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Friday 28 June 2024
Hyper-NA EUV to debut in 2030, primes foundry market for transformation
As semiconductor technology advances towards 1-2 nanometer (nm) processes, extreme ultraviolet (EUV) lithography equipment is undergoing generational changes. The next-generation...
Friday 28 June 2024
China-based chipmaking tool provider delays R&D facility operation amid regulatory and operational issues
ACM Research Shanghai, one of the major semiconductor equipment providers in China, decided to postpone the operation of its R&D facility in Shanghai to mid-2025.
Thursday 27 June 2024
China charges ahead in hydrogen race with strong policy support and domestic demand
The Chinese government is once again expanding the scale of its hydrogen energy industry and broadening overseas sales through two main methods: official policy support and substantial...
Thursday 27 June 2024
Equipment makers see demand boom for TSMC CoWoS packaging
With TSMC planning to boost production capacity for CoWoS packaging, related fab toolmakers are confident about orders from the contract chipmaker.
Wednesday 26 June 2024
South Korea kicks off US$ 19 billion of chip loans, funds from July
South Korea will begin awarding aid to chipmakers in July, kicking off a KRW 26 trillion (US$ 19 billion) package of financial support pledged toward boosting a href="https://www.bloomberg.com/news/articles/2024-05-23/south-korea-sets-aside-record-19-billion-to-boost-chip-industry"...
Wednesday 26 June 2024
Poland's CEZAMAT supports the nation's photonics prowess and wider European chip ambitions
One of the largest high-tech R&D investment projects in Poland, the Centre for Advanced Materials and Technology (CEZAMAT) under the Warsaw University of Technology has been a...
Wednesday 26 June 2024
Chinese DRAM maker CXMT to build new fab in Shanghai
Chinese DRAM manufacturer ChangXin Memory Technologies (CXMT) has received government approval to establish a new manufacturing site in Shanghai, according to industry sources.
Monday 24 June 2024
Innolux, OSATs stepping up FOPLP deployment
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Monday 24 June 2024
South Korean manufacturers rumored to consider 'full liquidation' of old equipment
Even since the US imposed sanctions on China, South Korean manufacturers have been storing old equipment in warehouses, incurring annual rental fees exceeding KRW20 billion (approx...
Monday 24 June 2024
South Korean equipment makers set to benefit from BOE's 8.6G OLED plant construction in China
BOE Technology, the largest Chinese display panel manufacturer, is reportedly placing equipment orders for its 8.6-generation (8.6G) OLED panel plant under construction in China....
Thursday 20 June 2024
Fab toolmakers see strong demand for HBM, CoWoS-like from China
IC equipment and materials suppliers have seen a surge in demand from China's semiconductor industry, where companies are rushing to adopt HBM memory and CoWoS-like technology, according...
Wednesday 19 June 2024
US lawmakers look to bar Chips Act winners from using Chinese tools
US lawmakers want to prevent companies that win federal chipmaking funds from using Chinese-made equipment at government-backed factories, part of efforts to limit Beijing's influence...
Tuesday 18 June 2024
FitTech faces challenges, seeks opportunities with TSMC's advanced packaging
The Mini LED demand in the LED industry has shown a lack of new momentum, leading to a halt in expansion plans, and impacting equipment supplier FitTech's operations.
Monday 17 June 2024
Fab tool and equipment suppliers benefit from TSMC 2H24 business boom
TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...
Thursday 13 June 2024
China accounts for half of Japan's chip equipment exports for 3 quarters in a row
China's demand for Japanese semiconductor equipment has been growing rapidly amidst the export sanction imposed by the US on advanced semiconductor equipment and technologies.
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research