Taipei, Friday, February 24, 2017 07:34 (GMT+8)
showers
Taipei
17°C
Cooler Master launches passive CPU cooler
Press release, May 9; Joseph Tsai, DIGITIMES [Friday 9 May 2008]

Cooler Master has announced the Hyper Z600, noiseless CPU cooler.

The cooler's X shape design retains rapid heat transfer and creates a lower backpressure, forcing air to pass through quickly, according to the company. Optimized fin spacing along with interlaced fins presents an ideal method to maximizing surface areas.

Cooler Master Hyper Z600 CPU cooler specifications

Item

Detail

Dimension

127.28×127.28×160mm

Material

Aluminum fins with copper-base

Heat Pipe Dimensions

φ6mm×6

Weight

1045g

Source: Company, compiled by Digitimes, May 2008

Cooler Master Hyper Z600 CPU cooler

Cooler Master Hyper Z600 CPU cooler
Photo: Company

Realtime news
  • WPG expects sales to recover starting 2Q17

    Bits + chips | 9h 8min ago

  • VIS expects to post up to 5% revenue decrease in 1Q17

    Bits + chips | 9h 10min ago

  • UMC enters mass production for 14nm chips

    Bits + chips | 9h 11min ago

  • Advantech nets NT$8.96 per share for 2016

    Before Going to Press | 9h 23min ago

  • Digitimes Research: Japan aims at 20% of cars to be self-driving in 2030

    Before Going to Press | 9h 24min ago

  • Acer provides smart health platform to Changhua Christian Hospital

    Before Going to Press | 9h 26min ago

  • SSD and eMMC prices to rise 15% in 2Q17, says DRAMeXchange

    Before Going to Press | 9h 27min ago

  • Oppo, Vivo will struggle to succeed in overseas markets

    Before Going to Press | 9h 28min ago

  • Danen Technology suffers net loss per share of NT$2.10 for 2016

    Before Going to Press | 9h 30min ago

  • CyberLink nets NT$3.15 per share for 2016

    Before Going to Press | 9h 31min ago

  • SunPower to set up PV module joint-venture in China, say reports

    Before Going to Press | 9h 31min ago

  • Fraunhofer ISE reaches 21.9% efficiency for N-type polycrystalline solar cells

    Before Going to Press | 9h 32min ago

  • TSMC on track to move 5nm to risk production in 1H19

    Before Going to Press | 9h 34min ago

  • AMOLED penetration of smartphones estimated at over 27% in 2017

    Before Going to Press | 9h 35min ago

  • Arcadyan Technology posts 2016 net EPS of NT$7.19

    Before Going to Press | 9h 36min ago

  • Silitech Technology suffers net loss per share of NT$0.61 for 2016

    Before Going to Press | 9h 37min ago

  • Kaimei Electronic fails in bid for stake in Ta-I

    Before Going to Press | 9h 37min ago

  • Giantplus Technology to deal out 2016 dividend of NT$0.20

    Before Going to Press | 9h 38min ago

  • TPK Holding to not deal out dividend for 2016

    Before Going to Press | 9h 38min ago

Pause
 | 
View more
Global notebook shipment forecast, 2017 and beyond
Intel strategies in the mobile device market
The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.