Taiwan-based Winchip Technologies will debut its brand-new DRAM modules, which include high-capacity DDR2 and DDR3 products, low-voltage DDR3 modules and overclocking-orient DDR3 series, at the upcoming Computex Taipei 2010 (June 1-5).
Winchip said it is now extending its Calligraphy-series high-capacity memory kit up to 24GB (4GBx6pcs) of DDR3 1333MHz LO-DIMM and 8GB (4GBx2pcs) dual-channel kit of DDR3 1600MHz for SO-DIMM to fulfill increasing demand for high-density solutions. The series targets research centers, design studios and other data-intensive users.
Winchip will also showcase an eco-friendly series that operates on DDR3 standard 1.35V supply voltage, which is designed for the Intel P55 platforms. In addition, its Robust-series modules overclocked to 2133MHz will be highlighted at the Computex booth (Nangang Hall, I0501).
Founded in 1996, Winchip already has years of OEM/ODM experience in motherboard, VGA card and notebook memory module manufacturing. In 2007, it began marketing DRAM modules - ranging from DDR, DDR2 up to DDR3 for both desktops and notebooks - under the Winchip brand.
Winchip Calligraphy-series DDR2 and DDR3 modules
Photo: Company
