Last update: Thursday 16 May 2013 [283 news items]
IC backend service firms to ramp up investments in 2012
Sep 5, 01:30
Most Taiwan-based IC packaging and testing firms including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL) and Powertech Technology (PTI) all plan to...
Taiwan IC backend firms look to expand in Korea
Sep 4, 01:00
Recent moves by Advanced Semiconductor Engineering (ASE) and Ardentec suggest that Taiwan-based IC packaging and testing houses are looking to expand their presence in South Korea,...
Taiwan copper wirebonding production value to rise
Sep 3, 12:11
The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.
Backend firms expect orders for 28nm chips to pick up
Aug 29, 16:10
Taiwan Semiconductor Manufacturing Company (TSMC) is producing 28nm process ICs for Qualcomm and the first batch of shipments will be delivered to packaging and testing houses in...
Aug 29, 11:52
IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) expects its sales to grow quarter-on-quarter onward in the second half of 2012, and total shipments...
Japan IDMs to increase outsourcing of logic IC backend processing
Aug 17, 11:35
Major Japan-based IDM companies including Renesas, Sony and Toshiba are set to increase outsourcing of backend processing for logic ICs, and have approached existing and potential...
ASE, SPIL see small growth in July revenues
Aug 8, 01:00
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), two Taiwan-based providers of IC packaging and testing service, saw consolidated revenues of...
Major IC packagers step up 2012 capex
Aug 6, 15:41
Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...
ASE, SPIL make progress in transition to copper wire bonding
Jul 31, 16:12
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...
ASE, SPIL expect 3Q12 sales to rise
Jul 30, 14:27
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both expect their third-quarter sales to register another sequential growth buoyed by rising demand...

Jul 27, 15:47
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their second-quarter net profits rise over 50% sequentially along with higher...
ASE, SPIL post sales drops in June
Jul 10, 01:05
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported decreases in June consolidated revenues from the previous month of 1.7% and 5.9%,...
Most backend firms give positive 3Q12 outlook
Jul 4, 01:25
With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.
ASE to expand operations in Korea
Jun 25, 14:54
In view of the growing semiconductor industry in Korea, Advanced Semiconductor Engineering (ASE) is looking to expand its local factory site located in Paju, Gyeonggi Province, with...
Jun 22, 01:30
Upcoming rollouts of new handsets, tablets and ultrabooks will help boost overall shipments of semiconductors in the second half of 2012, according to Tien Wu, COO for Advanced Semiconductor...

ASE, SPIL gearing up for capacity expansion
Jun 21, 14:45
IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both reiterated their commitment to expand capacity in 2012...
Major Taiwan IC backend firms to post over 5% sales growth in 2Q12
Jun 11, 12:27
Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...
ASE-USI deal probed for possible insider trading
Jun 11, 11:39
The Taipei Prosecutors' Office on June 8 began a probe into insider trading suspicions involving Advanced Semiconductor Manufacturing's (ASE) takeover of Universal Scientific Indus...
ASE, SPIL post sales growth in May
Jun 7, 16:09
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their May revenues register single-digit growth.
IC packagers reiterate sales guidance for 2Q12, says report
Newswatch - Jun 4, 15:06
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reiterated their previous guidances for the second quarter of 2012, according to a Chinese-language...
ASE opens new manufacturing facility in China
May 31, 15:09
Packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced the opening of its Phase 3 manufacturing facility in Weihai, Shangdong province, China. The new building...
ASE, SPIL post slight drops in April sales
May 8, 01:10
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported slight decreases in consolidated revenues for April 2012. ASE announced consolidated...
ASE to issue overseas convertible bonds worth NT$9 billion
May 4, 14:02
Taiwan's Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has announced plans to issue overseas convertible bonds worth up to NT$9...
ASE to hike 2012 capex to US$800 million
Apr 30, 10:29
Packaging and testing house Advanced Semiconductor Engineering (ASE) will expand 2012 capital expenditure (capex) from US$700-750 million originally to US$800 million mainly due to...

ASE 2Q12 shipments likely to grow 15%
Apr 20, 01:30
IC packager Advanced Semiconductor Engineering (ASE) is expected to post shipment growth of 15% sequentially in the second quarter of 2012 as clients step up their pace of orders...

Apr 10, 13:47
Consolidated revenues at Advanced Semiconductor Engineering (ASE) registered declines of 7.1% sequentially and 6.3% on year in the first quarter of 2012. Sales of its core IC assembly...
ASE, SPIL report slight decreases in 2011 revenues
Apr 3, 01:40
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...
ASE, SPIL remain conservative on business outlook
Mar 20, 14:41
While the recent news that Taiwan Semiconductor Manufacturing Company (TSMC) is mulling an upward revision in 2012 capex has boosted market observers' confidence in the outlook for...
ASE February sales up, SPIL down
Mar 9, 11:01
Advanced Semiconductor Engineering (ASE) saw sales of its core IC ATM (assembly test and material) business grow 3.9% on month to NT$9.49 billion (US$320 million) in February 2012...
March shipments of 4G mobile phones to reach over 1 million
Mar 1, 01:30
Mobile phone makers Samsung and HTC both target 4G phone shipments in March to exceed one million units. Shipments in second-quarter 2012 are likely to reach 5-10 million units. Suppliers...
ASE expects sales rebound in 2Q12
Feb 13, 10:46
Advanced Semiconductor Engineering (ASE) has estimated that its core IC assembly test and material (ATM) business will post another sequential decrease of 6-9% in shipments in the...

ASE, SPIL post sales drops in January
Feb 9, 01:40
IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...
ChipMOS looks to higher capex in 2012
Jan 10, 15:32
ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.
ASE, SPIL, PTI, Sigurd see decrease in December revenues
Jan 10, 01:05
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging...
ASE, SPIL post slight drops in 4Q11 sales
Jan 9, 16:42
Advanced Semiconductor Engineering (ASE) has announced that revenues of its core IC assembly test and material (ATM) business slid 2.1% sequentially in the fourth quarter of 2011,...
- AUO aims at 20% market share for eTP touch panels for notebooks in 2013
- Digitimes Research: US new solar installations may only reach 3.5GW in 2013
- Solar cell prices may increase to US$0.43/W in Taiwan
- Sony Mobile to extend cooperation with ODM firms, says marketing executive
- Senao expanding retail chain in eastern China
- UDE likely to obtain orders from 2 game console vendors
- Lenovo 1Q13 net profit hikes 90% on year
- Phison warns several backend firms of possible patent infringement
- Facebook sets up OCP Taiwan
- Computex 2013: Memory module firms to showcase new SSDs
- Asia to be largest LTE market, says Nokia Siemens Networks greater China head
- ABB to produce PV inverters in South Africa
- TPV Technology suffers 1Q13 net loss of over US$10 million
- Digitimes Research: Seoul Semiconductor may see 2013 revenues up 40.3% on year
- Taiwan April manufacturing production index down, says MOEA
- Polarizer makers under price-cut pressure from clients
- AUO to supply panels for use in 2nd-gen Nexus 7, say sources
- US fab-tool book-to-bill stays above parity, says SEMI
- Intel, MediaTek and Elan taking up 60% of global touchscreen controller market
- HannStar to reach 95% utilization in 2Q13
- Windows 8 expected to take up 5-8% of global tablet shipments in 2013, say Taiwan makers
- Digitimes Research: Global LED tube light shipments to reach 220 million units in 2013
- Nvidia introduces GeForce GTX 780 GPU for gaming
- Quartz component maker TXC expects sales to rise through 4Q13
- Global LCD monitor OEM shipments down 14% on year in 1Q13, says TPV
- Releases
- White papers
- Bulletin
- GIGABYTE Launches the BRIX Ultra Compact PC Kit
- AEWIN Introduces Newest Multiplayer Gaming System SGA-5010
- Carry Technology Highlights Thunderbolt and Wi-Fi Card Reader Series
- Imagination says third party IP becoming a key driving force for silicon vendors
- EverFocus launches ECOR960 X1 16CH with better image quality and more affordable price
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
24-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8209.78 | -28.05 | -0.34% |

| TSE electronic | 310.89 | -0.43 | -0.14% |

| GTSM (OTC) | 118.64 | -0.71 | -0.59% |

| OTC electronic | 143.77 | -0.29 | -0.2% |

- Infineon ships security chips to Taiwan electronic passport program (May 23) - Company release
- Apple 'among largest tax avoiders in US' - Senate committee (May 21) - BBC News
- Weak eurozone growth hits euro (May 15) - The Financial Times
- German factory orders rise for second month (May 7) - Bloomberg
- Eurozone retail sales fall for second consecutive month (May 6) - BBC News
- China economy to stay commodity-oriented, says JPMorgan (April 16) - Bloomberg
- S Korea in US$15.3 billion stimulus bid to spur economic growth (April 16) - BBC News
- Gold hit by sharpest tumble in 30 years (April 16) - CNN

Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...

Returning with stronger competitiveness: Q&A with Lu Li-Cheng, Chaintech chairman
Chaintech, a motherboard/graphics card maker, which quit the market once and returned recently, has...

MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...

Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- 2H 2012 global TFT panel market forecast
Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.
- Trends and shipment forecast for 2H 2012 smartphone market
Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.


















