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News tagged heat pipe
  • Last update: Monday 21 April 2014 [5 news items]

Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%

Apr 21, 21:52

Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...

Heat pipe demand from tablets starts rising in 2013

May 2, 15:20

Cooling module demand from tablets is rising in 2013 as average power consumption of ARM-based processors has increased significantly from 3W in the past to 6-7W currently and heat...

CCL supplier ShineMore targets niche segment

Aug 2, 16:02

Taiwan-based ShineMore Technology Materials, a maker of copper clad laminates (CCL), has stepped up its efforts to to expand the application of its products. According to company...

Japan-based Furukawa Electric sues Taiwan-based CCI for infringement of heat-sink patent

Jan 27, 12:00

Japan-based Furukawa Electric on January 25 filed with Taiwan's Intellectual Property Court charging Chaun-Choung Technology (CCI) with infringement of its Taiwan patent No.121526...

Auras, CCT to expand heat-pipe capacity

Jan 19, 16:02

Taiwan-based cooler module makers Auras Technology and Chaun-Choung Technology (CCT) plan to expand their heat-pipe capacities and expect the new lines to start production in the...

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Wireless broadband developments in Southeast Asia markets
Analysis of China revised domestic semiconductor industry goals

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TD-LTE market developments and forecast, 2014-2016
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