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News tagged ASE
  • Last update: Thursday 7 August 2014 [341 news items]

ASE, SPIL sales fall back in November

Dec 9, 15:32

Advanced Semiconductor Engineering's (ASE) sales of its core IC ATM (assembly test and material) business registered a 5.8% sequential decrease in November, while sales at fellow...

ASE, SPIL developing low-cost IC substrates

Dec 2, 10:35

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both developed low-cost IC substrates to satisfy demand from mobile chip suppliers, which...

ase

SiP market has room to expand, says ASE

Nov 15, 14:03

SiP (system-in-package) currently accounts for 5-10% of the overall production value of the IC packaging sector, according to Tien Wu, COO for Advanced Semiconductor Engineering (ASE)...

ASE posts record consolidated revenues for October 2013

Nov 8, 16:03

Consolidated revenues at Advanced Semiconductor Engineering (ASE) climbed to an all-time high of NT$20.76 billion (US$707 million) in October 2013, representing growth of 17.7% on...

ASE, Infineon team up for assembly of auto products

Nov 7, 15:42

Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...

ASE looks to 6-8% sequential revenue growth in 4Q13

Oct 30, 22:13

IC backend service company Advanced Semiconductor Engineering (ASE) expects its revenues to grow 6-8% sequentially in the fourth quarter of 2013, but will also see its gross margin...

ASE reportedly to buy Panasonic IC backend plants

Newswatch - Oct 28, 21:24

Taiwan-based Advanced Semiconductor Engineering's (ASE) is likely to take over Panasonic's IC backend sites overseas, according to a recent Chinese-language Commercial Times...

ASE September sales rise, SPIL flat

Oct 9, 16:04

Advanced Semiconductor Engineering (ASE) saw September sales of its core IC ATM (assembly test and material) business grow 4.1% on month, while fellow firm Siliconware Precision Industries...

ASE IC backend unit to post sales drop in 4Q13

Oct 3, 10:40

Sales of Advanced Semiconductor Engineering's (ASE) core IC ATM (assembly test and material) business is likely to post a sequential decrease in the fourth quarter of 2013, due to...

Equipment suppliers expected to benefit from ASE, SPIL investment

Sep 13, 14:20

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will add investment to meet increasing orders in the second half of 2013, and this will bring...

ASE August sales up 7%

Sep 10, 11:21

IC packager Advanced Semiconductor Engineering (ASE) has announced August consolidated revenues of NT$18.83 billion (US$635.2 million), increasing 7.4% sequentially and hitting the...

ASE expands into MEMS market

Sep 6, 10:29

Packaging and testing firm Advanced Semiconductor Engineering (ASE) has expanded into the MEMS field, providing backend services for MEMS pressure sensors and microphones, according...

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

Chip carrier packaging grows on widespread adoption of QFN package, says IC Insights

Sep 4, 12:32

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking...

ASE to land growing backend orders for Apple devices, says report

Newswatch - Aug 29, 15:56

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...

ASE, SPIL August sales to rise

Aug 22, 20:45

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to report 3-5% sequential increases in August revenues, thanks to brisk...

ASE, SPIL July sales up

Aug 8, 16:12

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported increases in July consolidated revenues from the previous month of...

ASE 2Q13 IC ATM revenues up 15.9% sequentially

Jul 29, 10:41

Advanced Semiconductor Engineering (ASE), the largest Taiwan-based provider of IC packaging and testing services, saw IC ATM (assembly, testing and materials) revenues of NT$36.295...

ASE to raise additional capital through issuing new shares, bonds

Jul 16, 13:45

Taiwan-based Advanced Semiconductor Engineering (ASE) has announced plans to issue new shares and unsecured corporate bonds overseas. Proceeds from the share and bond issues will...

ASE IC backend biz posts record revenues in 2Q13

Jul 8, 22:04

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business reported net sales of NT$36.3 billion (US$1.22 billion) for the second quarter of...

ASE, SPIL 3Q13 sales to be affected by slower sales of Galaxy S4

Jul 3, 21:59

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see their sales for the third quarter of 2013 affected by reduced orders from...

ASE lands pull-in of copper wirebonding orders

Jun 27, 14:40

IC backend service company Advanced Semiconductor Engineering (ASE) has seen its Europe- and US-based fabless clients adopting copper wire to package their products since the beginning...

ASE IC backend unit posts record revenues in May

Jun 10, 22:35

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...

ASE to buy Toshiba backend plant in China

May 16, 11:34

IC packager Advanced Semiconductor Engineering (ASE) announced on May 15 that the company has reached a deal with Toshiba Semiconductor (Wuxi) in China to acquire its chip assembly...

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

ASE expects 11-14% growth in 2Q13 shipments

Apr 29, 10:32

IC packaging and testing house Advanced Semiconductor Engineering (ASE) expects shipments to increase 11-14% sequentially and gross margin to rise to 23.2% in second-quarter 2013,...

ASE, SPIL 2Q13 sales outlook optimistic

Apr 18, 22:10

Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...

Backend to outperform IC sector, says ASE chair

Apr 15, 23:37

The packaging and testing sector is set to outperform the overall industry in 2013, said Jason Chang, chairman for Advanced Semiconductor Engineering (ASE), during a recent company...

ASE breaks ground for new factory buildings in southern Taiwan

Apr 12, 11:55

Semiconductor assembly and testing company Advanced Semiconductor Engineering (ASE) on April 12 held a groundbreaking ceremony for two new factory buildings, one designated for production...

ASE, SPIL March sales rebound

Apr 9, 15:35

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...

ASE to issue NT$15 billion convertible bonds

Stockwatch - Apr 9, 12:23

Taiwan-based Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has unveiled plans to issue overseas convertible bonds worth up to...

ASE, SPIL to see sales rebound in March

Mar 8, 15:04

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both have reported decreased sales for February, but their sales are expected to gain momentum...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Digitimes Research: Taiwan IC backend production value to outperform global industry

Feb 26, 15:42

Production value of Taiwan's dedicated semiconductor packaging and testing industry is forecast to grow 4.9% to US$13.88 billion in 2013, while the global industry will generate a...

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Equipment maker GPTC posts significant revenue and profit growth in January

Feb 26, 14:51

Buoyed by its recent acquisition of a chemical material supplier, as well as brisk demand from IC foundries, Grand Plastic Technology (GPTC) has reported significant on-year growth...

341 items [2/10]
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    Before Going to Press | Sep 2, 20:43

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    Before Going to Press | Sep 2, 19:51

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    Before Going to Press | Sep 2, 19:50

  • Tencent invests in DXY

    Before Going to Press | Sep 2, 19:46

  • Digitimes Research: Samsung lowers US 7-inch tablet prices

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  • LDK Solar sees continued losses in 1H14

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