Chipbond Technology has achieved 70-80% capacity utilization for its gold bumping and tape carrier package (TCP) lines for TFT LCD driver ICs, said company president Fei-jain Wu.
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Chipbond Technology has achieved 70-80% capacity utilization for its gold bumping and tape carrier package (TCP) lines for TFT LCD driver ICs, said company president Fei-jain Wu.
