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News tagged ASE
  • Last update: Thursday 16 May 2013 [283 news items]

ASE to buy Toshiba backend plant in China

May 16, 11:34

IC packager Advanced Semiconductor Engineering (ASE) announced on May 15 that the company has reached a deal with Toshiba Semiconductor (Wuxi) in China to acquire its chip assembly...

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

ASE expects 11-14% growth in 2Q13 shipments

Apr 29, 10:32

IC packaging and testing house Advanced Semiconductor Engineering (ASE) expects shipments to increase 11-14% sequentially and gross margin to rise to 23.2% in second-quarter 2013,...

ASE, SPIL 2Q13 sales outlook optimistic

Apr 18, 22:10

Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...

Backend to outperform IC sector, says ASE chair

Apr 15, 23:37

The packaging and testing sector is set to outperform the overall industry in 2013, said Jason Chang, chairman for Advanced Semiconductor Engineering (ASE), during a recent company...

ASE breaks ground for new factory buildings in southern Taiwan

Apr 12, 11:55

Semiconductor assembly and testing company Advanced Semiconductor Engineering (ASE) on April 12 held a groundbreaking ceremony for two new factory buildings, one designated for production...

ASE, SPIL March sales rebound

Apr 9, 15:35

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...

ASE to issue NT$15 billion convertible bonds

Stockwatch - Apr 9, 12:23

Taiwan-based Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has unveiled plans to issue overseas convertible bonds worth up to...

ASE, SPIL to see sales rebound in March

Mar 8, 15:04

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both have reported decreased sales for February, but their sales are expected to gain momentum...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Digitimes Research: Taiwan IC backend production value to outperform global industry

Feb 26, 15:42

Production value of Taiwan's dedicated semiconductor packaging and testing industry is forecast to grow 4.9% to US$13.88 billion in 2013, while the global industry will generate a...

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Equipment maker GPTC posts significant revenue and profit growth in January

Feb 26, 14:51

Buoyed by its recent acquisition of a chemical material supplier, as well as brisk demand from IC foundries, Grand Plastic Technology (GPTC) has reported significant on-year growth...

Mobile IC vendors asking to renegotiate backend quotes for 28nm products

Feb 26, 13:46

The available capacity for 28nm mobile chips at IC foundries, mainly Taiwan Semiconductor Manufacturing Company (TSMC), has become sufficient to meet demand since early 2013. Suppliers...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

ASE, SPIL 1Q13 sales likely to drop 10% or more

Jan 28, 20:58

Sales at IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely register sequential decreases of 10% or more...

ASE, SPIL 4Q12 sales miss guidance

Jan 10, 14:09

Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their core business revenues miss their guidance of 2-5%...

ASE reportedly lands small-volume orders for Apple processors

Dec 27, 21:00

Taiwan-based Advanced Semiconductor Engineering (ASE), an IC packaging and testing services provider, reportedly has begun to fulfill small-volume orders for Apple's A-series proce...

ASE, SPIL to post mixed results for December

Dec 18, 14:08

The top-two Taiwan-based IC backend services companies, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), are expected to report mixed results...

IC backend services firms to ride high as TSMC ramps capex for 2013, say sources

Dec 17, 21:37

Taiwan-based IC backend services companies will benefit from an increase in capital expenditure (capex) by Taiwan Semiconductor Manufacturing Company (TSMC) in 2013, according to...

ASE November IC packaging/testing revenues hit record for 2nd time straight

Dec 10, 11:05

Taiwan-based IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) brought in revenues of NT$11.823 billion (US$405 million) from IC packaging and testing...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

Apple suppliers to enjoy particularly strong 1Q13

Nov 19, 11:31

Apple's suppliers, including contract chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) and packager Advanced Semiconductor Engineering (ASE) which have entered the vendor's...

ASE to post better-than-seasonal sales for 1Q13

Nov 8, 10:02

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to post an only a single-digit sales drop sequentially in the first quarter of 2013, compared to...

ASE, SPIL sing different tune for 4Q12

Oct 31, 21:52

Advanced Semiconductor Engineering (ASE) expects its shipments to grow 3-5% in the fourth quarter of 2012, while fellow company Siliconware Precision Industries (SPIL) is looking...

ASE expects 4Q12 IC backend shipments to rise 3-5% sequentially

Oct 29, 11:56

Advanced Semiconductor Engineering (ASE), the largest Taiwan-based IC packaging and testing houses, expects its shipments in the fourth quarter of 2012 to increase on quarter by 3-5%...

ASE, SPIL to perform rather strongly in 4Q12

Oct 23, 22:11

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will perform relatively strongly in the fourth quarter of 2012 thanks to 28nm orders from Qualcomm...

ASE posts revenue gains in September as SPIL stays flat

Newswatch - Oct 11, 16:05

Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$17.06 billion (US$580.27 million) for September, up 5% sequentially and 10.6% on year.

ASE, SPIL October sales to rise

Oct 2, 01:35

IC backend service companies Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) will both see their October revenues continue to rise sequentially thanks...

packager

ASE breaks ground on new factory in Korea

Sep 28, 14:32

Advanced Semiconductor Engineering (ASE) recently broke ground on its second factory located in Paju City, Gyeonggi province, Korea. The new plant is slated for commercial operation...

ASE to expand operations in Korea

Rising value of NT dollar to affect performance of IC backend service firms

Sep 26, 14:40

The rising price of gold and the appreciation of the NT dollar, triggered by the launch the US Federal Reserve's third round of the quantitative easing (QE3) is expected to weigh...

IC backend service providers look to strong revenue gains in September

Sep 18, 01:25

IC backend service companies, including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL), King Yuan Electronics (KYEC) and Sigurd Microelectronics, all...

Demand for copper wirebonding machines to slide 50% sequentially in 4Q12

Sep 12, 01:40

Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...

ASE sees August revenues up slightly

Stockwatch - Sep 10, 11:08

Taiwan-based IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) had consolidated revenues of NT$16.247 billion (US$542 million) for August growing...

3D IC commercialization to take place in 2015-16, says ASE

Sep 6, 09:33

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

Tong Ho-ming, general manager and chief of R&D at ASE
283 items [1/9]
Realtime news
  • Global large-size panel shipments exceed 65 million units in April 2013, says WitsView

    Before Going to Press | May 20, 21:28

  • Touchscreen IC, LED driver IC suppliers to post strong May

    Before Going to Press | May 20, 21:27

  • TPK expected to see decline in touch screen notebook panel shipments during 2Q13

    Before Going to Press | May 20, 21:26

  • Demand for large-size driver ICs to boom in 2H13, say backend firms

    Before Going to Press | May 20, 21:23

  • HTC cooperates with KDDI to launch HTC One in Japan market

    Before Going to Press | May 20, 21:21

  • Innolux expected to ship 1 million TOD units in 2013

    Before Going to Press | May 20, 21:11

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Trends in China IC design industry in 2013

21-May-2013 12:45 (GMT+8)

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TAIEX (TSE)8371.68-5.37-0.06% 

TSE electronic316.38-0.41-0.13% 

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OTC electronic144.6+0.54+0.37% 

2013 global tablet forecast
  • 2H 2012 global TFT panel market forecast

    Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.

  • Trends and shipment forecast for 2H 2012 smartphone market

    Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.

  • Trends in Asia LED chip manufacturing industry

    Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.