology has entered the supply chain of Japan-based substrate maker Ibiden Electronics, while Key Ware Electronics has also received orders...

Key Ware drill bits

Taiwan IC substrate supply chain seeing more outsourcing and material orders from Japan

Jan 12, 12:17

Due to the appreciating Japanese yen, Japan's first-tier IC substrate makers have increased their outsourcing, benefiting Taiwan companies, according to market watchers.

Semco becomes top-two FC-CSP substrate supplier

Nov 13, 01:00

Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...

Realtime news
  • ASE buys equipment from Teradyne

    Bits + chips - Stockwatch | 12min ago

  • TSMC discloses NT$4.4 billion worth of facility construction for Nanjing fab

    Before Going to Press | 1min ago

  • ASE, SPIL sign merger deal

    Before Going to Press | 1min ago

  • Taiwan market: FET launches smart home solution

    Before Going to Press | 24min ago

  • Huawei to launch VR device in July

    Before Going to Press | 26min ago

  • China market: Xiaomi to launch 3rd-party mobile payment services

    Before Going to Press | 28min ago

  • AIC offers hardware/software integrated solutions for data centers

    Before Going to Press | 29min ago

  • Efun Technology to not deal out 2015 dividend

    Before Going to Press | 31min ago

  • Hota Industrial lands 7-year orders from BorgWarner

    Before Going to Press | 32min ago

  • Sharp to beef up overseas marketing of solar cells, says Nikkei

    Before Going to Press | 32min ago

  • Aaeon Technology to deal out 2015 dividend of NT$3

    Before Going to Press | 33min ago

  • Samsung Display to reportedly end production at 7G LCD factory

    Before Going to Press | 33min ago

  • Huawei Technologies ships 28.3 million smartphones globally in 1Q16, says report

    Before Going to Press | 34min ago

  • Short lead-time orders to buoy UMC 3Q16 revenues

    Before Going to Press | 35min ago

  • Digitimes Research: China IC production value to rise 15% in 2016

    Before Going to Press | 36min ago

  • Robust SSD demand to buoy related IC revenues in 3Q16

    Before Going to Press | 37min ago

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Analysis of China revised domestic semiconductor industry goals
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