News tagged gold bumping
Last update: Wednesday 29 July 2015 [25 news items]
Chipbond responds to reports of price reductions
Stockwatch - Oct 4, 13:58
Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...
ChipMOS expects weak 3Q11
Aug 19, 16:17
LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...
ChipMOS to expand into 12-inch gold bumping
Oct 5, 14:14
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
UAT tripling wafer bumping capacity
Jul 13, 11:52
Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...
Chipbond sees profits in 1Q10
Apr 23, 15:37
LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...
Chipbond completes merger with peer IST
Stockwatch - Apr 1, 15:21
LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...