Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology. The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.

Mecal High-Tech Systems is an independent global high end contracting engineering company that specializes in anti-vibration and shielding technologies for high-precision semiconductor equipment and optical measurement systems. Mecal is in control of critical conditions, in and around high end equipment, co-developing with customers and with its own IP and OEM product base. Take the well-known Extreme Ultraviolet (EUV) lithography technology as an example. Since EUV equipment uses highly precise optical lithography technology with accuracy reaching the nanometer level. These high sophisticated machines are generally extremely sensitive to vibration, need to have corresponding solutions.A complete anti-vibration system must be designed to meet the standard operation of EUV machines and achieve high production yields. Therefore, any semiconductor foundry service vendors who purchases EUV equipment becomes an important target customer for Mecal. The company provides solutions including problem analysis, consulting, engineering design, technology R&D, installation deployment and operation services. It integrates cutting-edge technologies to develop engineering solutions and create optimal economic value for customers, such as improving production yields to generate significant revenue incomes. It also enables even more sophisticated production of next generation technologiesMecal currently provides a vibration-proof platform and technology designed for EUV process needs. Every aspect of design and installation requires detailed planning by the engineering teams of the company. Mecal has more than 170 five-star ranking senior professional engineers certified by customers and works in Taiwan from established service bases in countries including the Netherlands, the United States, South Korea, and Japan.Mecal implements successful approach involving to foster strong communication, a deep technical understanding of semiconductor manufacturing, and a collaborative strategy to diagnose and solve these root problems by being located near where customers stay. For example, with major Taiwanese foundry customers, Mecal not only provides the solutions to solve key challenges of EUV operation, but also team-up with customers to transfer technology to different regions within their global footprint where EUV technology is deployed, thereby creating mutually beneficial business opportunities.The main purpose of Mecal in participating in Netherlands Pavilion is to expand its visibility in the Taiwanese market. The company believes that Taiwanese semiconductor ecosystems can increase the development speed and improve production yields and solve problems caused by vibration in process equipment through Mecal solutions.As semiconductor chips become smaller and more sophisticated, the technical challenges of anti-vibration are also increasing. With 35 years of accumulated industry experience and technical capabilities, Mecal plays the role of co-developer and problem solver in high-precision production, optoelectronic systems, advanced packaging systems and new projects that aims to be of relevance and to contribute to innovation that tackles major challenges in industries. Mecal is looking forward to finding appropriate partners and customers to create high economic value for high-tech industries.

SCIL Nanoimprint Solutions is a provider of nanoscale imprinting equipment for patterning wafers leveraging its unique technology of Substrate Conformal Imprint Lithography (SCIL). The company is targeting the creation of optical structures on wafers for emerging applications in silicon photonics modules and smart glasses. Active in the market since 2015, SCIL Nanoimprint Solutions, originally a business unit of Philips, utilizes patented stamp transfer technology to create process equipment and processes for creating specialized optical structures on wafers. For example, it can create lightguide structures on wafers to enable direct chip-to-fiber connections, driving the fabrication of high-speed optical communication structures.Following the internal installation and testing of the first AutoSCIL tool in 2016, the company officially began mass production and delivered equipment to customers from 2017 onwards. In 2023, with investment from venture capital funds and other investors, the company was officially spun out from Philips to become an independent operating company. The company is targeting applications in optical communication semiconductors, including high-speed optical communication chips for data centers, advanced packaging silicon photonics systems, and ultra-compact optical elements for smart glasses and augmented reality devices. The product portfolio spans advanced imprint equipment, tailored optical materials, and optimized processes. As these are all key areas of focus for the next phase of AI-related applications, the company is attracting significant industry attention.These nanostructures and precision structures utilize processes such as imprinting precise patterns onto wafers using glass materials, serving as light-guiding structures for fiber-optic communication systems. Furthermore, some are manufactured as lens modules, imprinting optical components onto wafers. The existing equipment can achieve optical structures with critical dimensions down to 10 nanometersand sub-nanometer surface roughness.The company's process equipment is differentiated by wafer size, supporting 4-inch, 6-inch, 8-inch, and 12-inch sizes. The process includes resist deposition, overlay alignment, nano-imprinting, , and curing to complete the 2D or 3D patterning process. Targeting two key and highly anticipated applications, smart glasses and CPO (co-packaged optics), Taiwan is a high potential market for SCIL Nanoimprint Solutions, with the Taiwanese semiconductor industry focused on optoelectronic chips, high-speed communications, and advanced heterogeneous packaging technologies.

Tempress is a leading manufacturer of diffusion and thin film deposition equipment, with over 55 years of experience in thermal process technology. We support innovators in semiconductors, power, MEMS, photonics, memory, life sciences, and coating industries in producing high-value materials and devices. Our production systems are built for R&D applications but also for  automated, high-volume production and meet the rigorous standards of modern chip manufacturing. Tempress solutions cover essential thermal processes such as oxidation, annealing, diffusion, and LPCVD, offering precise temperature control to achieve optimal properties in silicon wafers.Tempress established an early presence in Taiwan (1999), earning recognition across the region's semiconductor sector. Our local experts ensure smooth coordination between customers and our product team in the Netherlands, providing hands-on support and technical guidance.We collaborate globally with universities and research institutes to drive innovation and continuously improve our technology. At Tempress, we deliver more than equipment-we build lasting partnerships backed by dependable service and worldwide support.

Xinyx IC Design B.V. is a 100% Filipino owned IC Design house and has been in operations since 2009, with more than a decade of experience in the field of integrated circuit design, giving its clients scalability and access to highly qualified Filipino engineers. Xinyx provides end-to-end semiconductor design solutions, spanning front-end architecture, circuit realization, and physical implementation for analog, digital, and mixed-signal domains.Xinyx offers comprehensive IC design services customized to meet each customer's unique requirements. The company's capabilities span digital, analog, and mixed-signal design and layout, enabling it to support projects across a wide range of applications and technologies. Xinyx provides flexible engagement models, from full turnkey solutions to project-based and specialized design services, allowing clients to leverage its expertise at any stage of the design process to achieve faster turnaround times and optimized results. With over 16 years of experience, Xinyx has grown from a 15-person team into a 400-strong engineering and service organization, operating across five sites in the Philippines and one in Eindhoven, the Netherlands. Built on the strength of its large pool of talented young Filipino engineers, the company helps customers bring innovative silicon solutions to market. As Xinyx continues to expand its global footprint, it is optimistic about the booming Taiwanese semiconductor industry and is eager to collaborate with Taiwanese IC design firms to broaden its reach and explore mutually beneficial opportunities.As part of its commitment to developing the IC design ecosystem, Xinyx actively drives its flagship Campus Connect Program, which focuses on nurturing IC design talent at the university level. The program bridges industry and academia by providing a pathway for Filipino students to enter the IC design field through collaborative learning opportunities, internships, and training programs. In line with this vision, Xinyx continues to explore strategic partnerships with universities abroad, including recent engagements with Chung Yuan Christian University in Zhongli District, Taoyuan City, Taiwan.

HITEC Power Protection develops, manufactures, and provides dynamic uninterruptible power (UPS) solutions to support the most vital of manufacturing and business critical applications. Founded in 1956, its products are widely used in industries with high power reliability requirements, such as semiconductor fabs, banking, aviation, healthcare, and government defense, to ensure that critical missions and processes receive uninterrupted and stable power supply. HITEC Power Protection provides equipment to ensure safe, reliable, and adjustable power to support the operational needs of businesses and critical government facilities. Taking ESG and sustainability into consideration, HITEC Power Protection provides customers with solutions to meet the demanding and complex operational needs of the high-tech industries by providing immediate, reliable backup power and voltage regulation during outages.The company has accumulated over 60 years of experience in industries requiring high power stability, primarily using flywheel energy storage technology. This technology stores energy in a mechanical flywheel to ensure immediate emergency response and stable power supply in the event of power anomalies. Once an emergency power outage is detected, the flywheel energy storage system will be activated to deliver stored instantly, and within 5 seconds transfers smoothly to an integrated diesel generator to provide long term emergency power. HITEC Power Protection was introduced to the Taiwanese market in 1985 and has successfully installed over 200 units. Its customers primarily include well-known semiconductor manufacturing fabs and the display panel makers. As Taiwan's industrial demand for power stability continues to rise, the business opportunities of HITEC Power Protection continue to grow.The current product line provides a continuous power generation capacity of approximately 2,880 kW at 60 Hz per unit. And the features include power safety and protection functions, such harmonic filtration, surge protection, load stabilization, and short-circuit current protection, which outperform typical static UPS systems. HITEC Power Protection provides 100% emergency power to all manufacturing and supporting equipment, implementing precise UPS capacity design to ensure a stable power supply to customer's power loads. This not only reduces unstable power risks but also overall lowers installation and ongoing maintenance costs. After engaging the market with Taiwanese industrial clients, HITEC Power Protection is now further targeting the needs of reliable backup power systems for major government critical public facilities, such as disaster prevention and instant response systems for critical infrastructure like tunnels and airports, with the ultimate goals of improving public service quality, bolstering private sector disaster preparedness, and significantly enhancing the overall resilience of Taiwanese society.

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive manufacturing technology that allows for parallel transfers high-resolution conductive patterns to enable the rapid and precise printing of micrometer scale interconnections. This technology offers high-speed low-cost manufacturing, is well suited for process equipment to create complex 3D structures and achieve further miniaturization of electronic devices. The rapidly growing opportunities in AI-driven electronics push the technology forward. These unique solutions have considerable potential, and on May 16, 2025, Fonontech received the good news of a $9.5 million seed round investment.Currently, Fonontech equipment is being used to address wire bonding speed issues in chip packaging. Wire bonding is a viable solution for connecting chips to external pins or for silicon interlayer structures in advanced packaging. This process is typically used in back-end chip manufacturing, particularly flip-chip bonding. Fonontech equipment offers higher pin density, optimized electrical performance, and smaller package sizes.While conventional wire bonders can only print one line at a time, Fonontech Impulse Printing technology is much faster. Because its parallel printing solution can transfer contacts covering an entire area at a time, the speed increase is astonishing. According to on-site testing and monitoring, Fonontech Impulse Printing technology can achieve speeds up to 100 times faster than wire bonders.Currently, Fonontech equipment can successfully bonding with a minimum size of 20 micrometers, and in the future it will further achieve a dimensional accuracy down to a few micrometers. In the booth of Fonontech showcased the Impulse Printing demo kit, a scaled down version of the industrial equipment. In addition to selling the equipment itself, the company also integrates Impulse Printing print head modules into customers' production lines for special tailored applications.The equipment can be used for transfer printing onto wafers, PCBs, or other manufacturing processes, such as connecting signal pins on the side of a display chip to the signal contacts on the back side of the display panel. The bestselling point of this equipment is speed and cost effectiveness to reduce material waste and carbon emissions. The company's product is marketed as a replacement for wire bonding machines. Furthermore, the company currently is developing Taiwan market and running ongoing collaborative projects through testing and verification with potential clients.

Fastmicro B.V. is a manufacturer of surface particle defect detection systems and equipment established over 15 years ago. The main product lines include sample surface particle defect scanning, particle deposition measurement instruments, and particle defect detection systems for applications such as compound semiconductor wafers, glass wafers, masks, and EUV/DUV mask pellicles.The ranging product offerings of Fastmicro include analytics software to cover a wide variety of applications and processes, in-line defect inspection systems, transportable scanners and scanning module for system integration. The company's technology can detect particles down to 100 nanometers in size. It offers various operation modes, with inspection speeds up to 400 wafers per hour, and can provide inspection reports in ISO standards or PDF format.Fastmicro was initially established through a collaboration with the Netherlands Organization for Applied Scientific Research (TNO) to develop and research surface particle detection technology. Because the cleanliness level within semiconductor front-end processing plants and cleanrooms is crucial to the stability and yield of advanced semiconductor manufacturing, detecting tiny particles significantly impacts their operational needs. Today, tiny particles have a wide variety of composition, Fastmicro equipment plays a proactive role.Because the company's equipment has the advantage of fast detection speed, it usually only takes about ten seconds to complete surface particle defect detection, which has been well recognized by customers. The standard equipment is roughly the size of a household microwave oven. The operative procedures start to use swab or sampling tool to collect a sample from the surface of an object, which is then placed into the detector to read the particle count. Fastmicro adheres to NIST standards and uses PSL (Polystyrene latex) material for calibration and particle measurement. They also provide an OEM design model, providing flexible integration scanning modules to precision semiconductor equipment customers, covering wide-area scanning and diverse testing needs.The company began expanding its international business in 2022. At Semicon Taiwan 2025, in addition to engaging with Taiwan major foundry clients, the company is also entering the semiconductor equipment manufacturing supply chains. During equipment assembly, it is necessary to first confirm that the parts and components meet the product cleanliness level requirements before entering assembly. Each manufacturing link of supply chain requires confirmation that particle defect detection meets standard requirements, so Fastmicro equipment present strong business opportunities. This is currently the company's main market opportunity for expansion in Taiwan.

Brainport Industries Campus (BIC) is a development project for an industrial park in Eindhoven, the Netherlands. Phase one (BIC 1) has been completed, encompassing 105,000 square meters of existing buildings, surrounding public space, and parking. The site is home to several high-tech manufacturing companies and educational institutions. Expansion plans are currently underway, with the newly expanded BIC 2 campus expected to double the size of BIC 1, reaching 300,000 square meters. More than 40 pioneering companies are already established on the campus. BIC is the largest campus expansion in the Netherlands for years to come. Notably, ASML, the Dutch EUV lithography equipment giant, is considering expanding to the northern part of the BIC 2 campus. In 2024, ASML announced plans to establish a subsidiary in the BIC Industrial Park by 2030, accommodating thousands of employees. The Brainport Industries Campus development company stated that it aims to provide startup facilities, co-innovation spaces and built to suit manufacturing space for high-tech companies.In partnership with Invest Holland and the Brabant Development Agency (BOM), the park will offer Taiwanese companies the option of establishing regional business units or research centers in the Netherlands through support services provided by the industrial park.The campus aims to attract leading companies in cutting-edge technology fields, including semiconductor related technologies, photonics, quantum and additive manufacturing. BIC and Invest Holland jointly unveiled this plan at Semicon Taiwan 2025, offering the access to advanced facilities, a strong open innovation ecosystems and encouraging Taiwan's high-tech industries participating in this collaboration opportunity.

As businesses face dramatic changes in the global market environment, companies worldwide are accelerating their digital transformation efforts, seeking competitive advantages through innovative technologies. Yet, while many departments have embraced automation, legal teams often remain the slowest to digitalize. Manual contract review still dominates daily operations, with a single document taking one to two weeks to pass from sales to legal approval.Such delays not only disrupt decision-making but also affect overall business performance. Addressing this long-standing challenge, LegalSign.ai has launched an end-to-end generative AI legal workflow management platform that accelerates contract and document review with precision and transparency, fundamentally redefining corporate legal operations.According to Chih-Tung Chen, CEO of LegalSign.ai, lengthy manual reviews often force companies to ship products before contracts are finalized - taking on significant legal risk just to maintain business momentum. To tackle these inefficiencies, LegalSign.ai's cross-disciplinary team of legal and AI experts has created a one-stop generative AI legal workflow platform that resolves these long-ignored bottlenecks. The solution is already trusted by leading enterprises such as Acer, CTBC Bank, Cathay Financial Holdings, and ezTravel, proving its value across industries.Integrating legal expertise and generative AI to address three core challengesFounded in 2019 by experienced lawyers and patent attorneys with over 25 years of combined practice, LegalSign.ai operates across Taiwan, the United States, and China. The company's founding mission is to ensure that "legal work is no longer an island buried in paperwork." By combining deep legal expertise with generative AI, LegalSign.ai transforms legal operations into a streamlined, digital, and automated process, helping enterprises manage contracts and risks more efficiently and intelligently.LegalSign.ai's all-in-one platform addresses three major pain points for legal departments - workflow management, compliance auditing, and risk control. Through generative AI, the platform digitalizes the entire contract lifecycle, covering drafting, review, negotiation, signing, execution, archiving, retrieval, and risk management. This comprehensive approach enables enterprises to significantly improve productivity while cutting costs and mitigating legal exposure.Chen explained that the platform integrates three core capabilities: generative AI-powered compliance management, legal workflow lifecycle management, and electronic signature services. For instance, the AI assistant draws on a library of over 400 contract templates to generate legally sound drafts, minimizing hallucinations or logic errors. It can also translate and compare documents, automatically highlighting high-risk clauses to assist in compliance monitoring.Building trustworthy legal AI services on AWSFollowing its recognition with the AWS Generative AI Rising Star Award in 2024, LegalSign.ai joined the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) program in 2025 to further expand its visibility and pursue new business collaborations. The company is implementing Amazon Elastic Compute Cloud (Amazon EC2) to leverage cloud GPUs for enhanced AI computation and inference efficiency, aiming to deliver trusted, enterprise-grade legal AI cloud services globally through AWS cloud infrastructure.Chen emphasized that legal AI differs from typical generative AI applications due to its high data sensitivity and territorial restrictions. Given ongoing data security and regulatory concerns in China, Taiwan has emerged as a trusted hub for legal AI solutions serving international enterprises. Leveraging AWS's global cloud infrastructure, LegalSign.ai is executing a "Chinese-language legal AI + AWS Cloud" strategy to bring Taiwan's legal technology to the world. The company's initial overseas expansion targets Japan and the United States, with current collaboration focused on a bilingual legal AI platform serving multinational corporations.