Chipbond Technology expects 3Q TFT LCD driver IC packaging market to remain strong
Nuying Huang, Hsinchu; Shih-wei Kao, DIGITIMES

Chipbond Technology has achieved 70-80% capacity utilization for its gold bumping and tape carrier package (TCP) lines for TFT LCD driver ICs, said company president Fei-jain Wu.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.