Taipei, Thursday, August 24, 2017 04:03 (GMT+8)
thunderstorms
Taipei
35°C
G.Skill announces DDR3 memory at 1.35V
Press release; Jessie Shen, DIGITIMES [Friday 23 October 2009]

G.Skill International Enterprise, a Taiwan-based manufacturer of memory modules and solid state storage (SSD) devices, has released low-voltage DDR3 modules for Intel's Lynnfield Core i5 and Core i7 platforms. The new ECO series operates at 1.35V, compared to standard DDR3 modules at 1.65V.

According to G.Skill's internal lab tests, 1.35V memory modules produce 16% lower temperatures than 1.65V ones.

G.Skill said its new low-voltage modules, clocked at 1333MHz or 1600MHz, are available in 4GB (2GBx2) dual-channel kits.

G.Skill DDR3 modules at 1.35V

G.Skill DDR3 module at 1.35V
Photo: Company

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.