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Jun 4, 16:34
Foxconn, SK Group eye deeper AI infrastructure ties in Asia

Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers, data centers, and energy solutions.

Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.
Chenbro targets server rack global leadership in 3 years
Jun 4, 15:38
Server chassis maker Chenbro is continuing to evolve, aiming to perfect the craftsmanship of mechanical components to become the world's top rack supplier, according to company CEO Corona Chen.
Adlink Technologies said it pushed into a growth phase for robotics, edge AI, and vertical markets in 2026 as the US became its largest revenue engine, accounting for more than 30% of sales. The industrial PC maker reported broad-based demand across healthcare, transportation, defense, energy, and industrial automation and said design-in projects will start contributing shipments from 2026 into 2027.
TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year in which the world's largest contract chipmaker converted the AI semiconductor boom into record-scale earnings.
Nvidia CEO Jensen Huang introduced RTX Spark, co-developed with MediaTek, at Nvidia GTC Taipei, with PC brands expected to launch products in the third quarter of 2026. While widely seen as Nvidia's return to Windows on Arm after a 15-year absence and a challenge to Qualcomm, RTX Spark points to a larger fight over AI-era endpoints.
Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The company said it has shipped a high-RTI flame-retardant polycarbonate material for backup battery modules and cooling fans since 2025, is developing deep ultraviolet photoresist precursor materials, and is advancing a high-purity low-carbon hydrogen project to support semiconductor fabs.
AI-driven demand for computing infrastructure has ended the passive components industry's inventory adjustment phase, with Taiwan-based leaders Yageo and Walsin Technology both seeing utilization rates return to high or full-capacity levels. The market is now showing signs of a renewed boom for the first time since the 2018 "super cycle."

Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore as the city-state becomes a more important manufacturing, logistics, and advanced-packaging hub for the US chip-equipment maker, Nikkei Asia reported.

Global AI computing demand is sweeping through the infrastructure market. Kentec, the AI data center (AIDC) system integrator and turnkey solution provider under Kenmec Mechanical Engineering, expects first-half 2026 revenue to rise more than 200% year on year, with the real surge concentrated in the second half of the year.
Ability said it secured a new OEM order from a long-established Japanese camera brand for the second half of the year, a deal the company expects will begin ramping in the fourth quarter of 2026 and provide a significant revenue boost. The company announced the order alongside a major presence at COMPUTEX 2026, where it highlighted AIoT edge computing, smart city deployments, smart retail, and commercial robotics.
The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source software, and digital energy systems.