Last update: Wednesday 20 February 2013 [28 news items]
Five IC suppliers to hold one-third of 300mm wafer capacity in 2013, says IC Insights
Feb 20, 20:28
Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies. IC industry capacity is also...
Samsung to build new 12-inch fab for logic ICs
Jun 8, 14:42
Samsung Electronics has unveiled plans to build a new fabrication line in Hwaseong, South Korea, to meet the growing demand for logic products.
STATS ChipPAC completes expansion of 300mm wafer bump and WLCSP operation in Taiwan
Nov 17, 14:13
STATS ChipPAC has completed the expansion of its 300mm wafer bump and wafer-level chip-scale packaging (WLCSP) in Taiwan, according to the chip packaging and test service provider.
STATS ChipPAC expands TSV offering
Apr 19, 10:38
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
Only 10 participants in 300mm wafer capacity space, says IC Insights
Mar 7, 10:57
Semiconductor industry capital spending is becoming more concentrated, with a greater percentage of spending coming from a shrinking number of companies, according to IC Insights...
Record capex leads to 28% fab equipment growth in 2011, says SEMI
Mar 3, 14:45
SEMI has updated data on over 200 facilities, including LED fabs. Using a thorough bottoms-up approach (tracking all projects fab by fab), the data reveal a 28% increase year-over-year...
Intel announces new chip plant in Arizona
Feb 21, 10:07
Intel has announced plans to invest more than US$5 billion to build a new chip manufacturing facility at its site in Chandler, Arizona. Designated Fab 42, it will be built as a 300mm...
Tight capacity forces semiconductor production efficiencies in 2010, says Semico
Jan 26, 14:00
The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...
STATS ChipPAC opens new plant for 300mm eWLB wafer manufacturing
Sep 15, 15:33
STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...
Silicon demand set to rebound robustly in 2010, says iSuppli
Apr 27, 09:24
Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...
STATS ChipPAC intros 300mm embedded WLB wafer manufacturing
Apr 13, 12:00
STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
BCD platform technologies are rapidly changing the power IC landscape, says Petrov Group
Mar 3, 14:22
The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...
Shanghai government to invest in new HHNEC-GSMC 12-inch fab
Jan 22, 11:00
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
Elpida and ProMOS ink partnership on DRAM
Nov 6, 10:28
Elpida Memory and ProMOS Technologies announced on November 6 the signing of a DRAM foundry agreement.
UMC ramping 45/40nm at Fab 12i
Oct 9, 10:33
United Microelectronics Corporation (UMC) has begun implementing a capacity expansion project for 45/40nm production at its Singapore-based 300mm (12-inch) wafer fab - Fab 12i, according...
TI opens 300mm analog fab in US
Oct 6, 14:46
Texas Instruments (TI) has announced the opening of its manufacturing facility in Richardson, Texas. The chipmaker said it expects to begin moving equipment into the facility in Oc...
Spansion says partnership with SMIC remains unchanged
Sep 2, 15:06
Spansion has claimed its foundry agreement with Semiconductor Manufacturing International Corporation (SMIC) is still valid, though the schedule to ramp 65nm production at SMIC's...
Jul 24, 15:02
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...
Winbond remains cautious about expansion
Jul 16, 14:45
Winbond Electronics, a Taiwan-based DRAM maker that has diversified its products to include niche memory and NOR flash, has said its capital spending for 2009 may be less than its...
Globalfoundries calls for renewed focus on 300mm
Jul 14, 15:20
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....
Winbond completes transition to 300mm fab production
Jul 8, 14:09
Taiwan's Winbond Electronics, which has shifted its focus from standard DRAM to niche memory and NOR flash, has recently completed its migration to 300mm wafer fab production, according...
Intel to produce on 65nm in China
Jun 24, 12:20
Intel's upcoming 12-inch fab in China will initially focus on 65nm production, according to Kirby Jefferson, general manager of the new fab (Fab 68). Intel is scheduled to commence...
Chip equipment market to begin recovery by October, says The Information Network
Jun 10, 14:36
The semiconductor equipment market will begin its recovery by October 2009, according to The Information Network.
Intel on track to commence operations at China fab in 2010
Jun 8, 14:56
Intel is scheduled to kick off operation at its 300mm fab in Dalian, China, in 2010, according to the company. The chip giant also said it is looking to integrate its assembly and...
TSMC sees delay in e-beam equipment delivery
May 18, 12:08
Taiwan Semiconductor Manufacturing Company (TSMC) has seen a delay in the delivery of 300mm multiple electron-beam (e-beam) maskless lithography equipment from Mapper Lithography...
Semiconductor equipment makers wary of 450mm development, says The Information Network
Apr 21, 10:01
The planned transition to 450mm diameter silicon wafers for semiconductor production will be disastrous for the equipment industry, The Information Network said.
FlipChip announces 300mm strategic partnership with SMIC
Mar 18, 09:36
FlipChip International (FCI), which specializes in flip-chip bumping and wafer level packaging, has recently announced a partnership alliance with Semiconductor Manufacturing International...
NAND flash market prepares for rush orders
Feb 19, 11:31
The NAND flash market is gearing up for an influx of rush orders, according to market sources. However, bit growth for the sector will still suffer a signficant drop in 2009, which...
Canon has developed what it claims is the world's largest CMOS image sensor, with a chip size measuring 202x205mm. The newly-developed CMOS sensor is among the largest chips that...
Photo: Company, Sep 10.
FormFactor 300mm full-wafer test solution for DRAM
FormFactor has introduced its next-generation 300mm (12-inch) full-wafer-contact probe card for DRAM devices - the SmartMatrix 100 probe solution. Incorporating a proprietary probe...
Photo: Company, Dec 11.
KLA-Tencor 8900 inspection system
KLA-Tencor has extended its product offerings in the CMOS image sensor (CIS) market by announcing the 8900 defect inspection system. The new 8900 offers selectable illumination...
Photo: Company, Oct 19.
- China-based ARM-architecture IC designers to attend 2013 Computex Taipei
- Digitimes Research: Global LED tube light shipments to reach 220 million units in 2013
- Lextar expected to see 2Q13 gross margin rise to 13-14%
- Samsung to launch complete line up of notebooks in 2H13
- Taiwan panel industry output value worth US$7.86 billion in 1Q13, says IEK
- China market: B2C transaction value over CNY133 billion in 1Q13, says Analysys
- Taiwan market: Sony to launch Xperia Tablet Z
- Asustek, Chunghwa Telecom cooperate to provide cloud computing services
- Nanjing Z-Com developing 4G small cells for China market
- China market: Smartphone sales over 75 million units in 1Q13, says Analysys
- Imec, Globalfoundries team up for STT-MRAM
- Solar industry capex hits 7-year low in 2013, says IHS
- ACX sees earnings up over 60% sequentially in 1Q13
- Ilitek to post revenues of over NT$900 million in May
- Sharp to produce 3 types of IGZO LCD panels for notebooks
- 3M announces new development of quantum dot enhancement film
- NLT demonstrates latest display technologies, including projective capacitive touch panel technology
- New Vision Display exhibits PMVA color display based on Corning Willow Glass
- AMD falls to 4th rank MPU supplier in 2012, says IC Insights
- Touch screen IC, LED driver IC suppliers to post strong performance in May
- LED maker Epistar expects more revenues from lighting applications in 3Q13
- Taiwan makers expected to benefit from Lenovo targeting smartphones in 2013
- Digitimes Research: Taiwan LCD driver IC shipments rise 22% in 1Q13
- CSOT successfully produces 32-inch Oxide TFT LCD module
- Can Ultra HD TVs avoid the fate of 3D sets? asks IHS
- Releases
- White papers
- Bulletin
- Carry Technology Highlights Thunderbolt and Wi-Fi Card Reader Series
- Imagination says third party IP becoming a key driving force for silicon vendors
- EverFocus launches ECOR960 X1 16CH with better image quality and more affordable price
- Leadtek to Show Total Cloud Solutions at Computex Taipei 2013
- Clientron to exhibit its latest Zero/Thin Client and POS solutions along with the full product line at Computex Taipei 2013
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
22-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8398.84 | +15.79 | +0.19% |
| TSE electronic | 317.55 | +0.70 | +0.22% |
| GTSM (OTC) | 120.71 | +0.33 | +0.27% |
| OTC electronic | 145.64 | +1.03 | +0.71% |
- Apple 'among largest tax avoiders in US' - Senate committee (May 21) - BBC News
- Weak eurozone growth hits euro (May 15) - The Financial Times
- German factory orders rise for second month (May 7) - Bloomberg
- Eurozone retail sales fall for second consecutive month (May 6) - BBC News
- China economy to stay commodity-oriented, says JPMorgan (April 16) - Bloomberg
- S Korea in US$15.3 billion stimulus bid to spur economic growth (April 16) - BBC News
- Gold hit by sharpest tumble in 30 years (April 16) - CNN
- FBI probes Boston 'terror' blasts (April 16) - BBC News
Photo: Company, Apr 30.
Photo: Company, Apr 16.
Photo: Company, Apr 12.
Photo: Company, Apr 10.
Photo: Company, Apr 10.
2013 Taiwan International Lighting Show: Edison Opto's cafe booth
Photo: Jackie Chang, DIGITIMES, Apr 8.
2013 Taiwan International Lighting Show: Delta LED light bulbs
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Jackie Chang, DIGITIMES, Apr 8.
Photo: Company, Apr 8.
2013 Taiwan Internationbal Lighting Show: Epistar applications for agricultural lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Everlight residential LED lighting
Photo: Jackie Chang, DIGITIMES, Mar 29.
2013 Taiwan International Lighting Show: Edison Opto LED strip lamp
Photo: Jackie Chang, DIGITIMES, Mar 29.
Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
Returning with stronger competitiveness: Q&A with Lu Li-Cheng, Chaintech chairman
Chaintech, a motherboard/graphics card maker, which quit the market once and returned recently, has...
MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
- Smartphone and tablet industry: The view from Taiwan - May 2012
Taiwan-based companies have a long and successful history of involvement in the supply chain for mobile devices, which for the purposes of this article consist...
- Taiwan motherboard industry overview - May 2012
The year 2011 saw the motherboard industry reverse its trend of declining shipments year-on-year, to post a slight 0.2% growth. This upturn in fortunes was expected...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- 2H 2012 global TFT panel market forecast
Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.
- Trends and shipment forecast for 2H 2012 smartphone market
Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.