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News tagged heat pipe
  • Last update: Wednesday 21 June 2017 [10 news items]

Cooling module maker CCI starts production at new factory in China

Jun 21, 14:48

Thermal module maker Chaung Choung Technology (CCI) is moving manufacturing equipment from a factory on lease in Chongqing, western China, to a newly constructed factory nearby. So...

Auras Technology sees smartphone heat-pipe demand remain brisk in 2017

Jun 9, 15:52

Heat-dissipation solution vendor Auras Technology, which reportedly is a major heat-pipe supplier for Samsung Electronics' Galaxy S8 smartphones, expects demand for heat-pipes from...

Delta, Furukawa land heat-pipe orders from LG, say Taiwan makers

Dec 2, 16:03

Following Samsung Electronics' adoption of heat-pipes for its Galaxy S7 and Galaxy Note 7, Korea-based LG Electronics reportedly is also planning to adopt heat-pipes for smartphones...

Taiwan ultra-thin heat-pipe makers under price cut pressure

May 31, 20:32

Due to increasing competition for orders for ultra-thin copper-based heat-pipes used in smartphones, prices for pipes with a diameter of 0.4mm have dropped from US$1 in early 2016...

Demand for heat-pipes for smartphones may emerge

Feb 26, 12:21

Samsung Electronics has adopted heat-pipes for its Galaxy S7-series, and this is expected to become a trend in the smartphone industry bringing business opportunities for heat-pipe...

Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%

Apr 21, 21:52

Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...

Heat pipe demand from tablets starts rising in 2013

May 2, 15:20

Cooling module demand from tablets is rising in 2013 as average power consumption of ARM-based processors has increased significantly from 3W in the past to 6-7W currently and heat...

CCL supplier ShineMore targets niche segment

Aug 2, 16:02

Taiwan-based ShineMore Technology Materials, a maker of copper clad laminates (CCL), has stepped up its efforts to to expand the application of its products. According to company...

Japan-based Furukawa Electric sues Taiwan-based CCI for infringement of heat-sink patent

Jan 27, 12:00

Japan-based Furukawa Electric on January 25 filed with Taiwan's Intellectual Property Court charging Chaun-Choung Technology (CCI) with infringement of its Taiwan patent No.121526...

Auras, CCT to expand heat-pipe capacity

Jan 19, 16:02

Taiwan-based cooler module makers Auras Technology and Chaun-Choung Technology (CCT) plan to expand their heat-pipe capacities and expect the new lines to start production in the...

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Trends and forecasts for the China FPD industry, 2014-2017

28-Jun-2017 10:45 (GMT+8)

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TAIEX (TSE)10389.26-122.80-1.17% 

TSE electronic438.36-4.31-0.97% 

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Analysis of China revised domestic semiconductor industry goals
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