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Infineon and Winbond tie the technological knot

Hans Wu, Taipei; Noah Sauve, DIGITIMES Asia Tuesday 12 March 2002 0

Infineon Technologies and Winbond Electronics on March 11 announced that they have signed a memorandum of understanding whereby Infineon will provide Winbond with 0.11-micron trench technology for DRAM production in 2003. In return, Winbond will guarantee...

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