Last update: Tuesday 8 May 2012 [227 news items]
ASE, SPIL post slight drops in April sales
May 8, 01:10
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported slight decreases in consolidated revenues for April 2012. ASE announced consolidated...
ASE to issue overseas convertible bonds worth NT$9 billion
May 4, 14:02
Taiwan's Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has announced plans to issue overseas convertible bonds worth up to NT$9...
ASE to hike 2012 capex to US$800 million
Apr 30, 10:29
Packaging and testing house Advanced Semiconductor Engineering (ASE) will expand 2012 capital expenditure (capex) from US$700-750 million originally to US$800 million mainly due to...
ASE 2Q12 shipments likely to grow 15%
Apr 20, 01:30
IC packager Advanced Semiconductor Engineering (ASE) is expected to post shipment growth of 15% sequentially in the second quarter of 2012 as clients step up their pace of orders...
Apr 10, 13:47
Consolidated revenues at Advanced Semiconductor Engineering (ASE) registered declines of 7.1% sequentially and 6.3% on year in the first quarter of 2012. Sales of its core IC assembly...
ASE, SPIL report slight decreases in 2011 revenues
Apr 3, 01:40
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) reported 2011 consolidated revenues that represented an on-year decrease of 1.8%...
ASE, SPIL remain conservative on business outlook
Mar 20, 14:41
While the recent news that Taiwan Semiconductor Manufacturing Company (TSMC) is mulling an upward revision in 2012 capex has boosted market observers' confidence in the outlook for...
ASE February sales up, SPIL down
Mar 9, 11:01
Advanced Semiconductor Engineering (ASE) saw sales of its core IC ATM (assembly test and material) business grow 3.9% on month to NT$9.49 billion (US$320 million) in February 2012...
March shipments of 4G mobile phones to reach over 1 million
Mar 1, 01:30
Mobile phone makers Samsung and HTC both target 4G phone shipments in March to exceed one million units. Shipments in second-quarter 2012 are likely to reach 5-10 million units. Suppliers...
ASE expects sales rebound in 2Q12
Feb 13, 10:46
Advanced Semiconductor Engineering (ASE) has estimated that its core IC assembly test and material (ATM) business will post another sequential decrease of 6-9% in shipments in the...
ASE, SPIL post sales drops in January
Feb 9, 01:40
IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...
ChipMOS looks to higher capex in 2012
Jan 10, 15:32
ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.
ASE, SPIL, PTI, Sigurd see decrease in December revenues
Jan 10, 01:05
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging...
ASE, SPIL post slight drops in 4Q11 sales
Jan 9, 16:42
Advanced Semiconductor Engineering (ASE) has announced that revenues of its core IC assembly test and material (ATM) business slid 2.1% sequentially in the fourth quarter of 2011,...
Backend firms gearing up for new MediaTek solution
Dec 23, 01:05
IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and substrate makers Unimicron Technology and Kinsus Interconnect Technology are...
Sanyo to sell subsidiary factory in central Taiwan to ASE
Dec 20, 01:00
Sanyo Electronic (Taichung), a subsidiary of Japan-based Sanyo Electric, plans to sell its IC packaging/testing factory located in central Taiwan to the Taiwan-based Advanced Semiconductor...
PowerASE Technology to delist from stock market
Dec 13, 01:05
PowerASE Technology, a Taiwan-based provider of IC packaging/testing services belonging to the Advanced Semiconductor Engineering (ASE) Group, will withdraw its listing on the Emerging...
ASE revenues down 5% in November
Dec 7, 16:44
Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 billion (US$356 million) in November 2011, down...
TSMC gearing up for via-first TSV
Dec 5, 15:38
While major IC packagers have already devoted resources on TSV (via-last) development, Taiwan Semiconductor Manufacturing Company (TSMC) is also eyeing the market with its front-end...
Copper pillar bump penetration of FC packaging to rise
Nov 29, 12:25
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
AKM to outsource more backend processing, says president
Nov 24, 15:52
Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...
ASE to acquire 100% stake in Power ASE
Stockwatch - Nov 11, 11:54
IC packager Advanced Semiconductor Engineering (ASE) has announced plans to acquire up to 107 million shares of Power ASE Technology, a joint venture with memory chipmaker Powerchip...
October revenues up slightly for IC packaging firms
Nov 8, 01:00
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging/testing...
ASE to see lower 4Q11 shipments, flat margin
Oct 31, 10:11
IC packager Advanced Semiconductor Engineering (ASE) has forecast shipments for the fourth quarter of 2011 will decrease 3-4% sequentially, due to weak demand from Europe- and Japan-based...
Integration a must for packaging and testing industry, says ASE chairman
Oct 24, 15:04
If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...
ASE opens new plant in Taiwan, outlines effort to expand operations
Oct 24, 11:27
IC packaging and testing firm Advanced Semiconductor Engineering (ASE) on October 23 opened a new plant, named K12, in Kaohsiung, southern Taiwan. During a ceremony marking the opening...
Packaging and testing firms see flat growth in 4Q11
Oct 21, 01:05
The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues to feel the effects of the economic downturn,...
ASE seeking US$200 million syndicated loan, says paper
Newswatch - Oct 17, 15:53
Advanced Semiconductor Engineering (ASE), Taiwan's largest IC packaging and testing firm, is applying for a US$200 million syndicated loan to fund its operations in China, according...
ASE to open US$460 million plant
Oct 14, 01:05
IC packager Advanced Semiconductor Engineering (ASE) is scheduled to open its new US$460 million plant in Kaohsiung, southern Taiwan, on October 23. Chairman Jason Chang will host...
SPIL outperforms fellow backend firms in 3Q11
Oct 11, 12:13
Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...
ASE, Amkor expanding to compete for IDM orders
Oct 7, 01:25
In view of increased outsourcing demand by IDM companies, IC packagers Advanced Semiconductor Engineering (ASE) and Amkor Technology has been expanding their operations to vie for...
Qualcomm reportedly starts shipping baseband chips for Mango phones
Sep 29, 01:25
Qualcomm has secured orders for baseband chips from Nokia and Samsung Electronics for their upcoming Windows Phone (Mango)-based smartphones with shipments kicking off in September,...
Sep 23, 01:05
IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion in 2020, and is eyeing a 30% global market...
ASE breaks ground on China headquarters
Sep 22, 01:00
Advanced Semiconductor Engineering (ASE) broke ground at the site of a regional headquarters in Zhangjiang, Shanghai on September 21. Operations are scheduled to commence in 2012,...
ASE announces another share buyback
Stockwatch - Sep 21, 14:28
Advanced Semiconductor Engineering (ASE) has announced a share buyback program, under which the company will repurchase up to 30 million of its common shares from the open market...
LED industry enjoys high capacity utilization rates in 2Q12
LED | 1min ago
Solar wafer firms inclined to follow solar cell firms to increase quotes
Green energy | 18min ago
Silicon Power Computer & Communications to list on OTC
Bits + chips | 28min ago
Eris Technology to list on OTC at the end of June
Bits + chips | 59min ago
Compal lands notebook ODM orders from Samsung
IT + CE | 2h 7min ago
Price key to popularity of Thunderbolt, say Taiwan motherboard makers
Before Going to Press | 26min ago
TPK to see revenue growth in 3Q12
Before Going to Press | 54min ago
China government focuses on illegal imports of waste materials that carry polysilicon
Before Going to Press | 1h 38min ago
Three Taiwan IC distributors deny Samsung plans to withdraw sales agent rights
Before Going to Press | 1h 39min ago
June TV panel prices to be flat
Before Going to Press | 1h 51min ago
Taiwan market: China-based vendors competing in entry-level to mid-range smartphone segment
Before Going to Press | 2h 4min ago
TSMC sequential growth in 3Q12 revenues may fall to 5% due to declining book/bill ratio
Before Going to Press | 2h 21min ago
Infineon and ASE forge licensing partnership on new WLB technology
Infineon Technologies and Advanced Semiconductor Engineering (ASE) announced a partnership to introduce new embedded wafer-level ball-grid array (eWLB) technology. To promote the...
Photo: Company, Nov 14.
- Asustek, Acer to see 10% of notebook shipments in 2012 feature touchscreen panels
- Acer, Asustek to launch netbooks with upgraded Atom processor in 3Q12
- CMI, AUO see decreasing production costs due to declining equipment depreciation costs
- Intel pushes new battery solutions to reduce ultrabook cost
- International smartphones vendors worried about insufficient LTE chip supply
- AMD prepares low-voltage CPUs for Windows 8 tablet PCs
- Some China solar cell makers looking for Taiwan partnerships
- Taiwan solar firms fear turning into OEM firms for China
- Career to ramp up FPCB capacity by 30% in 2H12
- Hermes Microvision lists on OTC market
- GET refutes production suspension of thin-film solar products
- Packaging and testing firms see mobile DRAM orders rise
- Rexchip shares at stake between Micron-Elpida deal, say sources
- Taiwan market: WiMAX operator Global Mobile obtains NT$640 million loan
- Mighty Bright showcasing LED lighting lineup at the National Stationery Show in New York
- Taiwan LED manufacturers to use silicon substrates for producing LED chips
- China TV makers to further expand products abroad
- China market: 6.8 million iPhones shipped in 1Q12, says Digitimes Research
- BOE may roll out AMOLED panels at Ordos line in 2014
- Overall value of lighting market to shrink as LEDs displace conventional technology, says Pike Research
- MediaTek lands 2.5G handset solution orders from Nokia, say sources
- US solar firms may request duties on China-made solar modules
- Taiwan solar cell makers plan to increase quotes due to expected order increases from China
- Taiwan 1Q12 display production value down 7.7%, says IEK
- Korean vendors compete for OLED market
- Digitimes Research: Embedded and standalone integration in NFC IC development
- Digitimes Research: Solar spot prices in Greater China freeze before final verdict of anti-dumping and anti-subsidy investigation
- Digitimes Research: Solar spot prices in Greater China remain flat despite continuous demand from Europe
- Digitimes Research: April 1 solar FIT cuts in Germany to negatively impact solar spot prices
- Releases
- White papers
- Bulletin
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Fujitsu converts Fujitsu Toshiba Mobile Communications into a wholly owned subsidiary
- NEC reaks the speed barriers of microwave transmission with ultra high modulations
- ATO Solution to launch 256Mb SLC NAND Flash - for the first time in fabless industry
- LSI completes acquisition of SandForce
- NEC develops super-resolution technologies for fine magnification of surveillance camera images
22-May-2012 markets closed
| Last | Change |
| TAIEX (TSE) | 7274.89 | +82.66 | +1.15% |
| TSE electronic | 277.63 | +3.99 | +1.46% |
| GTSM (OTC) | 104.57 | +2.00 | +1.95% |
| OTC electronic | 134.14 | +2.91 | +2.22% |
- Thousands protest Taiwan leader's inauguration (May 19) - AP (via Google)
- 40% of employees in Asia/Pacific will be mobile workers by 2015, says IDC (May 14) - IDC
- Globalfoundries welcomes President Barack Obama (May 4) - Company release
- India gives 4G to Qualcomm at last (May 8) - Tech Eye.net
- Abu Dhabi fund Mubadala plans US$5.5 billion spending in 2012 (May 9) - Reuters
- French, Greek voters say no to austerity (May 7) - Washington Post
- SK Hynix won't bid for Elpida (May 3) - Wall Street Journal
- Google, authors go head to head over digital books (May 3) - Reuters
Photo: Company, May 21.
Photo: Company, May 21.
Photo: Company, May 17.
Photo: Company, May 17.
Photo: Company, May 11.
Photo: Michael McManus, May 10.
Maxim's Chris Neil, senior VP, Industrial and Medical Solutions Group
Photo: Michael McManus, May 10.
Ravi Subramanian, CEO of EDA firm Berkeley Design Automation
Photo: Michael McManus, May 10.
Algotochip CTO Satish Padmanabhan and company VP of operations Mike Hong
Photo: Michael McManus, May 10.
Photo: Company, May 4.
Photo: Company, May 4.
Photo: Company, May 2.
- Commentary: A Micron-Elpida merger would improve DRAM industry health
- Simon Sze and his invention of floating-gate NVM
- Commentary: Long-term solar material supply contracts increase losses during industry downturns
- Commentary: Grid parity in India may happen sooner than expected
- Commentary: US protectionism on domestic solar industry may backfire
Keeping industrial interesting: Q&A with analog and mixed signal solution provider Maxim
According to analog and mixed-signal semiconductor maker Maxim Integrated Products, the industrial...
Over the next 30 years, the world's middle class (defined as per capita income of more than US$8,000...
Turning C code into silicon in 8-16 weeks: Q&A with semi startup Algotochip
Silicon Valley startup Algotochip specializes in architecting and implementing all aspects of a complete...
The rise of China Star Optoelectronics Technology: Q&A with CEO He Chengming
The ramping-up of 8.5G production at China-based BOE Technology and China Star Optoelectronics Technology...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- Taiwan motherboard industry overview - Jun 2011
The motherboard industry began 2010 with optimism and expected to see a reversal of the previous two years' declines in revenues and shipments as the impact of...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Taiwan ICT industry development and outlook
A presentation prepared for Taiwan Ministry of Economic Affairs (MOEA), offering an overview of Taiwan's key ICT industries and the dynamics influencing future development. The report is free for download.
- The role of PV in China energy policy through 2015
During China 12th Five Year Plan period (2011-2015), solar PV will be the fastest growing renewable energy. Installed capacity in China grow by tenfold to reach the target of 10GWp by 2015.
- Industry development and government policy in China animation sector
The animation industry production value in China is projected to exceed CNY50 billion by 2015. This Digitimes Special Report provides an overview of the industry, including regional development, government policy and a breakdown of the various market segments.