Bits + chips
Sources claim Samsung to establish BGA substrate plant in Suzhou
Nuking Huang, Taipei; Esther Lam, DIGITIMES

Samsung Electro-Mechanics will start volume shipping ball-grid array (BGA) substrate from a plant in Suzhou starting in mid 2006 for packaging Samsung DDR2 memory, according to industry sources. Local BGA substrate makers are not concerned about Samsung’s...

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