At the 2026 Mobile World Congress (MWC), MediaTek showcased a series of breakthrough technologies under the theme "AI for Life: From Edge to Cloud," emphasizing its leadership in chips and AI. The company focused on 6G communications, next-generation home broadband platforms, automotive connectivity, mobile AI, and data center interconnect solutions.
Taiwan Mobile announced on March 2 that it had signed a strategic cooperation memorandum of understanding with AST SpaceMobile at MWC 2026 to promote the integration of space-based base stations with existing mobile networks in Taiwan. The companies said the partnership will accelerate the deployment of satellite-terrestrial communication architectures.
The Mobile World Congress (MWC) 2026, held from March 2 to 5, showcased a decisive shift for the global mobile industry. No longer centered solely on smartphones, this year's event highlights a broader, deeply integrated ecosystem spanning satellite communications, WiFi 8, AI, automotive connectivity, and robotics—signaling the next growth chapter for wireless technologies.
Samsung Electronics officially launched its annual flagship Galaxy S26 series smartphones and Galaxy Buds 4 Bluetooth earphones on February 26. Following integrations with Bixby and Google's Gemini, Samsung has now added support for Perplexity, broadening compatibility with multiple large language models (LLMs). Observing Samsung's AI strategy for 2026 phones reveals three key characteristics.
As AI model training scales up and cloud service providers (CSPs) accelerate the buildout of high-performance data centers, switch bandwidth is moving from 51.2Tbps to the 102.4Tbps generation, raising stricter requirements for power consumption, thermal management and serviceability in high-speed optical interconnects. Co-packaged optics (CPO) is regarded as a key architecture to overcome the power limitations of traditional pluggable optical modules, driving laser modules, packaging integration and high-speed interconnect technologies to the forefront of supply chain deployment.
At MWC 2026 in Barcelona, Taiwanese electronics companies are highlighting how AI, edge computing, and next-generation connectivity are converging to reshape telecom and enterprise networks, with a strong focus on practical deployments across industry, cloud, and public infrastructure.
The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud and data-center operators are consuming DRAM and NAND at a pace that is crowding out smartphone makers, distorting foundry economics, and forcing chipmakers to rethink how they secure supply. The consequences are rippling from factory floors in Asia to boardrooms in Silicon Valley.
Nearly all smartphone brands are facing pressure from severe memory supply constraints. Major Chinese smartphone brands have indicated that their procurement volumes this year will decline significantly, with some dropping by as much as 15–20%. For smartphone chip suppliers, this is expected to translate into considerable revenue pressure.
Telecommunications giant Ericsson has announced its participation at the 2026 Mobile World Congress (MWC), scheduled for March 2 to 5 in Barcelona, under the theme "Enter new horizons." At the event, the Swedish company will collaborate with its global ecosystem partners to demonstrate how AI is driving the evolution of mobile networks and laying critical foundations for 6G.
Chunghwa Telecom will participate in the 2026 Mobile World Congress (MWC) in Barcelona, Spain, from March 2 to 5, unveiling its core strategy for "pre-6G next-generation communications." The company plans to highlight technological advancements and strengthen international collaborations across satellite communications, optical networks, and 5G-Advanced.
Samsung Electronics officially unveiled the Galaxy S26 series of smartphones in the early hours of February 26 2026, Taipei time. Alongside its annual hardware upgrades to the flagship lineup, Samsung is leaning heavily on enhanced generative AI capabilities through the introduction of AI agents, more intuitive AI controls, and other AI-powered innovations.
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