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Aug 11
Google readies Pixel 11 lineup, market breakthrough still under question

Google has officially announced that it will unveil its annual Pixel 11 flagship smartphone series on August 13, 2026, with the lineup expected to include the Pixel 11, Pixel 11 Pro, Pixel 11 Pro XL, and Pixel 11 Pro Fold. As generative AI adoption accelerates and shortages and price increases hit key upstream smartphone components, investors and the market are closely watching how Google will use AI to boost sales and hardware momentum.

Taiwan's Sercomm Corporation is repositioning itself for the next phase of network infrastructure demand by expanding beyond traditional broadband equipment into 5G, fixed wireless access (FWA), enterprise networking and IoT connectivity, areas expected to benefit from rising data traffic and AI-driven digitalization.

Samsung Electronics will increase production of the Galaxy Z Fold8 by 1 million units in 2026 after strong preorder demand for its wider foldable phone, according to ET News. The move comes as the company prepares for a new round of competition in foldables ahead of Apple's first 4:3 foldable iPhone, which is expected in September 2026.

LinkCom Manufacturing said its July revenue fell from a year earlier because tight supplies of memory, passive components, and other key parts pushed up prices and prompted some networking customers to adjust procurement and delivery schedules for large projects. The magnetic components maker said order intake and deliveries remained steady, and July sales still ranked as the second-highest for the same month in company history.
Highpoint Service Network approved its second-quarter 2026 financial report on August 5, posting record revenue for both the quarter and the first half as it expanded in the Asia-Pacific and launched operations in India. The Taiwan-based service provider reported consolidated revenue of NT$375 million, net profit after tax of NT$8.38 million, and earnings per share (EPS) of NT$0.46 for the quarter.
Sercomm Corporation reported July revenue of NT$7.98 billion, up 51% from a year earlier and a new monthly high, as rising AI adoption continued to drive network traffic and equipment upgrade demand. Revenue for the first seven months reached NT$45.24 billion, also a record and up 57% year-over-year.
TSMC-affiliated optical sensing chipmaker VisEra Technologies said at its earnings conference on August 6 that business momentum rebounded significantly in the second quarter of 2026, driven by stable shipments of smartphone CMOS image sensors (CIS).
As geopolitical tensions and natural disasters continue to highlight the importance of resilient communications infrastructure, Chunghwa Telecom is accelerating investments in both satellite and subsea cable networks to strengthen Taiwan's network redundancy.
Taiwan's Development of Cultural and Creative Industries Act has formally designated the film and TV industry as one of the island's national strategic industries. Companies investing in the sector are eligible for tax credits, while film and television productions may also apply for investment from Taiwan's National Development Fund (NDF).

Elon Musk's ambitions across AI, robotics and space infrastructure are moving into a new phase following the unveiling of Terafab, an ambitious semiconductor manufacturing complex designed to secure the compute capacity required by Tesla, SpaceX and xAI.

Nvidia is seeking Chinese telecom equipment partners to develop 6G AI radio access network base stations for overseas markets, according to Chinese media reports, as the chipmaker looks to extend its computing platform beyond data centres and into wireless networks and edge AI infrastructure. In a written response to DIGITIMES, however, Nvidia has categorically denied the report. "The report is unfounded, and the characterization of our activities in the region are false," an Nvidia spokesperson states.

Apple and its manufacturing partners are rushing to secure mobile DRAM ahead of the expected launch of the iPhone 18 lineup, as about US$1 billion worth of next-generation processors reportedly remain unable to move into packaging without sufficient memory supply.