TSMC processes over five million 12-inch wafers based on sub 0.13-micron nodes

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TSMC processes over five million 12-inch wafers based on sub 0.13-micron nodes

Claire Sung, Taipei; Jessie Shen, DIGITIMES

Thursday 2 July 2009

Taiwan Semiconductor Manufacturing Company (TSMC) has cumulatively shipped over five million 12-inch equivalent wafers of chips processed with sub 0.13-micron processes, according to company sources. The pure-play foundry is gearing up for volume production...

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