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News tagged Ibiden
  • Last update: Friday 13 June 2014 [8 news items]

Supply of any-layer HDI boards to remain in 2H14, says Compeq chairman

Jun 13, 14:16

The supply of any-layer HDI boards will remain tight in the second half of 2014 due to limited capacity ramps by major players, according to Wu Chien, chairman of Compeq Manufactur...

Compeq chairman Wu Chien

IC substrate suppliers to compete for 20nm and below process orders in 2015

Apr 25, 14:33

IC substrate suppliers Ibiden, AT&S, Kinsus Interconnect Technology and Unimicron Technology are expected to compete fiercely for IC substrate orders using 20nm and below processes...

Taiwan makers begin to ship FPCBs, HDI boards for new iPhone

Sep 13, 01:10

Taiwan-based Flexium Interconnect and Zhen Ding Technology Holding have begun shipments of flexible PCBs (FPCBs) for use in the new iPhone, while Taiwan-based Unimicron Technology,...

Sources reveal some PCB suppliers for iPad 2

Nov 19, 01:30

Ibiden, Tripod Technology and TTM Technologies have been named as the initial PCB suppliers for a second-generation Apple tablet PC, which is expected to be launched in the first...

Nanya PCB to get more FC substrate backend orders from Intel on better yields

Oct 21, 01:10

Nanya PCB (NPC) is actively improving its production yield rates for CPU-use flip-chip (FC) substrate packaging in order to gain a larger share of orders from Intel, according to...

Topoint, Key Ware enter Japan drill bit supply chain

Oct 27, 16:40

Taiwan-based drill bit maker Topoint Technology has entered the supply chain of Japan-based substrate maker Ibiden Electronics, while Key Ware Electronics has also received orders...

Key Ware drill bits

Taiwan IC substrate supply chain seeing more outsourcing and material orders from Japan

Jan 12, 12:17

Due to the appreciating Japanese yen, Japan's first-tier IC substrate makers have increased their outsourcing, benefiting Taiwan companies, according to market watchers.

Semco becomes top-two FC-CSP substrate supplier

Nov 13, 01:00

Korea-based flip-chip chip-scale packaging (FC-CSP) substrate maker Semco has gained market share from Japan-based Ibiden to become one of the top-two players in the market, according...

Tags: Ibiden
Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.