Last update: Tuesday 29 January 2013 [15 news items]
STATS ChipPAC, UMC unveil 3D IC developed under open ecosystem model
Jan 29, 22:11
STATS ChipPAC and United Microelectronics Corporation (UMC) have jointly announced the first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem...
STATS ChipPAC to expand operations in Korea
Nov 20, 13:42
STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
Amkor licenses proprietary through-mold-via technology to Shinko
Apr 2, 10:22
Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.
Chip equipment spending to decline following two years of growth, says Gartner
Dec 16, 15:53
Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...
Amkor, Globalfoundries team up for advanced assembly, test solutions
Aug 30, 11:08
Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...
Nanya, ITRI team up for 3D stacked DRAM
Jan 25, 14:57
Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...
ITRI sets up 3D IC experimental lab
Jul 1, 12:28
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
Jun 21, 16:55
Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies...
Major growth in TSV metrology/inspection equipment expected, says The Information Network
Apr 30, 10:42
The market for metrology/inspection equipment for 3D through silicon via (TSV) semiconductor packaging looms large, according to The Information Network. The desire for smaller, lighter...
Applied Materials, ITRI team up for 3D chip stack technology
Oct 15, 16:53
Applied Materials has announced its collaboration with the Taiwan government-backed Industrial Technology Research Institute (ITRI) to accelerate the development and commercialization...
3D IC packaging to be mature within 3 years, says ASE chief officer
Oct 2, 17:10
Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...
PTI purchase of Spansion backend facility in China to target non-memory products, say sources
Aug 25, 16:39
Powertech Technology (PTI) aims to turn the China plant it is buying from Spansion into its major production base for non-memory packaging and testing, covering logic ICs, SiP (system...
TSV development picking up momentum
Apr 7, 10:34
Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...
Taiwan to mass produce TSV by 2010
Oct 15, 17:06
Taiwan's Semiconductor Industry Promotion Office under the Ministry of Economic Affairs (MOEA) and Industrial Technology Research Institute (ITRI) recently gathered experts to discuss...
3D-stacking IC consortium established in Taiwan
Jul 24, 15:44
Driven by growing demand for strong IC design integration, Taiwan's Industrial Technology Research Institute (ITRI) recently established a consortium for advanced stacked-system technology...
TSMC presence in advance process market remains strong
Bits + chips | 10h 52min ago
Chicony seeks growth from non-notebook product lines
IT + CE | 11h 47min ago
Taiwan April export order value slightly down on month, year, says MOEA
Bits + chips | 11h 56min ago
Global large-size panel shipments exceed 65 million units in April 2013, says WitsView
Displays | 11h 57min ago
Supply chain to begin volume shipments of new Xbox console orders in 3Q13
IT + CE | 11h 59min ago
MediaTek 2Q13 sales likely to beat guidance
Bits + chips | 12h 12min ago
Taiwan makers expected to benefit from Lenovo targeting smartphones in 2013
Mobile + telecom | 12h 14min ago
Digitimes Research: Taiwan LCD driver IC shipments rise 22% in 1Q13
Bits + chips | 12h 16min ago
Taiwan panel makers lower pricing for Ultra HD TV panels
Displays | 12h 18min ago
Global large-size panel shipments exceed 65 million units in April 2013, says WitsView
Before Going to Press | 12h 14min ago
Touchscreen IC, LED driver IC suppliers to post strong May
Before Going to Press | 12h 15min ago
Win Semi expects to post double-digit revenue growth in 2013
Before Going to Press | 12h 16min ago
TPK expected to see decline in touch screen notebook panel shipments during 2Q13
Before Going to Press | 12h 16min ago
Demand for large-size driver ICs to boom in 2H13, say backend firms
Before Going to Press | 12h 19min ago
Epistar expects revenue proportion for LED used in lighting to rise to 30%
Before Going to Press | 12h 19min ago
HTC cooperates with KDDI to launch HTC One in Japan market
Before Going to Press | 12h 21min ago
Innolux expected to ship 1 million TOD units in 2013
Before Going to Press | 12h 31min ago
- Trial production of 5th-generation iPad to begin soon, say Taiwan makers
- Handset vendors in discussion over producing 6-inch and larger phones
- Taiwan component makers conservative about growth in 2H13 notebook shipments
- Taiwan-based analog IC suppliers facing increasing competition from rivals in China
- Commentary: High-end LED lighting in demand
- AUO supply of iPad mini panels in 2Q13 expected to slip sequentially
- More firms provide crystal-less USB 3.0 device controllers
- BLU makers report different results in 1Q13
- ChipMOS capex for 2013 to reach NT$2.5-2.8 billion
- BIOS designers feel the impact from weak PC market
- Apple MacBook orders to rise 20% sequentially in 2Q13
- Capella tops analog IC suppliers with highest EPS in 1Q13
- LED firms to lower prices through improved technology
- Digitimes Research: Europe solar trade tariffs may slow down market growth
- Getac aims at expanding ruggedized PC market share to 30%
- Ruggedized PC vendors eyeing 7- to 8-inch tablet market
- Wintek to reportedly set up joint venture 6G touch panel factory in China with Nanjing Panda Electronics
- China market: Several smartphone components in short supply
- Taiwan LED firms to attend Guangzhou International Lighting Exhibition 2013
- Asia Pacific leads worldwide mobile phone sales growth in 1Q13, says Gartner
- SMA Technology sees 1Q13 revenues fall on year
- SunPower announces fiscal 2013 financial guidance
- LED plant factory market to reach US$1.2 billion in 2013, says PIDA
- Equipment maker Acter sees profits down in 1Q13
- Asustek unveils Intel 8 series motherboards
- Releases
- White papers
- Bulletin
- DIGIEVER partnership with EverFocus for better professional network surveillance solutions
- Advantech Introduces New 18" and 21" Widescreen Multitouch Panel PCs
- Digital Network Fuels Opportunities in Vehicle Surveillance Market
- Advantech Redefines Entry Level Network Application Platforms
- WD shipping world's first 5 mm 2.5-inch hard drive
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
20-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8377.05 | +8.86 | +0.11% |
| TSE electronic | 316.79 | +0.62 | +0.2% |
| GTSM (OTC) | 119.74 | +0.18 | +0.15% |
| OTC electronic | 144.06 | +0.15 | +0.1% |
- Weak eurozone growth hits euro (May 15) - The Financial Times
- German factory orders rise for second month (May 7) - Bloomberg
- Eurozone retail sales fall for second consecutive month (May 6) - BBC News
- China economy to stay commodity-oriented, says JPMorgan (April 16) - Bloomberg
- S Korea in US$15.3 billion stimulus bid to spur economic growth (April 16) - BBC News
- Gold hit by sharpest tumble in 30 years (April 16) - CNN
- FBI probes Boston 'terror' blasts (April 16) - BBC News
- China GDP growth slows to 7.7% (April 14) - Wall Street Journal
Photo: Company, Apr 30.
Photo: Company, Apr 16.
Photo: Company, Apr 12.
Photo: Company, Apr 10.
Photo: Company, Apr 10.
2013 Taiwan International Lighting Show: Edison Opto's cafe booth
Photo: Jackie Chang, DIGITIMES, Apr 8.
2013 Taiwan International Lighting Show: Delta LED light bulbs
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Company, Apr 8.
2013 Taiwan Internationbal Lighting Show: Epistar applications for agricultural lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Everlight residential LED lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Edison Opto LED strip lamp
Photo: Jackie Chang, DIGITIMES, Mar 29.
Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
Returning with stronger competitiveness: Q&A with Lu Li-Cheng, Chaintech chairman
Chaintech, a motherboard/graphics card maker, which quit the market once and returned recently, has...
MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- Trends and shipment forecast for 2H 2012 tablet market
Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.
- Trends in the China video market
In addition to strong potential video content demand in China, the market has developed rapidly due to government intervention and delays in establishing copyright protections.
- 4Q12 trends in the Greater China touch panel industry
In the second half of 2012, the market focus is on the iPhone 5, which uses in-cell touch screen technology. Due to the integration of display panels and touch panel functions, the high technological threshold will mean Taiwan touch panel makers are unable to enter the iPhone supply chain.