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News tagged EUV
  • Last update: Monday 24 July 2017 [37 news items]

Marketech to enjoy robust OEM orders, says report

Jul 24, 13:55

Taiwan-based Marketech International is set to enjoy a ramp-up of OEM orders from ASML for a component used in the fab tool vendor's extreme ultraviolet (EUV) lithography equipment...

ASML expects 25% growth in 2017 sales

Jul 20, 16:00

ASML has disclosed that its second-quarter 2017 net sales came to EUR2.10 billion (US$2.42 billion), up from EUR1.94 billion from the previous quarter. The semiconductor equipment...

FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha

Jul 19, 10:37

Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...

Globalfoundries CEO

TSMC expanding number of equipment suppliers for 7nm

Jul 18, 22:59

Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...

TSMC 7nm technology ready for volume production in 2018

Brewer Science, Arkema partner to develop high-chi DSA materials for advanced node patterning

Jul 12, 22:35

Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copo...

Samsung begins mass production at new fab

Jul 4, 20:36

Samsung Electronics announced its new semiconductor fabrication line in Pyeongtaek (South Korea) has begun mass production and shipping its first product to customers. The new facility...

TSMC secures 7nm chip orders from Qualcomm

Jun 21, 21:36

TSMC has regained chip orders from Qualcomm for baseband chips produced on its 7nm process, but not application processors, according to industry sources.

7nm foundry market to heat up in 2018

Jun 16, 16:03

IC foundries are gearing up for mass production of 7nm chips in 2018, as well as production for 7nm process technology using extreme ultraviolet (EUV), according to market observers...

Packaging can extend physical limits of semiconductors, says TSMC chair

Jun 12, 15:41

Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

TSMC chairman Morris Chang

TSMC set to move 7nm to volume production in 2018

May 25, 22:14

Taiwan Semiconductor Manufacturing Company (TSMC) is set to move its 7nm process technology to volume production in 2018, an improved version of the 7nm process using extreme ultraviolet...

ASML secures pull-in of EUV equipment orders

Apr 20, 13:52

ASML has landed a pull-in of EUV lithography equipment orders with its backlog reaching 21 units, according to the company.

Gudeng seeing robust 12-inch fab equipment orders from China

Mar 20, 21:44

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has enjoyed a pull-in...

ASML expects to post record sales for 2016

Jul 21, 12:13

Lithography equipment supplier ASML expects to post record sales for 2016. "The ultimate level will depend on the timing of our EUV revenue recognition and the size of the combined...

TSMC expects to launch 5nm node 2 years after 7nm

Jan 18, 10:30

TSMC will be ready to roll out its 5nm process technology two years after the launch of its 7nm node, according to the pure-play foundry.

TSMC chairman Morris Chang is confident that the company will lead the 10nm foundry market segment

Imec and Cadence complete tapeout of first 5nm test chip

Oct 8, 10:08

Nano-electronics research center imec and Cadence Design Systems have announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as...

ASML, TSMC reach milestone in EUV productivity

Feb 25, 19:50

ASML has confirmed that Taiwan Semiconductor Manufacturing Company (TSMC) has successfully exposed more than 1000 wafers on an NXE:3300B EUV system in a single day, an important step...

ASML lands EUV tool orders from TSMC

Nov 25, 16:01

Lithography system vendor ASML announced on November 24 that Taiwan Semiconductor Manufacturing Company (TSMC) has ordered two NXE:3350B EUV systems for delivery in 2015 with the...

ASML lands rising EUV equipment orders; looking to expand capacity

Sep 11, 14:07

ASML's new EUV system, the NXE:3300B, has obtained 18 orders. In order to meet customer demand, the lithography tool vendor is looking to boost its production capacity for EUV tool...

ASML to acquire litho light source supplier Cymer

Oct 18, 10:25

ASML and Cymer have entered into a definitive agreement under which ASML will acquire all outstanding shares of Cymer in a cash-and-stock transaction currently valued at EUR1.95 billion...

TSMC says still considering ASML proposal

Jul 20, 01:10

Taiwan Semiconductor Manufacturing Company (TSMC) is still evaluating the proposal from ASML for joint development of new technologies, and no decision has been made yet, according...

TSMC expects to report another record sales for the third quarter of 2012, but sees dips ahead

ASML updates EUV progress

Mar 2, 01:05

ASML has been developing the next generation of its NXE-series EUV lithography machines, the 3300 series, according to Peter Jenkins, VP of marketing at the Dutch fab tool supplier...

Peter Jenkins of ASML

New ASML-IMEC deal demos move to EUV lithography

Oct 11, 10:33

IMEC has announced that it has signed a new agreement with ASML for a period of five years (2011-2015). The pair's continued collaboration guarantees the global semiconductor ecosystem...

ASML NXE:3100 for EUV litho at an IMEC cleanroom

450mm and EUV linked with uncertainty, says SEMI

Sep 9, 11:14

The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...

ASML to ship 10 EUV tools in 2012

May 16, 11:40

ASML has received 10 orders for its next-generation ultraviolet (EUV) lithography system – the NXE:3300 – with deliveries starting in 2012, according to the Dutch fab...

Commentary: Financially-strapped Taiwan DRAM makers have difficulties migrating to sub-20nm processes

Dec 27, 09:39

Taiwan-based DRAM makers will find themselves at a disadvantage to migrate their production to 20nm and below processes, as they struggle to preserve cash for the expenses needed...

Rexchip reportedly orders EUV lithography tool from ASML

Dec 7, 02:25

ASML has recently invited DRAM companies to make early reservations for extreme ultraviolet (EUV) lithography tools to avoid a repeat of early 2010, when immersion scanners saw constrained...

EUV to get ready for high-volume production in 2014, says IMEC chief

Oct 21, 14:04

Extreme ultraviolet (EUV) lithography is likely to reach mass production in 2014 at the earliest, according to Luc Van den hove, president and CEO of Belgian researcher IMEC. But...

IMEC CEO and president Luc Van den hove

TSMC to take delivery of EUV lithography system in 2011, says R&D head

Jun 25, 10:28

Taiwan Semiconductor Manufacturing Company (TSMC) will take delivery of its first extreme ultraviolet (EUV) lithography system from ASML in 2011 paving the way for the company to...

Shang-yi Chiang, head of R&D at TSMC

TSMC to take delivery of ASML EUV lithography system

Feb 22, 10:45

ASML Holding today announced that Taiwan Semiconductor Manufacturing Company (TSMC) will take delivery of a Twinscan NXE:3100 extreme ultra-violet (EUV) lithography system. This tool...

ASML upbeat on micro-lithography growth

Oct 12, 15:47

Customers have turned more active in placing orders, according to Antonio Mesquida Kusters, Director of Market Intelligence for ASML. Citing predictions by research firms, Kusters...

Antonio Mesquida Küsters, Director of Market Intelligence for ASML

UMC focusing R&D on 28nm, 22nm processes

Sep 30, 14:23

United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...

KLA-Tencor extends reticle inspection systems to 2Xnm

Sep 15, 14:04

KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...

KLA-Tencor keeping up R&D spending despite difficult times

Sep 2, 16:49

R&D expenses are estimated to equal 25% of KLA-Tencor's overall sales in 2009, with the expenditure mainly on the development of next-generation products for 3X/2Xnm and beyond...

KLA Tencor CMO Brian Trafas

Cymer ships laser-produced plasma EUV lithography source to ASML

Jul 14, 15:15

Cymer, which specializes in excimer laser illumination sources for deep ultraviolet (DUV) photolithography systems, has kicked off shipments of what it claims is the world's first...

Semiconductor lithography sector continues to outperform rest of market, says The Information Network

Mar 23, 11:40

High-priced equipment enabled the semiconductor lithography sector to grow to 25% of entire front-end equipment processing market in 2008, according to market research firm The Information...

37 items [1/2]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

UMC
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