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Unitive’s solder bumping handicapped by immature downstream substrate and packaging

Carol C.Y. Hsu, Hsinchu; Shih-wei Kao, DIGITIMES Asia Friday 13 April 2001 0

Unitive Semiconductor Taiwan, with technology received from its major shareholder Unitive Electronics Inc. (UEI), was very optimistic when it launched solder bumping services in Taiwan last year. However, the company finally realized that its business...

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