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TSMC, PSC and VIS to break ground for 12-inch fabs at HSP in May, paper says

EDN, March 1; Rodney Chan, DIGITIMES Asia Thursday 1 March 2007 0

Hsinchu Science Park (HSP) authorities are set to complete acquisition of land by April for 12-inch fabs to be constructed by Taiwan Semiconductor Manufacturing Company (TSMC), Powerchip Semiconductor Corporation (PSC), and Vanguard International Semiconductor...

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