Samsung Electronics and SK Hynix are locked in fierce competition in the High-Bandwidth Memory (HBM) market, with attention turning to Nvidia, the leader in Artificial Intelligence...
SK Hynix has unveiled its latest high-bandwidth memory (HBM) production plan, poised to produce the fifth-generation HBM product, HBM3E, at its Icheon plant in South Korea. Meanwhile,...
The emergence of generative AI has made high-bandwidth memory (HBM) a bonanza, which helped the memory industry recover from huge losses due to inventory corrections in 2023.
Despite reporting a higher loss in the last quarter, Micron offered a strong revenue forecast and is optimistic about the outlook for the coming year as generative AI is driving demands...
Even though the White House seems to have softened its stance on chip export curbs against China, China still struggles to acquire the most advanced HBMs amid surging demand.
Following Nvidia and AMD's footsteps, cloud service provider AWS has started to design its proprietary artificial intelligence (AI) chips. This move is deemed beneficial for the growth...
All major DRAM chipmakers have prioritized DDR5 and high-bandwidth memory (HBM) in anticipation of a surge in demand from generative AI, according to industry sources.
Micron Technology expects to kick off volume production of HBM3E memory at its factory site in Taiwan, which the memory chipmaker considers a hub for advanced packaging, in the first...
The memory market is still slow. Operating losses at SK Hynix continued in the third quarter of 2023, but the quarterly loss was reduced by 37.8%. Despite this, its DRAM division...
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
The demand for high bandwidth memory (HBM) is poised to experience explosive growth starting in 2024, fueled by its incorporation into servers hosting large language models like ChatGPT...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
