Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing.Advanced Packaging 3D Metrology Solutions - Chroma 7980/7981The Chroma 7980/7981 systems feature Chroma's patented BLiSTM technology, purpose-built for nanoscale critical dimension measurement. These systems incorporate application-optimized algorithms and user interfaces to deliver high-speed surface profiling and fast auto-focusing capabilities, along with large-area image stitching. They address key needs in advanced packaging processes such as TSV/VIA, RDL, probe mark inspection, overlay, and sub-micron surface profiling. Additionally, Chroma's inspection and in-situ AOI solutions, like the Chroma 7961, enable real-time defect detection and inline process quality control.AI-Driven Test Platform - Chroma 3680When hardware innovation meets AI-enhanced software, a new era of automated test equipment emerges.The Chroma 3680 platform is purpose-built to meet the demands of modern semiconductor testing, combining high-efficiency algorithms with a modular architecture to redefine flexibility and efficiency in test systems.This platform features a unified and intelligent system architecture that enables real-time, accurate test program conversion—reducing migration time and manpower by over 80%. It addresses key pain points such as poor portability of legacy test programs and time-consuming debugging processes, supporting diverse chip architectures with a concrete and effective solution.Chroma 3680 supports modular expansion to meet increasingly diverse future requirements, and can be equipped with the HDRF2 module for one-click activation of RF testing, greatly simplifying test setup. The overall platform is designed for high scalability and flexibility, enabling fast adaptation across different product lines, application needs, and test scales—streamlining both development and validation processes.Tri-Temp System-Level Test SolutionsChroma's 3100 and 3200 pick-and-place handler solutions, paired with the 31000R/31000K Series Temperature Forcing Systems, deliver a powerful, fully integrated platform to meet the unprecedented challenges of AI-era device testing.The advanced 3110, 3200, 3200-HD, 3210, and 3260 pick-and-place systems feature industry-leading SLT testing solutions, including a high-precision contact force system, CVOT (Chroma Virtual Operation Tools) for intelligent yield optimization, integrated device protection features, and a universal change kit design for fast, flexible device conversion. These systems ensure superior test quality through scalable architecture that integrates seamlessly into both engineering and high-volume production environments.The intelligent 31000R thermal solution provides a wide and stable temperature control range from –40°C to 150°C, with high-power dissipation capability up to 2,900 W. It features advanced thermal performance with direct phase-change cooling, intelligent power monitoring, and high-precision multi-zone control. This makes it ideal for AI, HPC, and thermally demanding automotive applications.SuperSizer Nano-Particle Monitoring SystemsPowered by advanced aerosol particle measurement technology, the SuperSizer system delivers precise monitoring of nano-sized particles ranging from 3 nm to 20 nm, overcoming the limitations of conventional optical systems, especially bubble interference.The SuperSizer II, V, VI, and VII generations have been widely adopted for real-time monitoring of critical wet chemicals such as CMP slurry, isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The latest addition to the series, SuperSizer VIII, is purpose-built for hydrochloric acid monitoring—extending the system's capabilities into more aggressive chemistries.By enabling in-line and real-time particle detection, the SuperSizer platform helps minimize wafer defects, ensure chemical purity, and improve overall process yield.Visit Chroma at SEMICON Taiwan 2025From September 10–12, Chroma ATE will exhibit at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center, Hall 1, 1F (Booth K2876).In addition to showcasing our wide-ranging portfolio of test solutions, Chroma will present at the Semiconductor Advanced Inspection and Metrology Forum. Our presentation "White-Light Interferometry Integration with Electromagnetic Simulation and Digital Light-Field Control for Advanced Packaging" will explore innovative applications of advanced packaging inspection and metrology technologies.Join us at SEMICON Taiwan 2025 and connect with our team to exchange insights on the future of test and innovation.Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing. Chroma ATE Inc.

ADLINK Technology Inc., a global leader in edge computing solutions, introduces the cExpress-R8, a COM Express COM.0 R3.1 Type 6 Compact module powered by AMD Ryzen Embedded 8000 Series processors (8845HS, 8840U, 8645HS, 8640U). Engineered to satisfy the demands of modern smart industrial applications, it delivers an advanced integration of high-performance and energy-efficient design. This module ignites mission-critical AI capabilities, accelerated edge computing, and advanced graphics performance-bringing the confidence that comes with the reliability needed for complex, graphics-intensive workloads.COM Express R3.1 Type 6 Compact Size Module. ADLINKcExpress-R8-B. ADLINKPushing the limits of edge performance, ADLINK's cExpress-R8 combines up to 8 "Zen 4" cores and 16 threads with integrated AMD RDNA 3 graphics and an XDNA NPU, delivering up to 40 TOPS. The cExpress-R8 fuels power-efficient AI inferencing and fast decision-making across machine vision, robotics, medical imaging, infotainment, and intelligent human-machine systems. With XDNA architecture, performance-per-watt efficiency is optimized, delivering advanced AI processing, and enabling more complex AI workloads without a significant spike in energy demands.cExpress-R8-F. ADLINKTo guarantee real-time processing, the cExpress-R8 supports up to 96GB of DDR5 memory at 5600 MT/s, with both ECC and non-ECC options available. ECC acts as a watchdog, detecting and correcting errors in environments where failure isn't an option, whether in mission-critical applications, gaming, transportation, and POS (Point of Sale)/POI (Point of Information) systems.With support for up to four displays, DP, eDP, HDMI, LVDS, and VGA interfaces. VGA and eDP outputs are available as optional features, allowing flexible visual configurations to meet edge computing demands. Combined with scalable performance, power, and graphics configurations, the cExpress-R8 is well-suited for a diverse range of edge applications. With 10-year product availability, it ensures long-term design stability and lifecycle alignment for system integrator roadmaps.Key Features:- AMD Ryzen Embedded 8000 Series Processors- AMD RDNA 3 Graphics and XDNA NPU (up to 40 TOPS performance)- Up to 96GB DDR5 5600 MT/s (ECC/non-ECC)- Four independent display outputsADLINK's cExpress development kits, including reference carriers and full I/O support, will be available in Q4 of 2025 to help you accelerate prototyping and simplify system integration.For more information about ADLINK COMs, visit adlinktech.com and explore the cExpress-R8 module.Summary:- Built on AMD Ryzen Embedded 8000 Series processors for powerhouse performance.Deploy 8-core, 16-thread processing with AMD RDNA 3 graphics for accelerated multitasking and immersive visuals.- Achieve up to 40 TOPS of AI inferencing performance with Zen 4, RDNA 3, and XDNA architectures for enhanced on-device intelligence.- Support up to 96GB DDR5 with ECC for reliable data integrity and system stability.- Enable versatile multi-display configurations (DP, eDP, HDMI, LVDS, VGA), accommodating complex visual setups with convenience.

In the face of global challenges such as traffic congestion, air pollution, and rising oil prices, electric two-wheelers are rapidly becoming an important transportation choice due to their advantages of flexibility, affordability, and zero emissions. To address the urgent market demand for high-performance electronic control systems, Holtek Semiconductor, leveraging its technical expertise accumulated through deep involvement in the consumer electronics sector, has officially launched a full-featured electronic control component solution for electric two-wheelers, enabling customers to achieve rapid product development and mass production.Complete technology ecosystem covering all vehicle electronic control requirementsBased on its independently developed complete technology ecosystem, Holtek deeply integrates technologies such as instrument display, anti-theft security, power control, energy management, and wired/wireless communication to launch an electric two-wheeler electronic control solution, abbreviated as the E-2W solution. This solution covers six core electronic control components: dashboard, RF vehicle alarm, central controller, motor controller, battery management system (BMS), and EV charger, flexibly supporting single-component development and whole-vehicle integration applications.Development efficiency revolution: dual engine drive in the form of evaluation boards + parametric platformHoltek's E-2W solution is equipped with feature-rich evaluation boards and a graphical development platform, allowing developers to quickly enter the functional testing stage by parameter configuration. It is worth noting that this series of evaluation boards supports the popular CAN bus communication, including:1. Intelligent LED dashboard: real-time display of vehicle data and operating status2. Hopping code alarm: RF remote control, supports abnormal vibration detection, and sound and light alarms3. 4G/Bluetooth central controller: multi-mode positioning, remote vehicle condition management, and OTA upgrades4. 250W motor controller: 3-shunt sensor FOC algorithm and multiple protection mechanisms5. 350W charger: precise control of battery charging curve and multiple safety protections6. 16S battery management system (BMS): battery power estimation and multiple protection mechanismsEnabling Green Transformation of the IndustryHoltek will collaborate with industry chain partners to accelerate technological innovation in electric mobility by providing vertical support from core chips to system solutions. Holtek will also continue to invest in R&D resources to deepen its technological footprint in the green transportation sector.Holtek wishes to announce its participation in Electronica India 2025, which will take place in Bangalore from 17th to 19th, September. At the exhibition visitors can see Holtek's E-2W development platform and the electronic control evaluation boards suitable for low-speed e-scooters. We welcome interested partners to visit the site to learn more information. For further details on our solution, please contact Holtek's sales or agencies.Holtek E-2W Solution for Green Travel. Holtek

TerraONE Tech Co., Ltd., a company specializing in modern IT solutions, has announced a strategic partnership with Wasabi Technologies, a leading cloud storage company, becoming the authorized distributor for Wasabi Technologies in the Taiwan market. With the partnership, Taiwanese businesses can enhance their data management and redundancy services with high-performance, secure, and cost-effective cloud object storage.Credit: TerraONEWasabi is one of the technology industry's fastest-growing companies. Wasabi Hot Cloud Storage is a predictable, affordable cloud object storage service. Compared to traditional storage solutions, Wasabi eliminates fees for egress and API usage and provides 99.9999999999% (11 nines) data durability and robust enterprise-grade security. Wasabi Hot Cloud Storage is widely adopted by tens of thousands of businesses and MSPs worldwide.Kevin Chen, General Manager of TerraOne Technology, said, "Amid digital transformation and IT modernization, many businesses are increasingly demanding highly flexible and scalable cloud storage. Wasabi Technologies' services offer significant advantages in performance, price, and security, making them ideal for storage, backup, redundancy, video surveillance, big data analytics, and other application scenarios across various industries. By partnering with Wasabi, we can provide our customers with more professional technical support, integration services, and customized solutions, helping businesses seamlessly transition to cloud platforms.""TerraONE has extensive experience in enterprise IT deployments and a broad distribution network in the Taiwanese market, making them a key partner in our efforts to expand our distribution network in Taiwan," said Raymond Koh, Country Manager, ASEAN, Wasabi Technologies. "We look forward to working together to accelerate the adoption and innovative applications of enterprise cloud storage."TerraOne Technology will host a Wasabi partner product launch event on 9th September 2025. Interested distributors are welcome to contact TerraOne. Alternatively, click here to stay up-to-date on TerraOne Technology events.For more information, please visit.

In the past decades, the memory industry has been one of the most volatile sectors in semiconductors, marked by price fluctuations, supply-demand imbalances, and rapid capacity shifts. Yet as we step into 2025, the rise of AI, massive data processing, and edge intelligence is propelling memory from a "cycle-driven" market into a new stage of "structural growth."The global memory market is moving beyond sheer "capacity expansion" toward "breakthroughs in performance, energy efficiency, and system-level integration". Rapid advances in DRAM and NAND, coupled with the accelerated adoption of new packaging, protocols, and architectures, are propelling the memory ecosystem into a new phase of robust and sustainable development.According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market reached USD 346 billion in H1 2025, up 18.9% year-over-year, with the memory segment growing by 20%. Multiple institutions forecast that memory product prices will continue to rise in the third quarter of 2025, particularly in high-value segments such as enterprise SSDs and high-speed DRAM. This wave of AI-driven structural demand is becoming the starting point of a new growth cycle for the memory industry.GMIF2025: Shaping the Future of Memory in the AI EraIn this paradigm-shifting moment, the industry needs a collaborative hub to connect upstream and downstream players, bridge technology with markets, and bring together key forces across the global memory ecosystem to explore trends, align resources, and foster partnerships.The 4th Global Memory Innovation Forum (GMIF2025 Innovation Summit) will be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel.Co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., GMIF2025 will focus on the theme "AI Applications, Innovation Empowered" to discuss memory breakthroughs and ecosystem collaboration under the momentum of AI.Four Core Themes:01 Trends and Roadmaps of Storage and Memory Technologies: From CXL and Chiplet to near-memory computing, new architectures are transforming memory from isolated optimization to system-level synergy.02 AI Applications & Deployment Practices: Deep dives into emerging memory innovations driven by AI servers, AI smartphones, AI PCs, and intelligent vehicles.03 Industry Collaboration Across the Value Chain: Uniting IDM manufacturers, controller providers, solution vendors, packaging & testing suppliers, material and equipment companies to build dual engines of technology and market growth.04 Global Ecosystem & New Industry Dynamics: Exploring new pathways to reshape supply chains, jointly build standards, and establish a paradigm for cross-border collaboration in the post-globalization era.Summit Highlights. Credit: GMIFGMIF2024 Data Insights. Credit: GMIFAn Industry Gathering Not to Be MissedGMIF is more than just a technology summit; it is a global high-end platform that combines dialogue, showcase, partnership, and influence:For enterprises: it's a premier stage to showcase technological achievements and expand upstream & downstream collaborations.For industry professionals: it's a vital arena to grasp trends, access resources, and discover opportunities.For investors: it's a unique vantage point to anticipate turning points and uncover industry value.For media & academia: it's a core hub for first-hand insights and shaping industry discourse.We sincerely invite you to join us this September in Shenzhen Bay, where global industry leaders will gather to discuss memory innovation in the AI era, witness a new stage of collaboration, and co-create the future of the memory ecosystem.Click the link to secure a seat.An Industry Gathering Not to Be Missed. Credit: GMIFFor more information about GMIF, please visit.

Lotus Microsystems ApS, a power management solutions company, and EDOM Technology, one of the Top 10 Global Distributors, jointly announced the signing of a strategic distribution agreement for the Asia-Pacific region.This collaboration combines Lotus Microsystems’ innovative power management solutions with EDOM Technology’s extensive distribution network, strong field application engineering (FAE) force, and deep market expertise. The partnership is designed to accelerate customer adoption, deliver superior technical support, and strengthen the presence of both companies across the fast-growing APAC markets.Power and thermal management are crucial aspects of electronic design, especially in the rapidly developing computing, networking, and IoT markets. Effective thermal management ensures that devices operate within a safe temperature range, optimizing performance and extending their operational life. Lotus Microsystems’ work on high-efficiency power modules supports more sustainable computing by reducing energy losses and improving overall power usage effectiveness.“This partnership with Lotus Microsystems allows us to bring differentiated and forward-looking solutions to our customers in the APAC region. We see great potential in Lotus Microsystems’ technology and are confident it will contribute to the success of our ecosystem.”— Jeffrey Yu [CEO of EDOM Technology]“We are delighted to partner with EDOM Technology, a recognized leader in distribution across Asia. This agreement marks an important step in our global expansion, enabling Lotus Microsystems to better serve customers in key APAC markets with the strong support and capabilities that EDOM provides.”— Hans Hasselby-Andersen [CEO of Lotus Microsystems]

Tescan Group proudly introduces its new global brand platform The Art of Discovery at this year's Microscopy Conference (MC) in Karlsruhe, Germany. Built on the belief that beauty lies in what is yet to be discovered, it reflects Tescan's ambition to be a trusted growth partner in science. Following its global introduction at MC 2025, the brand platform will make its Asia-Pacific debut at SEMICON Taiwan (September 8–12, 2025).This rebrand signals a pivotal step in Tescan' s shift toward a more integrated model — combining advanced technology, workflow-focused solutions, expert support, and a community built on shared knowledge. This represents Tescan's broader focus on delivering customer-centric solutions rather than simply providing technology.New Aspiration, Approach and Drivers"Our brand transformation captures who we are today — a company built on strong partnerships, driven by results, fueled by innovation, and committed to delivering purposeful solutions that put users first," says Sirine Assaf, Chief Revenue Officer at Tescan. Guided by its core principles, Tescan sets a clear ambition: to empower customers and partners with tools, software, and services built for what's next. At the heart of this transformation is a simple idea — removing the barriers between a question and its discovery. "This transformation isn't just about technology. It reflects a continuous evolution in how we think, how we work together, and how we enable the scientific community with timely solutions to fasten their discoveries," says Assaf.Automation and InnovationBuilding on last year's successful introduction of multiple new instruments (including the plasma FIB-SEM Amber X 2) — Tescan continues its innovation journey across the entire portfolio. This year, the company's primary focus is on enhancing automation throughout all its products, aiming to streamline scientists' workflows at a time when speed and accuracy are more important than ever. Alongside its new brand platform, Tescan is also unveiling two new software solutions: AutoSection and TEM AutoPrep PRO – Inverted & Planar Lamella Automation. "Our primary goal in this area is to reduce the time from instrument purchase to when users can fully leverage its capabilities. We accomplish this through intelligent automation, deep application expertise, and close collaboration with our customers," closes Bruno Janssens, Chief Strategy Officer at Tescan.CEO PerspectiveJean-Charles Chen, CEO of Tescan Group, commented: "This is much more than a cosmetic redesign. It's a strategic repositioning that reflects the way we see how science is evolving, and how Tescan is evolving with it. We're aligning with a new era of scientific discovery by enabling better-integrated workflows, faster time from question to insight, and a tighter connection between our technology and our users' needs. It's a shift from being a product-oriented company to becoming a solutions partner. This means more automation, smarter software, and a mindset rooted in customer outcomes. The new look is simply a reflection of that deeper change.”APAC RolloutFollowing an exclusive offline preview at the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) in early August, Tescan will make the APAC debut of its new brand at SEMICON Taiwan (September 8–12, 2025). As part of the Semiconductor Advanced Inspection and Metrology Forum, Hervé Macé, Global Business Development Director for Semiconductors, will speak on September 12 on Development of New Workflows to Address Metrology and Failure Analysis Challenges at Macroscale, Microscale and Nanoscale.Venue: 701F, 7F, Taipei Nangang Exhibition Center Hall 2. 

With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has intensified, driving advanced packaging technologies toward higher density and lower latency. Heterogeneous integration architectures such as CoWoS, CoPoS, and HBM are accelerating in adoption, while Thermo-Compression Bonding (TCB) has emerged as a critical process technology thanks to its advantages of low thermal stress and high bonding strength.Global equipment leaders including BESI, ASMPT, Kulicke & Soffa, Hanmi, and Shibaura are actively investing in TCB, underscoring its growing strategic importance.In response to this market momentum, Taiwan-based precision equipment manufacturer Micraft System Plus Co., Ltd. (MSP＋) has officially announced the launch of its first self-developed TCB bonder, which will make its public debut at SEMI Taiwan 2025. Purpose-built for heterogeneous integration applications, the system integrates Micraft’s years of expertise in precision automation and features localized heating, programmable temperature control, pressure sensing, platform leveling, and micron-level alignment—marking a new milestone for Taiwan’s equipment industry in advanced semiconductor processes.According to Micraft, the system employs multiple independently controlled heating modules, enabling rapid localized heating and cooling to minimize the thermal-affected zone and reduce warpage risk. Leveraging its extensive wafer bonder experience with optical semiconductor customers, the company has incorporated pressure sensing and leveling technologies that dynamically adjust bonding pressure and thermal profiles. This ensures uniform bonding quality and high yield, particularly for fine-pitch, low thermal stress, high-precision, and high-throughput packaging requirements.The bonder is further equipped with advanced optical alignment modules from Carl Zeiss, combined with Micraft’s proprietary optical system and cutting-edge vision algorithms. This enables alignment accuracy of better than 1 μm. In addition, the system offers high process flexibility, supporting a wide range of materials and carrier formats to meet diverse requirements of OSATs and IDMs.Micraft has long been a pioneer in the MicroLED equipment market, with its laser mass transfer and repair platforms already adopted and mass-produced by Taiwan’s two leading panel makers. By extending its expertise into advanced packaging, Micraft leverages its core strengths in precision motion control, optical integration, and thermal processing. Several leading domestic and international semiconductor customers have already initiated tool qualification programs.Looking ahead, Micraft plans to continue developing next-generation wafer-level bonding equipment, including Hybrid Bonding and Co-Packaged Optics (CPO), to address the rising demands of 3D IC and chiplet architectures. Through these efforts, Micraft aims to strengthen Taiwan’s role in the global advanced packaging supply chain and further advance the localization and globalization of Taiwan’s precision equipment technologies.Micraft System Plus warmly invites industry partners to visit its booth at SEMI Taiwan 2025 to explore collaborative opportunities and witness the next generation of bonding solutions.

SK hynix Inc. announced today that it has assembled the industry's first High NA EUV lithography system for mass production at the M16 fabrication plant in Icheon, South Korea.At an event to commemorate the assembly of the system, SK hynix's Head of R&D Cha Seon Yong, Head of Manufacturing Technology Lee Byoungki and ASML's Head of Customer Team SK hynix-Japan Kim Byeong-Chan celebrated the introduction of the equipment to produce next-generation DRAM.The move lays the foundation for a swift development and supply of the cutting-edge products that meet customer demand amid intense competition of the global semiconductor industry. SK hynix aims to enhance credibility and stability of the global supply chain through close collaboration with business partners.A sophisticated process technology to scale memory cells is critical to advance productivity and product performance. A more sophisticated pattern leads to an increase in the number of chips produced from a wafer and an improvement in power efficiency and performance.SK hynix has been expanding the scope of EUV adoption for production of the most advanced DRAM since the first introduction of the technology in 2021 for the 1anm, the fourth generation of the 10nm tech. The assembly of the next-generation technology system that outperforms the existing EUV equipment comes amid the company's efforts to prepare for the industry's requirement for extreme scaling and high density.The TWINSCAN EXE:5200B, the first model for volume production of ASML's High NA EUV product line, enables printing of transistors 1.7 times smaller and achievement of transistor densities 2.9 times higher, compared with the existing EUV system, with a 40% improvement in the NA to 0.55 from 0.33.With the adoption of the new system, SK hynix plans to simplify the existing EUV process and accelerate the development of the next-generation memory to advance product performance and cost competitiveness. The company also aims to enhance its position in the high-value memory product market and make its technological leadership stronger.“High NA EUV is a critical technology that opens the next chapter of the semiconductor industry,” said Kim at ASML. “ASML will closely collaborate with SK hynix to bring forward the innovation of the next-generation memory.”“We expect the addition of the critical infrastructure to bring our technological vision we have been pursuing into reality,” said Cha at SK hynix. “We aim to enhance our leadership in the AI memory space with the cutting-edge technology required by the fast-growing AI and next-generation computing markets.”

Cypress Technology (CYP) has introduced its latest 4K60 4:4:4 Seamless Matrix with USB 3.2 Docking, designed to meet the demands of real-time video transmission, remote control, and multi-source display management. The device integrates high-resolution video processing, scaling, multi-window display, and USB mouse control, providing a plug and play, intuitive, and flexible solution for professional environments. It is particularly suited for emergency operation centers, surveillance rooms, conference rooms, and multi-source display scenarios such as seminars and educational spaces.Flexible Multi-Window Display with Seamless switchingThe seamless switching matrix supports four input sources (two HDMI and two USB-C) and offers flexible viewing options including single full-screen, quad-view, picture in picture (PiP), and picture on picture (PoP) modes, outputting to two HDMI displays. The seamless switching technology ensures instant video transmission without delays or black screens in both matrix and multi-window modes, maintaining stable and continuous visuals for mission-critical decision-making or uninterrupted presentations.Intuitive Window Layout Control and Multiple Management OptionsUsers can resize windows and adjust window position directly with a mouse, or control the system via front panel buttons, on-screen display (OSD), Telnet, or RS-232. The system allows storing multiple custom window layouts for quick recall and uses highlighted borders to identify the active window, streamlining operations and improving workflow efficiency.Integrated USB Docking for Collaboration and Device ManagementWith a built-in USB docking function, the device supports keyboard and mouse control across multiple windows and also connects to USB cameras and storage devices. This eliminates the need for an external USB docking station, enabling streamlined video display and data access. It is ideal for control centers, command operations, and multi-tasking collaborative meetings, providing a simple, flexible, and real-time operating experience.High-Quality AV Performance with Broad CompatibilitySupporting resolutions up to 4K60Hz 4:4:4, the device is fully compliant with HDCP 1.x and HDCP 2.2 standards, ensuring secure, high-quality AV transmission. Audio support includes 2-channel LPCM, Dolby Digital, DTS 5.1 channel pass-through output, with the ability to independently select audio sources or switch via USB control, meeting the needs of modern conference and multimedia integration.High-Efficiency USB-C Input with Power DeliveryThe two USB Type-C ports support USB 3.2 Gen 1 with DisplayPort Alt Mode, delivering up to 45W and 30W of power. This allows laptops, tablets, and mobile devices stay powered while in use, enabling users to focus on meetings and video monitoring with improved efficiency.As the demand for synchronized video, remote control, and multi-source integration continues to grow in control rooms and multifunctional meeting spaces. CYP’s 4K60 4:4:4 Seamless Matrix with USB 3.2 Docking stands as a vital core device for next-generation smart collaboration environments. With its flexible multi-window layout, intuitive USB control interface, and support for high-resolution visuals. CYP once again demonstrates its R&D expertise and depth of application in the professional AV industry, providing users with reliable, easy-to-deploy, and highly adaptable video integration solutions. Click here for more product information.4K60 444 Seamless Matrix with USB3.2 Docking in Control Room. CYP