Taipei, Tuesday, September 26, 2017 01:24 (GMT+8)
mostly cloudy
Taipei
29°C
Gigabyte set to launch AMD 6 Core CPU-ready motherboard
Press release, March 2; Ricky Morris, DIGITIMES [Tuesday 2 March 2010]

Gigabyte Technology is is set to launch its latest AMD AM3 Socket GA-890GPA-UD3H motherboard, the first featuring the AMD 890GX chipset paired with the new SB850 southbridge.

In addition to supporting upcoming six-core AMD CPUs and the new ATI Radeon HD 4290 IGP, the Gigabyte GA-890GPA-UD3H offers native support for SATA 6Gbps for up to six devices with the ability to configure RAID 0, 1, 5 and 10 for maximum data performance or enhanced data backup, the company highlighted.

The NEC USB 3.0 controller which is becoming a key value-added feature of Gigabyte's lineup for 2010 appears again offering high-speed data transfer rates for external devices and storage, and 3x USB Power Boost, which allows power-hungry peripherals to be used with a single USB port, without the need for an extra power supply.

The Gigabyte GA-890GPA-UD3H's HD 4290 IGP supports DirectX 10.1 and 128M DDR3 sideport memory, and scores up to 18% higher than the previous generation AMD 790GX chipset in certain benchmarks, according to Gigabyte. In addition, the motherboard includes two PCI Express 2.0 x16 slots, allowing users to run ATI CrossfireX or Hybrid CrossfireX configurations depending on their gaming, productivity and power efficiency needs.

The GA-890GPA-UD3H is expected to launch at CeBIT 2010 which runs from March 2-6.

GA-890GPA-UD3H motherboard

Gigabyte GA-890GPA-UD3H
Photo: Company

Realtime news
  • Sigurd to enter board of Winstek

    Before Going to Press | 3h ago

  • MEMS sensor demand for smartphones, automotive surging

    Before Going to Press | 3h 1min ago

  • Samsung certifies Synopsys design platform for 28nm FD-SOI process

    Before Going to Press | 3h 1min ago

  • Brand device vendors competing in wrist-worn wearables market with new products

    Before Going to Press | 3h 34min ago

  • Taiwan market: Smartphone sales return to growth in September

    Before Going to Press | 3h 40min ago

  • SMIC plans capacity expansions in China

    Before Going to Press | 4h 17min ago

  • Taiwan panel makers optimistic about large-size micro LED displays

    Before Going to Press | 4h 20min ago

  • Samsung ready to mass produce MRAM chips using 28nm FD-SOI process

    Before Going to Press | 4h 22min ago

Pause
 | 
View more
UMC
China AMOLED panel capacity expansion forecast, 2016-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.