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News tagged flash
  • Last update: Friday 20 October 2017 [806 news items]

Toshiba develops 3D flash memory with TSV technology

Jul 14, 15:48

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...

Toshiba 3D NAND flash with TSV

Semi content in electronic systems forecast to set new record in 2017, says IC Insights

Jul 14, 14:54

The global electronic systems market will grow only 2% to US$1,493 billion in 2017, while the worldwide semiconductor market is expected to surge by 15% to US$419.1 billion, according...

Faraday unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD controller

Jul 14, 14:01

Faraday Technology, a Taiwan-based ASIC design service and IP provider, has announced the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB...

Taiwan IC design houses gearing up for high speed transmissions

Jul 12, 16:00

With high speed transmissions becoming an important spec for electronics devices, Taiwan-based IC design houses including ASMedia, Parade Technologies, Weltrend, On-Bright, Etron...

Demand for high-speed transmission chips rising

SMIC increases output for NOR flash, while XMC cuts production

Jul 12, 14:48

Semiconductor Manufacturing International (SMIC) has landed more orders for NOR flash chips from GigaDevice Semiconductor and increased output, according to industry sources. On the...

Winbond, Macronix June revenues increase

Jul 7, 15:34

Winbond Electronics and Macronix International have reported sequential increases in June consolidated revenues of 4.7% and 15.9%, respectively.

Adata June revenues surge on memory price rally

Jul 6, 15:47

Rising memory chip prices buoyed Adata Technology's June revenues, which climbed to a 41-month high of NT$2.75 billion (US$90.1 million).

Supply of NAND flash for new iPhone falling short

Jul 5, 22:17

SK Hynix and Toshiba have both experienced lower-than-expected yield rates for their 3D NAND technologies resulting in fewer supplies for Apple's 2017 series of iPhones, according...

Talks to sell Toshiba Memory continue; announces new products

Jun 30, 11:01

Toshiba has disclosed the company continues to negotiate the sale of its memory chip business, Toshiba Memory, with Innovation Network of Japan, Bain Capital Private Equity and Development...

MediaTek unveils NB-IoT SoC, partnership with China Mobile

Jun 29, 15:04

MediaTek has unveiled its first narrow band Internet of Things (NB-IoT) system-on-chip (SoC), the MT2625, and announced a collaboration with China Mobile to build what the companies...

Winbond intros 1.2V, 1.5V NOR flash memories for IoT

Jun 28, 13:55

Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin...

New Winbond NOR flash for IoT

Faraday MFP ASIC shipments rise at CAGR of 38%

Jun 22, 21:20

Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...

NOR flash prices to rise 20% in 3Q17, says DRAMeXchange

Jun 22, 16:11

Increasing demand for AMOLED panels from brand-name smartphone vendors and the industry's rising output for TDDI (touch with display driver) solutions have propelled the NOR flash...

WD comments on Toshiba bid on flash JV

Jun 21, 20:38

Western Digital has issued a statement regarding Toshiba's selection of a consortium led by Korea-based SK Hynix and Bain Capital Japan, with funding provided by the government in...

Powerchip to restart NOR flash manufacturing

Jun 20, 14:23

Powerchip Technology has restarted its NOR flash production line amid tight supply of the memory.

Handset IC sales to top total personal computing in 2017, says IC Insights

Jun 20, 14:21

The ongoing slump in shipments of standard PCs along with the drop-off in tablets are setting the stage for handset IC sales to finally surpass IC revenues in total personal computing...

Winbond to expand 12-inch fab capacity

Jun 14, 20:27

Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...

winbond

Innodisk seeing tight NAND flash chip supply through 4Q17

Jun 13, 17:42

There will be a severe shortage of NAND flash memory chips in the third quarter of 2017, and the tight supply will persist through the fourth quarter, according to Taiwan-based Innodisk,...

Toppan welcomes partnership with China firms

Jun 13, 15:22

Toppan Printing welcomes the potential for China-based companies to become partners, according to the Japan-based photomask vendor. Toppan is looking to work closely with China-based...

IC distributor Supreme May revenues rise 12%

Jun 9, 10:19

Taiwan-based Supreme Electronics, a major IC distributor for Samsung Electronics, has announced revenues for May 2017 increased 12.4% sequentially and 27% on year to NT$11.19 billion...

Robust NOR flash demand to boost 3Q17 performance at backend firms

Jun 5, 10:22

Taiwan-based backend service companies including ChipMOS Technologies, Walton Advanced Engineering and Lingsen Precision Industries are expected to post brisk revenue results for...

NAND flash contract prices rise 20-25% in 1Q17, says DRAMeXchange

Jun 2, 15:13

The NAND Flash market remained tight in the first quarter of 2017 as it had been in the preceding quarter, according to DRAMeXchange. Despite seasonality, average contract prices...

PTI optimistic about memory-dominated packaging

Jun 2, 10:30

The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...

Fifteen chipmakers to spend more than US$1 billion on capex, says IC Insights

Jun 2, 10:29

There are 15 companies forecast to have semiconductor capital expenditures of more than US$1 billion in 2017, up from 11 in 2016 and only eight in 2013, according to IC Insights.

MediaTek launches next-gen Wi-Fi chipset portfolio for IoT

Jun 1, 15:21

MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...

DRAM market to remain oligopoly over next 3 years, says Nanya president

Jun 1, 15:21

The global DRAM market will remain an oligopoly of three large firms over the next three years, according to Pei-Ing Lee, president for Taiwan-based Nanya Technology.

Nanya president Pei-Ing Lee expects global DRAM industry to remain an oligopoly over the next 3 year

2017 automotive IC market on pace for record year, says IC Insights

May 30, 15:40

Electronic systems that improve vehicle performance; that add comfort and convenience; and that warn, detect, and take corrective measures to keep drivers safe and alert are being...

3S teaming up with Marvell to develop 28nm controller chips

May 23, 22:40

Solid State System (3S) has announced it is teaming up with Marvell to develop DRAM-less SSD controller solutions.

Phison still eyeing stake in Toshiba chip unit

May 22, 21:51

Phison Electronics originally planned to invest US$500 million in Toshiba's memory chip unit, but the plan has been postponed as Toshiba decided to sell more of the business' stake,...

ChipMOS expects revenue growth in 2Q17

May 12, 12:22

ChipMOS Technologies, a backend house targeting the LCD driver IC and memory chip sectors, expects rising sales generated from the LCD driver IC and mixed-signal chip sectors in the...

SMIC expects revenues to drop 3-6% in 2Q17

May 11, 15:42

China-based pure-play foundry SMIC expects to post a sequential decrease of 3-6% in revenues for the second quarter of 2017, with gross margin ranging from 25% to 27%.

Sumco lowering wafer shipments to XMC, say sources

May 11, 11:01

Sumco has reportedly cut its wafer shipments to Wuhan Xinxin Semiconductor Manufacturing (XMC), and given priority to Taiwan Semiconductor Manufacturing Company (TSMC), Intel and...

VIS seeking 8-inch fab equipment from memory chipmakers

May 9, 20:43

Specialty IC foundry Vanguard International Semiconductor (VIS) is looking to expand its 8-inch fabs, and has approached several memory makers to buy their second-hand equipment,...

Infineon rides automotive wave into top-10 semi supplier ranking, IC Insights says

May 9, 14:57

IC Insights has released its list of the world's top-10 semiconductor sales leaders excluding pure-play foundries in the first quarter of 2017. In total, the top-10 semiconductor...

Winbond, Macronix April revenues drop on-month

May 8, 23:03

Winbond Electronics and Macronix International have reported sequential decreases in April consolidated revenues of 0.4% and 15%, respectively.

806 items [3/24]
Realtime news
  • Arima Optoelectronics and Toshiba reach settlement on patent lawsuit

    Before Going to Press | 10h 42min ago

  • Sony looks to expand CIS presence in car electronics market

    Before Going to Press | 10h 59min ago

  • Powertech expects growth in 4Q17

    Before Going to Press | 11h ago

  • Graphics card vendors to see shipments rise in 2017

    Before Going to Press | 11h 31min ago

  • Huawei ships 112 million smartphones in January-October

    Before Going to Press | 11h 49min ago

  • Taiwan market: iPhone 8 best-selling smartphone in September

    Before Going to Press | 11h 50min ago

  • Aleees constructing new plant in China

    Before Going to Press | 11h 52min ago

  • Semiconductor firms eye edge-computing opportunities

    Before Going to Press | 11h 56min ago

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  • Samsung+eUFS+solution+for+auto+apps

    Samsung eUFS solution for auto apps

    Samsung Electronics has introduced the industry's first embedded Universal Flash Storage (eUFS) solution for use in next-generation automotive applications. Consisting of 128GB and...

    Photo: Company, Oct 13.

  • Winbond+NOR+flash+for+IoT

    Winbond NOR flash for IoT

    Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin...

    Photo: Company, Jun 29.

  • Samsung+14nm+chips+for+wearables

    Samsung 14nm chips for wearables

    Samsung Electronics has announced mass production of the Exynos 7 Dual 727 mobile application processor (AP) designed specifically for wearable devices with 14nm FinFET process technology...

    Photo: Company, Oct 18.

  • Samsung+256GB+UFS+card

    Samsung 256GB UFS card

    Samsung Electronics has unveiled removable memory cards based on the JEDEC Universal Flash Storage (UFS) 1.0 Card Extension Standard for use in high-resolution mobile shooting devices...

    Photo: Company, Jul 13.

  • Samsung+PM971%2DNVMe

    Samsung PM971-NVMe

    Samsung Electronics has begun mass producing NVM Express (NVMe) PCIe solid state drive (SSD) in a single ball grid array (BGA) package for next-generation PCs and ultra-slim notebook...

    Photo: Company, Jun 2.

UMC
Global AP demand forecast, 2017-2020

23-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.