Taipei, Wednesday, August 23, 2017 09:03 (GMT+8)
thunderstorms
Taipei
35°C
Computex 2014: Intel unveils innovations for mobile devices, desktops and 2-in-1s
Press release; Joseph Tsai, DIGITIMES [Wednesday 4 June 2014]

Intel president Renee James has unveiled several new innovations at Computex 2014 including a SoC platform for entry-level mobile devices, 14nm fanless mobile PC reference design, new CPUs and technologies.

Noting progress toward bringing the company's first integrated mobile SoC platform for entry and value smartphones and tablets to market in the fourth quarter of this year (2014), James made the first public phone call using a smartphone reference design based on the dual-core Intel SoFIA 3G solution. Intel will also bring a quad-core SoFIA LTE part to market in the first half of 2015 and last week announced a strategic agreement with Rockchip to add a quad-core SoFIA 3G derivative for entry-level tablets to the SoFIA family, also due in the first half of next year.

James also revealed the company's 14nm fanless mobile PC reference design. The 2-in-1 is a 12.5-inch screen that is 7.2mm thin with keyboard detached and weighs 670g. It includes a media dock that provides additional cooling. The design is based on the first of Intel's next-generation 14nm Broadwell processors that are purpose-built for 2-in-1s and will be in market later this year. The reference design is powered by Intel's Core M processor for energy efficiency.

James introduced the fourth-generation Intel Core i7 and i5 processors "K" SKU, deliver four cores at up to 4GHz base frequency. The desktop processor, built for enthusiasts will start production shipments begin in June of this year.

For the data center I/O needs, James introduced the Intel Solid-State Drive Data Center Family for PCIe to meet the increasing need for high-performance, consistent and reliable storage solutions in the data center while helping to lower total cost of ownership. The drives will be broadly available in the third quarter of this year.

In order for computing to become more personal, James said it needs to meet people on their own terms, making interaction more natural and intuitive. She highlighted collaborations and new advances to bring Intel RealSense technology and 3D cameras and supporting applications to a growing number of 2-in-1, all-in-one, tablet and other personal computing devices.

James said that the Intel RealSense software development kit 2014 will be made available to developers in the third quarter of 2014, providing opportunity for developers of all skill levels to create natural, intuitive user interfaces.

Intel 14nm fanless mobile PC reference design

Intel 14nm fanless mobile PC reference design
Photo: Company

Realtime news
  • TowerJazz and Tacoma announce partnership for 8-inch fab in China

    Bits + chips | Aug 22, 17:41

  • Digitimes Research: AR players shift focus to develop platform products

    Before Going to Press | 11h 37min ago

  • Taiwan market: Smartphone-based credit card payment to be launched

    Before Going to Press | 11h 39min ago

  • Fujitsu plans to sell its handset business

    Before Going to Press | 11h 47min ago

  • China market: Smartphone vendors ready to launch all-screen models

    Before Going to Press | 11h 53min ago

  • Asustek, Acer to roll out Coffee Lake-based notebooks starting September

    Before Going to Press | 11h 53min ago

  • China market: DPVR unseats HTC as VR headset leader in 2Q17, says Canalys

    Before Going to Press | 12h 1min ago

  • Winbond announces equipment purchases

    Before Going to Press | Aug 22, 20:56

  • Copper foil maker Co-Tech net profits hit record high for 4th consecutive quarter

    Before Going to Press | Aug 22, 20:54

  • LTPS panel makers look to develop more target markets

    Before Going to Press | Aug 22, 20:39

Pause
 | 
View more
Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.