BGA-packaged DRAM modules jumpstart immobilized market

Amber Chiu, Taipei; Noah Sauve, DIGITIMES Asia Wednesday 10 January 2001 0

While the market for personal computers goes through a period of readjustment DRAM packagers are trying to keep buyers interested with new ball-grid array (BGA) packaging, which connects circuits in a way that allows for overclocking, a popular function...

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