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News tagged COF
  • Last update: Thursday 14 May 2015 [28 news items]

JMC to expand production capacity for COF tape

May 14, 22:17

JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE) specializing in the manufacture of chip-on-film (COF) substrates, will launch a new COF tape production line in the...

JMC Electronics to apply for TSE listing

Dec 11, 21:18

JMC Electronics plans to apply for listing on the Taiwan Stock Exchange (TSE) in 2016, with an initial public offering (IPO) set to be introduced in 2015.

COF tape supply likely to fall short

Nov 28, 14:51

As the number of suppliers decreases, global supply of chip-on-film (COF) tapes has shrunk significantly, according to industry sources. Supply may fall short in 2015, as demand for...

COF tape supply likely to fall short of demand in 2015

Chipbond facing increasing competition from rivals in Korea

Dec 18, 14:00

Korea-based Nepes and LB Semcon, providers of LCD driver IC packaging and testing services, have recently cut their quotes by nearly 30% putting Chipbond Technology under pressure,...


Chipbond to buy COF substrate supplier

May 2, 22:28

Chipbond Technology has said it will acquire Simpal Electronics, a Taiwan-based COF substrate supplier, through a share swap.

Firms to phase out COF substrate business

Dec 26, 09:42

With LCD panel demand for large-size applications such as TVs remaining dull, Mitsui Kinzoku and Sumitomo Electronics Taiwan (SET) are looking to withdraw from the standard chip-on-film...

Ultrabook demand to trigger birth of thinner CCMs in 2012

Dec 13, 01:40

The thickness of compact camera modules (CCM), to satisfy demand of ultrabooks have a thickness of only 0.7- to 0.8-inch, is expected to shrink down from a standard size of 3-4mm...

Smartphone component makers penetrate ultrabook supply chain

Nov 22, 01:45

Smartphone component makers including Primax Electronics and Merry Electronics have recently cut into ultrabook supply chain as ultrabook's requirement of featuring 0.7-0.8-inch thickness...

Packaging material supplier Chang Wah expects flat growth for 4Q10

Oct 14, 14:02

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects flat revenue growth sequentially in the fourth quarter...

Chipbond posts strong 2Q10 results; gives cautious outlook

Aug 9, 16:12

Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, reflecting strong market demand for LCD...

Chipbond chairman Fei-Jain Wu

Driver IC packager Chipbond at almost full capacity on strong demand ahead of holiday season

Jun 23, 11:00

Chipbond Technology has revealed it is currently running at near full capacity for COF (chip-on-film) and COG (chip-on-glass), and utilization for bumping has risen to 85-90%. Customers...

Chipbond sees profits in 1Q10

Apr 23, 15:37

LCD driver IC packaging house Chipbond Technology has announced net profits of NT$398 million (US$13 million) or NT$1.20 per share, for the first quarter of 2010, compared with losses...

Packaging material supplier Chang Wah to hand out NT$6 cash dividends for 2009

Apr 16, 16:19

Packaging material and equipment supplier Chang Wah Electromaterials (CWE) has decided to deal out dividends of NT$6 in cash for 2009, based on the pre-tax profits of NT$564 million...

Chipbond completes merger with peer IST

Stockwatch - Apr 1, 15:21

LCD driver IC packaging house Chipbond Technology announced on April 1 the completion of its merger with International Semiconductor Technology (IST), with Chipbond being the surviving...

Chipbond sees January 2010 sales up 24% on month

Feb 11, 16:26

Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...

Chipbond-IST merger set to complete in June 2010

Stockwatch - Dec 28, 16:34

LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...

Chipbond eyes outsourcing COF substrate orders from Mitsui subsidiary

Dec 2, 14:36

Chipbond Technology has disclosed it is negotiating an outsourcing deal with MCS, a subsidiary of Japan-based Mitsui Kinzoku. Both parties have been evaluating the possibility of...

Chipbond affiliate in China suspends expansion plan pending rule changes

Nov 16, 14:16

Chipbond Technology's China-based affiliate Chipmore Technology has suspended plans to expand capacity for gold bumping, pending possible changes to Taiwan government policies concerning...

Driver IC backend suppliers upbeat about 3Q09

Sep 2, 14:29

Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...

Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu

Jun 30, 17:03

Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...

Chipbond chairman Fei-Jain Wu

Japan IDMs outsourcing IC backend production to Chipbond

Jun 22, 12:26

Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip...


Niching Industrial begins to deliver COF tape emboss spacers

Jun 18, 16:54

Taiwan-based semiconductor material supplier Niching Industrial has begun small volume shipments of emboss spacers for chip on film (COF) tape winding. Japan-based Actech is currently...

niching general manager

Driver IC testing, COF prices raised by 10-30%

Jun 12, 16:38

IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...


Driver IC backend suppliers May sales up on improved utilization

Newswatch - Jun 9, 16:41

Taiwan-based LCD driver IC backend service providers Chipbond Technology and International Semiconductor Technology (IST) both enjoyed double-digit sequential growths in revenues...

Chipbond production line

LCD driver IC backend capacity tight on material shortage

May 18, 15:00

LCD driver IC makers are being hit by tight packaging capacity at back-end service suppliers due to a shortage of chip on film (COF) tapes, according to industry sources.


Taiwan COF substrate makers see orders and utilization up

Apr 15, 11:58

Taiwan-based chip-on-film (COF) substrate makers have seen increased orders from Japan-based driver IC designers, including Renesas Technology and NEC, thanks to the appreciation...

IST sees low utilization; reports losses for August

Oct 1, 01:10

Packaging and testing house International Semiconductor Technology (IST) has seen its utilization rate drop significantly because of weak demand from driver IC clients. The company...

Chipbond sees its 2Q profit shrink; cautious over LCD driver IC backend demand in 3Q

Aug 14, 15:10

After seeing its profit decline by eight percentage points sequentially in the second quarter, Chipbond Technology is cautious about its third quarter performance. As utilization...

Realtime news
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