Advanced chip manufacturing and advanced packaging have now become the focus of attention in China. SMIC already confirmed that it had adopted deep ultraviolet (DUV) lithography machines...
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Semiconductor material equipment supplier Wah Lee Industrial Group reported a revenue of NT$66.78 billion in 2023, a year-on-year decrease of 9.2%, with a combined after-tax net profit...
AblePrint Technology (APT), a company specializing in pneumatic and thermal process solutions for semiconductor packaging, is optimistic about the growing demand for advanced packaging...
Samsung beware: As Intel Foundry (IF) is now collaborating with TSMC to accomplish an advanced packaging mission to meet customer's needs, it is aiming for something bigger.
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
