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NEWS TAGGED CIS
Tuesday 14 January 2020
OmniVision set to raise quotes for diverse CIS devices by 10-40%
OmniVision Technologies will raise its quotes for various CMOS image sensors (CIS) by 10-40% in 2020 to counter ever-expanding demand for application to handsets, notebooks, smart...
Wednesday 8 January 2020
SK Hynix unveils PCIe NVMe SSDs
At the ongoing CES, SK Hynix has unveiled its PCIe NVMe consumer SSD series. The drives are built with SK Hynix' 128-layer 4D NAND flash, just six months after the company announced...
Wednesday 8 January 2020
OmniVision to raise CIS prices to reflect tight supply
OmniVision will revise upward by as much as 20% its quotes for high-resolution CMOS image sensors for use in consumer devices due to tight supply, according to industry sources.
Friday 3 January 2020
KYEC starting 2020 with robust test orders for 5G, AI, CIS chips
Taiwan-based testing house King Yuan Electronics (KYEC) is expected to see its first-quarter 2020 revenues hit the highest record ever for the same quarter with monthly revenues to...
Monday 30 December 2019
Highlights of the day: Taiwan CIS packagers to merge into heavyweight player
Two major Taiwan-based CMOS image sensor packagers Tong Hsing and Kingpark have agreed a merger deal that will make turn them into one of the world's largest packaging firms for the...
Monday 30 December 2019
Tong Hsing, Kingpak to merge into heavyweight CIS packager in Taiwan
A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...
Thursday 26 December 2019
Xintec profit soars in November
Niche-market IC packaging house Xintec has disclosed its net profit surged 252% from a year ago to NT$74 million (US$2.46 million) in November 2019. EPS for the month came to NT$0....
Tuesday 24 December 2019
ASE, VisEra to enjoy robust demand for in-display fingerprint sensors
ASE Technology and VisEra Technologies are both being pinpointed as among the backend houses set to enjoy robust demand for optical in-display fingerprint sensors, according to industry...
Thursday 12 December 2019
Highlights of the day: UMC enters Sony CIS supply chain
UMC's acquisition of Mie Fujitsu Semiconductor apparently has fulfilled two of its major strategic purposes: to expand its presence in the Japanese maket and the niche market. Through...
Thursday 12 December 2019
Backend firms to gain from robust high-spec auto CIS demand
Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...
Thursday 12 December 2019
UMC enters supply chain for Sony CIS
United Microelectronics (UMC), through its takeover of Mie Fujitsu Semiconductor (MIFS), has entered the supply chain for Sony's CMOS image sensors, according to industry sources.
Tuesday 10 December 2019
Backend partners to gain from Sony CIS capacity expansion in 2020
Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...
Tuesday 10 December 2019
TSMC obtains Sony orders for CIS, says report
TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent...
Tuesday 3 December 2019
Handset vendors keen on camera upgrades
Handset vendors are demanding significant upgrades to camera lenses, screens, image resolutions and APs seeking to stand out in an increasingly competitive market.
Friday 15 November 2019
Tong Hsing sees CIS packaging as major growth driver for 2020
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...