XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications.Under the partnership, XTPL will install a Delta Printing System in Manz Asia's  Semiconductor Innovation and R&D centre in Taoyuan, Taiwan, establishing a local capability for process development, testing, and validation. The facility will enable customers to evaluate specific applications and establish a pathway from prototype development to volume production.The partnership combines XTPL's proprietary dispensing technology with Manz Asia's expertise in advanced semiconductor manufacturing systems and process development. The collaboration will focus on joint engagement with third-party customers and the evaluation of application-specific commercial opportunities.XTPL's UPD technology enables highly controlled deposition of functional nanomaterials with feature sizes ranging from tens of micrometres down to below one micrometre. The technology is already qualified for high-volume production in display applications and is currently being evaluated for additional applications in advanced electronics, including inline manufacturing, multichip module packaging, and advanced electronic structures."I am delighted to start the partnership with Manz Asia - a company with a strong position and deep expertise in the semiconductor industry in Taiwan and Asia. It is only natural for us to work side by side with a partner who knows this ecosystem from the inside.The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit. That is precisely why I am confident this collaboration will translate into tangible business opportunities for both sides.," said Filip Granek, CEO of XTPL.Robert Lin, CEO of Manz Asia, added: "This strategic partnership with XTPL expands our printing capabilities into ultra-precise material deposition, enabling a wide range of advanced semiconductor applications. The technology supports both conductive and non-conductive materials across 2D, 2.5D and 3D substrates in diverse manufacturing scenarios.By combining XTPL's dispensing technology with Manz's automation and process integration expertise, we broaden our portfolio and provide more flexible manufacturing solutions, helping customers accelerate innovation and move efficiently from prototype to volume production."

Teamsworld Innovation Inc. announced its AI-powered manufacturing matchmaking platform, targeting multinational enterprises seeking to diversify supply chains. The platform connects clients with precision component manufacturers in Taiwan and mass production facilities in Vietnam, addressing information gaps and geopolitical risks in cross-border sourcing. The digital platform serves companies implementing "China Plus One" strategies. Teamsworld combines Taiwan's research and development capabilities with Vietnam's cost advantages, providing sourcing solutions for mechanical components from prototype development to mass production with supply chain transparency and flexibility.AI-Driven Manufacturing SupportThe platform digitalizes traditional procurement processes using artificial intelligence. The system analyzes materials and geometric tolerances while incorporating Design for Manufacturing (DFM) experience to optimize production paths during early development stages. Company data indicates the platform helps clients increase production efficiency by 25% and reduce research and development costs by up to 40%. A cloud-based dashboard offers global clients real-time visibility into production status, fostering seamless cross-border collaboration while significantly lowering overhead.Taiwan-Vietnam Dual-Hub Model"In today's volatile global landscape, manufacturing has evolved from a race on price to a test of resilience," said Vincent Lin, CEO of Teamsworld. "We aren't just a matchmaking platform; we are a strategic partner. By integrating Taiwan's advanced R&D with Vietnam's cost-effective production, we empower enterprises to navigate the entire lifecycle from prototype to mass production with unparalleled agility."Specialized Thermal Management Solutions for EV and 5G MarketsTeamsworld has developed technical capabilities in thermal management for high-power consumption and harsh environment applications. The company provides precision thermal enclosures for electric vehicle battery management systems, 5G communication base stations, and industrial automation equipment. Production processes integrate over 50 techniques, including aluminum die casting and injection molding, with assembly services spanning thermal bases to protective enclosures. Further information is available at official website.

Seoul, February 26, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.SK hynix said, "By making HBF an industry standard, together with Sandisk, we will lay the foundation for the entire AI ecosystem to grow together. A dedicated workstream under OCP1 will be launched with Sandisk to begin standardization work."Recently, the AI industry is shifting from training which focuses on creating Large Language Models (LLMs) to inference, which accelerates actual AI services to users.Fast and efficient memory is essential as the number of users using AI services increases rapidly. However, the existing memory structure cannot meet the high capacity data processing and power efficiency at the same time in the inference stage and HBF technology is designed to address these limitations.HBF technology is a new memory layer between ultra-fast memory, HBM and high-capacity storage device, SSD. HBF technology can fill the gap between HBM's high performance and SSD's high capacity and ensure both capacity expansion and power efficiency required for AI inferencing. While HBM handles the high level bandwidth, HBF technology serves as a supporting layer in the architecture.In particular, HBF technology is expected to reduce the total cost of ownership (TCO) while increasing the scalability of AI systems. The industry forecasts that the demand of complex memory solutions, including HBF, will pick up around 2030.In the AI inference market, the role of a total memory solution company that can provide both HBM and HBF is becoming more important as system level optimization of CPU, GPU, and memory determines the overall competitiveness rather than the performance of a single chip.In line with this, SK hynix and Sandisk are proactively pursuing HBF solution's standardization and commercialization based on their design, packaging and mass production experience in HBM and NAND."The key to AI infrastructure is to go beyond the performance competition of individual technologies and to optimize the entire ecosystem," said, Ahn Hyun, President and Chief Development Officer. "Through HBF technology standardization the company will establish a cooperative system and present an AI-era optimized memory architecture to create new value for customers and partners."