In addition to orders from Apple and MediaTek, orders for HPC processors from AMD and Nvidia will be another major driver for TSMC's revenue growth in 2022, according to supply chain...
Backend houses including ASE Technology and Chipbond Technology are poised to enjoy robust orders for processing 5G RF modules, driven by demand for Apple's just-unveiled iPad mini...
Memory module houses are gearing up for the upcoming rollouts of new-generation PC products supporting DDR5 memory, while slowing down their purchases of DDR4 chips, according to...
Intel, facing AMD's fierce competition in the server market, is offering more competitive pricing for its server CPUs, with many cloud computing datacenter operators who have begun...
Arm is partnering with Taiwan's Industrial Technology Research Institute (ITRI) to develop an ecosystem platform available for international IC design startups looking to invest in...
Taiwan's vendors of transmission interface chip solutions are stepping up the development and production of high-speed solutions such as Wi-Fi 6E, PCIe4.0/5.0 controller chips and...
As AMD and Nvidia are warming up for rolling out new-generation CPU and GPU processors in first-half 2022, Taiwan-based IC test solutions providers including Chunghwa Precision Test...
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
The total microprocessor (MPU) market is on track to exceed US$100 billion for the first time ever this year, thanks to strong increases in cellphone application processor revenue,...
ABF substrate makers have seen more of their customers eager to strike long-term agreements to ensure sufficient supplies through 2025 and even beyond, as tight supply is expected...
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
