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News tagged heat pipe
  • Last update: Tuesday 4 July 2017 [12 news items]

Auras enjoys orders from servers, graphics cards and smartphones in 2017, says report

Jul 4, 15:44

Taiwan-based cooling module maker Auras is expected to enjoy a strong second half thanks to new orders for server-related products, increasing demand for graphics card cooling modules...

CCI expects rising demand in 2H17, says paper

Jul 4, 14:13

Cooling module maker Chaun-Choung Technology (CCI) expects its products for servers and notebooks to enjoy strong demand in the second half because of seasonality. Second-half revenues...

Cooling module maker CCI starts production at new factory in China

Jun 21, 14:48

Thermal module maker Chaung Choung Technology (CCI) is moving manufacturing equipment from a factory on lease in Chongqing, western China, to a newly constructed factory nearby. So...

Auras Technology sees smartphone heat-pipe demand remain brisk in 2017

Jun 9, 15:52

Heat-dissipation solution vendor Auras Technology, which reportedly is a major heat-pipe supplier for Samsung Electronics' Galaxy S8 smartphones, expects demand for heat-pipes from...

Delta, Furukawa land heat-pipe orders from LG, say Taiwan makers

Dec 2, 16:03

Following Samsung Electronics' adoption of heat-pipes for its Galaxy S7 and Galaxy Note 7, Korea-based LG Electronics reportedly is also planning to adopt heat-pipes for smartphones...

Taiwan ultra-thin heat-pipe makers under price cut pressure

May 31, 20:32

Due to increasing competition for orders for ultra-thin copper-based heat-pipes used in smartphones, prices for pipes with a diameter of 0.4mm have dropped from US$1 in early 2016...

Demand for heat-pipes for smartphones may emerge

Feb 26, 12:21

Samsung Electronics has adopted heat-pipes for its Galaxy S7-series, and this is expected to become a trend in the smartphone industry bringing business opportunities for heat-pipe...

Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%

Apr 21, 21:52

Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...

Heat pipe demand from tablets starts rising in 2013

May 2, 15:20

Cooling module demand from tablets is rising in 2013 as average power consumption of ARM-based processors has increased significantly from 3W in the past to 6-7W currently and heat...

CCL supplier ShineMore targets niche segment

Aug 2, 16:02

Taiwan-based ShineMore Technology Materials, a maker of copper clad laminates (CCL), has stepped up its efforts to to expand the application of its products. According to company...

Japan-based Furukawa Electric sues Taiwan-based CCI for infringement of heat-sink patent

Jan 27, 12:00

Japan-based Furukawa Electric on January 25 filed with Taiwan's Intellectual Property Court charging Chaun-Choung Technology (CCI) with infringement of its Taiwan patent No.121526...

Auras, CCT to expand heat-pipe capacity

Jan 19, 16:02

Taiwan-based cooler module makers Auras Technology and Chaun-Choung Technology (CCT) plan to expand their heat-pipe capacities and expect the new lines to start production in the...

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

23-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.