Taipei, Friday, November 24, 2017 11:30 (GMT+8)
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Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

The text is available free of charge for three days after publish date; older interviews require membership.

Please contact us if you're interested in arranging an interview.

  • Focused on embedded flash: Q&A with Spansion EVP Glenda Dorchak

    Monday 11 March 2013

    Spansion recently announced a joint development with United Microelectronics (UMC) to integrate its proprietary embedded charge trap (eCT) flash memory technology with the foundry's 40nm low power (LP) process. This provides...

  • Spansion gearing up for SLC NAND

    Friday 1 June 2012

    Spansion has started sampling the company's first single-level cell (SLC) NAND flash memory, built using SK Hynix' 4Xnm process technology, and packaged and tested by Spansion itself. The announcement arrives a couple of...

Realtime news
  • China Big Fund planning second round of support for local IC sector

    Bits + chips | 6min ago

  • WirForce 2017: Gaming product vendors to unveil innovations

    IT + CE | 13min ago

  • Lenovo assigns new head for Taiwan office

    IT + CE | 44min ago

  • Global mobile DRAM revenues to surge in 4Q17, says DRAMeXchange

    Bits + chips | 49min ago

  • Taiwan market: Huawei launches Mate 10 series smartphones

    Mobile + telecom | 53min ago

  • Dell may become largest server vendor, says executive

    Before Going to Press | Nov 23, 22:05

  • Taiwan market: Huawei to become 7th or 8th largest smartphone vendor in 2018

    Before Going to Press | Nov 23, 21:53

  • BOE 10.5G LCD panel plant to come online in December

    Before Going to Press | Nov 23, 21:36

  • Taiwan IC design firms November revenues to grow slightly

    Before Going to Press | Nov 23, 21:33

  • ChipMOS Shanghai to win 3D NAND orders chips from YMTC

    Before Going to Press | Nov 23, 21:33

  • Mobile DRAM prices to rise 10-15% in 4Q17, says DRAMeXchange

    Before Going to Press | Nov 23, 21:31

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24-Nov-2017 09:45 (GMT+8)

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OTC electronic229.62+0.24+0.1% 

UMC
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.