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Chipbond to build 12,000-wafer capacity for 12-inch solder bumping

Ingrid Lee, Taipei; Rodney Chan, DIGITIMES Asia Tuesday 13 February 2007 0

Chipbond Technology, the biggest gold bumping service provider in Taiwan, has plans to build solder bumping facilities to process 10,000-12,000 12-inch wafers monthly, according to company sources.

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