Bits + chips
Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs
Steve Shen, DIGITIMES, Taipei

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20nm Arria 10 FPGA and SoC solutions, according to the two comp...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.