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News tagged 200mm
  • Last update: Tuesday 1 March 2016 [15 news items]

Taiwan passes South Korea to become No.1 in total IC wafer fab capacity, says IC Insights

Mar 1, 15:10

As of December 2015, Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country, according to IC Insights. Taiwan surpassed...

200mm wafer fab capacity to reach 5.4 million wspm in 2018, says SEMI

Oct 21, 10:42

Worldwide 200mm semiconductor wafer fab capacity is forecast to reach 5.2 million wafer starts per month (wspm) in 2015, and will expand to 5.4 million wspm in 2018, according to...

Companies maximize 300mm, 200mm wafers; slow progress on 450mm, says IC Insights

Sep 14, 10:52

Worldwide capacity by wafer size was dominated by 300mm wafers in 2014, and is forecast to continue increasing through 2019, according to IC Insights.

Equipment spending slows but still positive in 2015 and 2016, says SEMI

Sep 10, 15:44

Front-end fab equipment spending (including new, used, and in-house) is projected to increase 5% in 2015 to US$37 billion, and rise another 6.6% in 2016 to US$39.4 billion, according...

IC manufacturers close or repurpose 83 wafer fabs from 2009-2014, says IC Insights

Jun 17, 15:59

Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity in order to produce devices more cost-effectively on larger wafers...

300mm capacity dominates but life remains for 200mm wafer fabs, says IC Insights

Feb 5, 10:48

Nearly all new fab upgrade and construction activity has to do with 300mm wafer processing, but there is still plenty of life remaining in 200mm fabs, according to IC Insights.

Tight capacity forces semiconductor production efficiencies in 2010, says Semico

Jan 26, 14:00

The semiconductor industry enjoyed over 30% revenue growth in 2010, with unit sales also rising an impressive 31%, according to Semico Research. But wafer demand, based on semiconductor...

Silicon demand set to rebound robustly in 2010, says iSuppli

Apr 27, 09:24

Following a weak 2009, global demand for silicon used in semiconductor manufacturing is expected to rebound robustly in 2010, led by shipments of 300mm (12-inch) wafers, according...

BCD platform technologies are rapidly changing the power IC landscape, says Petrov Group

Mar 3, 14:22

The emergence of state-of-the-art BCD (Bipolar-CMOS-DMOS) platform technologies is having a far reaching effect on the analog/mixed-signal IC landscape, the Petrov Group has commented...

Globalfoundries aims to ramp output to 5.8 million 200mm wafer equivalents in 2014

Jan 15, 12:41

Globalfoundries has completed its integration with Chartered Semiconductor Manufacturing, and aims to ramp its total capacity to 5.8 million 200mm (8-inch) wafers in equivalent in...

CSMC inks licensing deal with IBM for 0.18-micron RF CMOS process

Oct 21, 15:57

CSMC Technologies, a China-based specialty foundry provider, has signed an agreement with IBM to license its proprietary 0.18-micron radio frequency (RF) CMOS process. The process...

NAND flash ASPs up 20% in 2Q09, says DRAMeXchange

Jul 31, 14:33

Production cutbacks and demand for restocking inventory from emerging markets pushed up NAND flash ASPs by about 20% sequentially in the second quarter of 2009, according to DRAMeXchange...

IM Flash likely to beat Hynix in 2009 ranking, says DRAMeXchange

Apr 20, 16:00

IM Flash Technologies, a joint venture between Intel and Micron Technology, may overtake Hynix Semiconductor and become the third-largest NAND flash supplier worldwide in 2009, according...

NAND flash market prepares for rush orders

Feb 19, 11:31

The NAND flash market is gearing up for an influx of rush orders, according to market sources. However, bit growth for the sector will still suffer a signficant drop in 2009, which...

Hynix to accelerate retirement of 200mm fabs, to reduce capacity by 30% by early 2009

Sep 18, 16:12

Hynix Semiconductor said that the company will retire its 200mm wafer fabrication plants, which are less efficient than 300mm fabs earlier than planned in order to improve its financial...

Realtime news
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    IT + CE | 1h 49min ago

  • Qualcomm expands Snapdragon Wear lineup with offering for targeted-purpose wearables

    Bits + chips | 2h 2min ago

  • Insyde launches UEFI BIOS for Windows 10 Anniversary Update

    Before Going to Press | 1h 32min ago

  • Digitimes Research: TFT-LCD material makers step into smart windows

    Before Going to Press | 1h 33min ago

  • HTC to spin off VR business unit in 3Q16

    Before Going to Press | 1h 48min ago

  • Inotera buys equipment from Tokyo Seimitsu

    Before Going to Press | 1h 59min ago

  • MOEA gives green light to Foxconn stake investment in Sharp

    Before Going to Press | 2h 11min ago

  • Brazil market: Xiaomi recalls handset team, to not introduce new models temporarily

    Before Going to Press | 2h 15min ago

  • Tons Lightology shareholders approve 2015 dividend of NT$3

    Before Going to Press | 2h 24min ago

  • Computex 2016: Dell launches new notebooks and desktops in Taiwan

    Before Going to Press | 2h 24min ago

  • Elan fingerprint sensor shipments to reach 2 million units in 3Q16

    Before Going to Press | 2h 25min ago

  • Computex 2016: ITRI showcasing UV-C LED sanitizer

    Before Going to Press | 2h 38min ago

  • Taiwan ranks 14th in 2016 IMD world competitiveness

    Before Going to Press | 2h 39min ago

  • Panasonic to stop production of LCD TV panels in Japan, say reports

    Before Going to Press | 2h 41min ago

  • China market: Demand for TFT-LCD materials in 2015 estimated at nearly 250 tons, says Sigmaintell

    Before Going to Press | 2h 42min ago

  • CMC Magnetics obtains optical disc orders booking capacity until end of 2016

    Before Going to Press | 2h 43min ago

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Computex 2016
Display panels for wearable devices

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