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Chipbond lands orders for driver ICs used in new iPhone and Samsung TFT-LCD panels
Mavis Hong, Taipei; Adam Hwang, DIGITIMES
Driver IC packaging testing service provider Chipbond Technology has obtained orders for COG (chip on glass) chips used in screens for a new version of the iPhone, and 8-inch gold bumping for large-sized TFT-LCD panels produced by Samsung Electronics,...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.