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NEWS TAGGED ADVANCED PACKAGING
Wednesday 26 June 2024
ASE sets up new facility in southern Taiwan for advanced packaging
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Tuesday 25 June 2024
Intel Foundry ecosystem partners add reference flows for EMIB advanced packaging
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
Tuesday 25 June 2024
Taiwan OSATs to see sales growth in 2H24
Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...
Monday 24 June 2024
Innolux, OSATs stepping up FOPLP deployment
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Friday 21 June 2024
Chinese OSATs gear up for advanced packaging
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
Tuesday 18 June 2024
FitTech faces challenges, seeks opportunities with TSMC's advanced packaging
The Mini LED demand in the LED industry has shown a lack of new momentum, leading to a halt in expansion plans, and impacting equipment supplier FitTech's operations.
Monday 17 June 2024
Fab tool and equipment suppliers benefit from TSMC 2H24 business boom
TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...
Thursday 13 June 2024
HBM competition (2): The choice of HBM's next steps?
It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions.
Wednesday 12 June 2024
Samsung expands advanced-packaging alliance with 10 new partners to rival TSMC
Samsung Electronics is actively expanding its partner alliance to strengthen its semiconductor packaging technology, seeking to compete with the world's leading foundry, TSMC, in...
Friday 7 June 2024
Contrel steps up deployment in MicroLED, advanced packaging fields
Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025.
Monday 3 June 2024
SPIL invests US$1.276 billion to build facility in Penang, Malaysia
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Thursday 30 May 2024
Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Tuesday 28 May 2024
China can break through US EUV ban with mature-node innovation, but how?
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon...
Wednesday 22 May 2024
Csun contributes to advanced packaging supply chain, says company president
PCB and semiconductor equipment specialist Csun Manufacturing plays an important role in the supply chain for advanced 2.5D and 3D IC packaging, said company president Frank Liang...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research