Taipei, Wednesday, April 16, 2014 19:58 (GMT+8)
mostly cloudy
Taipei
24°C
MSI launches WindBOX III with Intel Core 2 Duo for fanless system - comments from readers
Press release, September 17; Joseph Tsai, DIGITIMES [Friday 17 September 2010]
  • Be the first to comment
Add your comments

  • 255 character limit .
  • If you wish to receive an email reply, please check this box
  • Name Email
  • Can we post your comment and/or question anonymously on this page (for anyone to read)?
  • Yes No
DIGITIMES Research Data Services
China smartphone tracker

16-Apr-2014 markets closed

 LastChange

TAIEX (TSE)8923.82+7.11+0.08% 

TSE electronic340.02+0.12+0.04% 

GTSM (OTC)144.01+0.41+0.29% 

OTC electronic179.21+0.17+0.09% 

2014 global smartphone market forecast
  • Taiwan notebook ODMs

    Taiwan notebook Original Design Manufacturers (ODMs) account for more than 90% of global notebook production and Digitimes is there to provide daily...

  • HDD makers pushing new applications

    Hard disc drive (HDD) makers have been launching products for many different applications, hoping to attract demand from segments outside of the standard...

  • Android

    The early success Google's Android platform has achieved in the handset market has caused system makers, software developers and semiconductor players...

  • Tablet vendors going large with panel sizes

    Seeing the 7-inch tablet market suffering from fierce price competition, several vendors are turning to focus on 8-inch and above segments to avoid profit...

  • China flat panel display industry outlook, 2013-2016

    This Digitimes Research Special Report outlines and analyzes the key trends and players that are influencing the continued development of China large-size and small-to medium size TFT LCD panel industry, while providing related growth forecasts for the industry through 2016.

  • TD-LTE market developments and forecast, 2014-2016

    TD-LTE has become the mainstream global choice for the construction of 4G asymmetric frequency spectrum networks. This Digitimes Research Special Report examines the current global status of TD-LTE, and forecasts developments in the TD-LTE supply chain in China and worldwide through 2016.

  • ASPs of TD-LTE chips to remain stable initially as suppliers are limited

    While a number of IC vendors have begun shipping chips supporting TD-LTE, including base band chips, radio frequency chips, APs, SoC solutions and soft modems, shipments of base band chips account for a majority share of total TD-LTE chip shipments currently, according to Digitimes Research.