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News tagged EUV
  • Last update: Wednesday 25 October 2017 [50 news items]

Moore's Law no longer valid, says Morris Chang

Oct 25, 14:25

Moore's Law has become invalid for a while, as the time needed for the transistor density to double is no longer 18-24 months although the density has indeed kept increasing, Morris...

Globalfoundries to adopt EUV for 7nm FinFET

Oct 25, 14:05

Globalfoundries will first use EUV lithography technology in its 7nm FinFET node, and has started to work with AMD in the process development, said company CTO Gary Patton at a recent...

TSMC raises IC market forecasts for 2017

Oct 20, 14:52

Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its forecasts for global foundry and overall IC market outlook for 2017 to a 7% and 16% growth, respectively,...

TSMC 7nm process ready for mass production in 1H18

ASML 3Q17 sales exceed guidance on extra EUV deliveries

Oct 20, 13:29

ASML has announced net sales of EUR 2.45 billion (US$2.89 billion) for the third quarter of 2017, up 16.5% from EUR2.1 billion in the prior quarter. The Dutch fab tool vendor now...

Samsung completes qualification of 8LPP process

Oct 19, 11:21

Samsung Electronics' 8nm FinFET process technology, the 8LPP (Low Power Plus), has been qualified and is ready for production, according to the company.

China to install first EUV equipment as early as 2019, says ASML executive

Oct 2, 10:30

Major China-based IC foundries are already in talks with ASML about the installation of their first extreme ultraviolet (EUV) lithography equipment for the manufacture of 7nm chips,...

country manager of ASML China

DRAM transition to EUV for sub-10nm node remains a financial challenge

Sep 27, 15:59

Major DRAM chipmakers will continue to use multiple patterning exposure techniques for their 1x/1y nodes, but a question mark is still hanging over the prospect of their switch to...

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

SEMICON Taiwan 2017: KLA-Tencor showcasing reticle blank inspection tools

Sep 13, 14:44

At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...

ASML EUV equipment production to almost double in 2018

Sep 13, 14:16

ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.

Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule

Sep 12, 10:47

Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...

ASML opens branch office in Nanjing

Aug 24, 11:51

ASML has announced the opening of a new branch office in Nanjing, China where its major client TSMC is constructing a new 12-inch wafer plant.

ASML opens branch office in Nanjing

Commentary: Can Samsung Foundry unseat TSMC?

Aug 3, 21:20

Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...

TSMC is the leader in the pure-play foundry sector

Marketech to enjoy robust OEM orders, says report

Jul 24, 13:55

Taiwan-based Marketech International is set to enjoy a ramp-up of OEM orders from ASML for a component used in the fab tool vendor's extreme ultraviolet (EUV) lithography equipment...

ASML expects 25% growth in 2017 sales

Jul 20, 16:00

ASML has disclosed that its second-quarter 2017 net sales came to EUR2.10 billion (US$2.42 billion), up from EUR1.94 billion from the previous quarter. The semiconductor equipment...

FD-SOI a promising technology: Q&A with Globalfoundries CEO Sanjay Jha

Jul 19, 10:37

Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...

Globalfoundries CEO

TSMC expanding number of equipment suppliers for 7nm

Jul 18, 22:59

Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...

TSMC 7nm technology ready for volume production in 2018

Brewer Science, Arkema partner to develop high-chi DSA materials for advanced node patterning

Jul 12, 22:35

Brewer Science has announced the extension of its partnership with Arkema to develop second-generation directed self-assembly (DSA) materials using high-x (chi) block copo...

Samsung begins mass production at new fab

Jul 4, 20:36

Samsung Electronics announced its new semiconductor fabrication line in Pyeongtaek (South Korea) has begun mass production and shipping its first product to customers. The new facility...

TSMC secures 7nm chip orders from Qualcomm

Jun 21, 21:36

TSMC has regained chip orders from Qualcomm for baseband chips produced on its 7nm process, but not application processors, according to industry sources.

7nm foundry market to heat up in 2018

Jun 16, 16:03

IC foundries are gearing up for mass production of 7nm chips in 2018, as well as production for 7nm process technology using extreme ultraviolet (EUV), according to market observers...

Packaging can extend physical limits of semiconductors, says TSMC chair

Jun 12, 15:41

Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

TSMC chairman Morris Chang

TSMC set to move 7nm to volume production in 2018

May 25, 22:14

Taiwan Semiconductor Manufacturing Company (TSMC) is set to move its 7nm process technology to volume production in 2018, an improved version of the 7nm process using extreme ultraviolet...

ASML secures pull-in of EUV equipment orders

Apr 20, 13:52

ASML has landed a pull-in of EUV lithography equipment orders with its backlog reaching 21 units, according to the company.

Gudeng seeing robust 12-inch fab equipment orders from China

Mar 20, 21:44

Taiwan-based Gudeng Precision Industrial, a semiconductor front-end equipment manufacturer specializing in mask solution products and wafer handling equipment, has enjoyed a pull-in...

ASML expects to post record sales for 2016

Jul 21, 12:13

Lithography equipment supplier ASML expects to post record sales for 2016. "The ultimate level will depend on the timing of our EUV revenue recognition and the size of the combined...

TSMC expects to launch 5nm node 2 years after 7nm

Jan 18, 10:30

TSMC will be ready to roll out its 5nm process technology two years after the launch of its 7nm node, according to the pure-play foundry.

TSMC chairman Morris Chang is confident that the company will lead the 10nm foundry market segment

Imec and Cadence complete tapeout of first 5nm test chip

Oct 8, 10:08

Nano-electronics research center imec and Cadence Design Systems have announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as...

ASML, TSMC reach milestone in EUV productivity

Feb 25, 19:50

ASML has confirmed that Taiwan Semiconductor Manufacturing Company (TSMC) has successfully exposed more than 1000 wafers on an NXE:3300B EUV system in a single day, an important step...

ASML lands EUV tool orders from TSMC

Nov 25, 16:01

Lithography system vendor ASML announced on November 24 that Taiwan Semiconductor Manufacturing Company (TSMC) has ordered two NXE:3350B EUV systems for delivery in 2015 with the...

ASML lands rising EUV equipment orders; looking to expand capacity

Sep 11, 14:07

ASML's new EUV system, the NXE:3300B, has obtained 18 orders. In order to meet customer demand, the lithography tool vendor is looking to boost its production capacity for EUV tool...

ASML to acquire litho light source supplier Cymer

Oct 18, 10:25

ASML and Cymer have entered into a definitive agreement under which ASML will acquire all outstanding shares of Cymer in a cash-and-stock transaction currently valued at EUR1.95 billion...

TSMC says still considering ASML proposal

Jul 20, 01:10

Taiwan Semiconductor Manufacturing Company (TSMC) is still evaluating the proposal from ASML for joint development of new technologies, and no decision has been made yet, according...

TSMC expects to report another record sales for the third quarter of 2012, but sees dips ahead

ASML updates EUV progress

Mar 2, 01:05

ASML has been developing the next generation of its NXE-series EUV lithography machines, the 3300 series, according to Peter Jenkins, VP of marketing at the Dutch fab tool supplier...

Peter Jenkins of ASML

New ASML-IMEC deal demos move to EUV lithography

Oct 11, 10:33

IMEC has announced that it has signed a new agreement with ASML for a period of five years (2011-2015). The pair's continued collaboration guarantees the global semiconductor ecosystem...

ASML NXE:3100 for EUV litho at an IMEC cleanroom
50 items [1/2]
  • IMEC+EUV+sensor+dies

    IMEC EUV sensor dies

    IMEC has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field,...

    Photo: Company, Oct 13.

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