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Toppan plans to establish new FC-BGA plant in Singapore

Chiang, Jen-Chieh, Taipei; Jingyue Hsiao, DIGITIMES Asia 0

Credit: Toppan

Japan-based Toppan announced a plan to build a plant in Singapore for producing FC-BGA substrates used in chip packaging, with operations expected to begin by the end of 2026. If necessary, the plant will receive further support from Broadcom, whose...

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