AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of Eris Technology, will begin trading on Taiwan's emerging stock market on October 23 and plans to raise the share of 6-inch wafers in its capacity from 35% to more than 50%, as its TVS products enter the international AI server supply chain.

Thermaltake is targeting the growing edge AI market with a new workstation lineup. Chairman Kenny Lin said the company has transformed from a gaming components maker into an AI PC and workstation systems provider. The company plans to launch three product lines in the second half of 2026 and aims for AI-related products to contribute 5% to 10% of revenue in 2027.

South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor packages grow larger. The company is conducting performance and internal reliability assessments, plans to advance samples and customer evaluations in 2027 and 2028, and is targeting mass production in 2029, with ceramic cores serving as a material alternative to glass cores for next-generation large-area packages.

Genius Electronic Optical (GSEO), a leading manufacturer of optical lenses and precision optical components, has entered into a strategic partnership with 3M to develop, manufacture and expand production capacity for 3M's Expanded Beam Optical (EBO) solutions. As part of the deal, 3M will invest NT$4.8 billion (US$147.1 million) through a private placement and is expected to complete the transaction in the fourth quarter of 2026.

Powertip Technology is transitioning from a module design and supply company to a solutions provider. The company has seen rising demand in the first half of 2026 as the electronics and manufacturing industries faced higher material costs, which it aims to control by negotiating price adjustments with its customers. Although such negotiations are difficult due to intense market competition, the company notes that failure to deal with the situation properly could impact future operations; similar circumstances previously occurred during the pandemic.

South Korean automotive and machinery component makers are among 12 companies identified in a KRW2.2 trillion (approx. US$1.66 billion) private investment plan to develop a domestic humanoid robot supply chain in Daegu, as the region seeks to turn its automotive manufacturing base into a source of actuators, motors and other robot components.

DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration shows the growing ties between two of China's largest technology firms to sidestep Nvidia.

Nvidia's South Korea representative said the company's Vera CPU already has customers in South Korea and that collaboration with LG Electronics on humanoid robots is expected to deliver results soon. Speaking at KES 2026, Soyoung Jeong outlined Nvidia's role in the shift toward AI agents and physical AI.

UK neocloud provider Nscale is set to lose Microsoft as the anchor tenant at its Loughton data center in Essex, after delays in power availability disrupted plans to support AI computing services. The UK's National Grid reportedly told Nscale that sufficient electricity for the site may not be available until after 2030.

FIC Global chairman Leo Chien said the PC market continues to suffer from memory shortages, with a meaningful recovery unlikely in the second half of 2026. However, some industrial PC (IPC) businesses, particularly those in maritime-related applications, have begun to recover from their lows.

Apple's MacBook Neo is intensifying competition in the global low-cost notebook market as rising supply-chain costs push Microsoft and other notebook makers to reassess their product strategies. Microsoft is initially planning to reduce the specifications of its entry-level 12-inch Surface model, reviewing everything from the SoC, memory, camera, and battery to structural components in order to lower the bill of materials (BOM).