News tagged bumping
Last update: Thursday 17 September 2015 [35 news items]
PTI to acquire Nepes in Singapore
May 2, 10:44
Powertec Technology (PTI) announced on April 29 that it has entered into a share purchase agreement with Nepes to acquire Nepes Pte Ltd (NPL) in Singapore.
TSMC builds up bumping capacity
Dec 12, 14:30
Taiwan Semiconductor Manufacturing Company (TSMC) has built up its bumping capacity to 150,000 12-inch wafers a month with total shipments amounting to over five million units, according...
PTI developing advanced packaging technologies
Jul 1, 01:10
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
Shortage of iPad 2 bumping up gray import prices
Mar 14, 16:38
Prices for Apple's iPad 2 in Korea or Hong Kong, where the device has not yet been launched, are being marked at about US$700-1,000, close to double Apple's original price, as Apple...
ChipMOS to expand into 12-inch gold bumping
Oct 5, 14:14
Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...
UAT tripling wafer bumping capacity
Jul 13, 11:52
Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity to be three times its current level,...
Chipbond sees January 2010 sales up 24% on month
Feb 11, 16:26
Chipbond Technology has announced revenues for January 2010 grew 23.61% sequentially to NT$608 million (US$18.93 million). The LCD driver IC packaging and testing house projected...
Chipbond August 2009 revenues hit high
Newswatch - Sep 8, 14:39
Driver IC packaging and testing firm Chipbond Technology saw its monthly revenues hit a record of NT$640 million (US$19.5 million) in August, representing a 52.5% increase from NT$420...
Driver IC backend suppliers upbeat about 3Q09
Sep 2, 14:29
Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...
Stable solder prices help increase Shenmao margin
Feb 10, 17:14
Solder prices have stayed around US$11,000 per ton for 3-4 months, helping increase electronic material supplier Shenmao Technology's gross margin. Shenmao expects to see better performance...
Shenmao profits jump on lower raw material costs
Aug 19, 16:15
After dealing with rising raw material costs and exchange loss in the first quarter, Shenmao Technology, the number-one bumping solder paste supplier in Taiwan, had 272% sequential...
Shenmao bumping paste prices up since March
May 28, 12:31
Shenmao Technology, a solder bumping paste supplier, started raising its average selling prices (ASPs) since March to reflect higher metal costs. The company has also decided not...