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News tagged Cadence
  • Last update: Thursday 18 December 2014 [16 news items]

Globalfoundries and Cadence deliver first SoC enablement solution featuring ARM Cortex-A17 processor in 28nm-SLP process

Dec 18, 21:58

Cadence Design Systems and Globalfoundries have jointly announced the delivery of quad-core silicon built around the ARM Cortex-A17 processor implemented using Globlfoundries' 28nm...

HiSilicon expands adoption of Cadence tools and IP for advanced-node FinFET designs

Dec 2, 14:38

Cadence Design Systems announced on December 1 that HiSilicon Technologies has signed an agreement to significantly expand its use of the Cadence digital and custom/analog flows for...

VIA licenses Cadence Tensilica HiFi audio/voice DSP

Oct 23, 11:08

Cadence Design Systems has announced that VIA Technologies has selected the Cadence Tensilica HiFi audio/voice digital signal processor for a system-on-chip design for set-top boxes,...

ARM buys mobile display IC cores from Cadence

Sep 4, 15:02

Processor IP licensor ARM and Cadence Design Systems, an EDA tool company, have signed an agreement for the sale and transfer of Cadence PANTA display controller cores to ARM, according...

Blue-collar processing: Q&A with Tensilica founder Chris Rowen

Jun 28, 16:12

Based in Santa Clara, Tensilica has been around the semiconductor industry for around 15 years, providing customers with what it calls configurable dataplane processors (DPUs). The...

Chris Rowen, chief technology officer and founder of Tensilica<br>

20nm process to take off in 2013, says Cadence executive

Apr 19, 15:15

The semiconductor industry will accelerate towards the adoption of 28nm process in 2012, and begin its transition to the next technology node in 2013, according to Chi-Ping Hsu, a...

Globalfoundries tapes out 20nm test chip

Aug 30, 16:40

Globalfoundries has announced that it successfully taped out a 20nm test chip using flows from EDA partners Cadence Design Systems, Magma Design Automation, Mentor Graphics and Synopsys...

Samsung Foundry tapes out 20nm

Jul 13, 01:00

Samsung Electronics has announced that its foundry business, Samsung Foundry, successfully taped-out a test chip based on its 20nm process with high-k metal gate (HKMG) technology...

TSMC delivers interoperable EDA formats for advanced process technologies

Apr 8, 10:40

Taiwan Semiconductor Manufacturing Company (TSMC) has made available several unified and interoperable electronic design automation (EDA) technology files for its 65nm, 40nm and 28nm...

EDA providers reshuffle management in Asia Pacific

Newswatch - Jul 13, 14:48

Another electronic design automation (EDA) provider is reshuffling its Asia-Pacific operations, following recent regional head changes at Cadence Design Systems and Synopsys, according...

Global Unichip to have former Cadence Asia Pacific president head China operations

Jun 30, 12:07

Taiwan-based IC design service provider Global Unichip has decided to appoint Lung Chu, the former Asia Pacific president for EDS company Cadence Design Systems, as its China president...

chu

Global Unichip beefing up presence in China, Japan and South Korea

Jun 4, 12:18

Taiwan IC design service provider Global Unichip will strengthen its deployments in China, South Korea, Japan, Europe and Israel in 2009, according to company CEO KC Shih. Market...

Lung Chu

SiS joins power forward initiative to assist in delivering power-efficient computing platforms

Mar 13, 13:58

Silicon Integrated System (SiS) has announced its joining of the Power Forward Initiative (PFI) and plans to offer common power format (CPF) design solutions for its chipset, motherboard,...

China IC design industry should strengthen R&D amid economic downturn, says Cadence executive

Jan 12, 15:59

China's IC design houses should strengthen their R&D in order to gain competitiveness within their home market against foreign rivals, when developed markets such as Europe and...

Cadence Asia president Lung Chu

MEMS to bring in NT$50 billion, says president of Cadence Asia Lung Chu

Dec 24, 15:59

MEMS is expected to bring in sales worth NT$50 billion (US$1.5 billion) as long as MEMS components can be produced on a large scale, according to Lung Chu, president of Asia Pacific...

Commentary: Low price strategy limits growth potential of players in China's IC design industry, says president of Cadence Asia

Jul 16, 11:25

Facing emerging competitors from China, IC design companies in Taiwan constantly enhance their products and operation to keep the advantageous position in the IC design field, according...

Lung Chu, the president of Asia Pacific Field Operations, Corporate Vice President in Cadence.
2015 global notebook demand forecast
The transition to 4k TV - UHD TV market forecast, 2014-2017

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TD-LTE market developments and forecast, 2014-2016
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