Broadcom CEO Hock Tan stands to receive up to US$600 million in stock rewards if he can drive artificial intelligence (AI) product revenue to US$120 billion by fiscal year 2030.

US electronic design automation (EDA) giant Synopsys faced ongoing challenges from US export restrictions to China and difficulties with key foundry customers. As of July 31, 2025, the company's revenue and profit for the third quarter of fiscal year 2025 fell short of market expectations, prompting an announcement of a 10% workforce reduction.

TSMC posted strong revenue growth in August 2025, recording approximately NT$335.77 billion (approx. US$11.03 billion). The result marks a 3.9% increase from July and a 33.8% rise compared to the same month last year, according to company data released Wednesday.

The semiconductor landscape has fundamentally shifted. As we move from 2025 to 2026, three forces dominate global technology discourse: semiconductors, artificial intelligence, and the Trump administration's trade policies. In Japan and South Korea, semiconductors are aptly called the "rice of industry"—and in our data-driven economy, this metaphor has never been more relevant.

Alliance Material, a semiconductor materials company, reported a surge in revenue in August 2025, reaching NT$67.93 million (US$2.23 million), a 15.84% increase from July and nearly four times higher year-over-year. Its cumulative revenue for the first eight months rose 204.15% to NT$280 million compared to the same period in 2024, marking its highest monthly performance since April 2016.

TSMC has confirmed it will exit gallium nitride (GaN) foundry operations within two years, shutting down production at its 6-inch Fab 2 in Hsinchu Science Park. The company is also expected to consolidate its three 8-inch fabs — Fab 3, Fab 5, and Fab 8 — redeploying up to 30% of staff to sites in the Southern Taiwan Science Park (STSP) and Kaohsiung to offset labor shortages, lower costs, and optimize asset utilization.

The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International Convention and Exhibition Center.

At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap from High NA to the next frontier of Hyper NA.

China's top silicon wafer maker, National Silicon Industry Group (NSIG), has unveiled a major restructuring, taking full control of three loss-making 12-inch wafer subsidiaries. The buyout, valued at CNY7.04 billion (approx. US$967 million), will be paired with a new fundraising plan capped at CNY2.105 billion.

SEMICON Taiwan 2025 opened on September 10, with numerous forums already underway ahead of the event. Various research institutions have expressed cautiously optimistic views on the semiconductor market outlook, stating that the artificial intelligence (AI) mega-trend will continue to drive growth in the chip market over the coming years.

Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision challenges and higher investments, slowing their progress.

At the SEMICON Taiwan event held in September, key international figures from the semiconductor, robotics, and future vehicle sectors convened, highlighting Taiwan's rising importance as a global technology supply chain center. The gathering underscored international confidence in Taiwan's semiconductor cluster and its electronic manufacturing expertise.

Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision Industry to advance energy-efficient high-performance computing (HPC) solutions for AI. Government documents show that Aewin and I-Chiun have already adopted technology transfers enabling chip-cooling performance that outstrips global standards, securing a foothold in the supply chain of leading US AI server manufacturers.

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established the "3DIC Advanced Manufacturing Alliance." The alliance gathers industry players from the equipment and materials sectors to build a globally competitive local supply chain, ensuring that backend processes no longer become growth bottlenecks for the artificial intelligence (AI) industry.

Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure expansion to end-user applications, the ecosystem now relies heavily on precision technologies, with chip-on-wafer-on-substrate (CoWoS) processes at the forefront.

Kemflo International has completed its activated carbon regeneration plant in Pingtung and is moving forward with environmental certification and licensing as it shifts focus toward circular economy solutions in semiconductor manufacturing. The company aims to establish a new growth area by offering regeneration services for spent activated carbon, widely used in liquid purification processes.

Simon Yang, the former YMTC CEO and later deputy chairman, has joined Rong Semiconductor (Ningbo) Co. (RongSemi) as head of its technical expert committee. The announcement came alongside RongSemi's September 8, 2025, statement denying reports that construction of its 12-inch fab in Ningbo had been suspended. The company said Yang has been guiding technical work in the role since July 2024.

The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position. Micron Technology reports its 2026 HBM output is already sold out, underscoring the company's confidence in its market position as demand intensifies.

India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics (FGEL), marking a significant step in its push to expand capabilities in power electronics.

Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials and supply-chain resilience, which she argued will decide future industry leadership.

Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process automation. Taiwan-based IPC maker Aplex Technology is strengthening its software capabilities in the semiconductor sector through investment in Adirtek. By also joining TSS Holdings, Aplex aims to leverage its comprehensive product lineup—including AI IPCs, human-machine interfaces, embedded hosts, edge computing, and AI software operation platforms—combined with Adirtek's system-level competitiveness to jointly penetrate the semiconductor industry supply chain.

As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced its first KrF lithography coater-developer system, the Ultra Lith KrF, a pivotal move into front-end lithography tools for mature-node production.

Taiwan's semiconductor sector continues to assert its significance globally, with surging demand for advanced processing and packaging technologies driving industrial PC (IPC) manufacturers to deepen their involvement. Industry participants highlight the growing need for customized, stable solutions across wafer fabrication and testing stages.

Intel has announced a series of senior leadership appointments aimed at advancing its core product business, scaling its foundry operations, and reinforcing engineering capabilities across the company. The moves, which include new hires and expanded responsibilities for key executives, come as Intel continues its efforts to improve execution and sharpen competitiveness in the semiconductor industry.

TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced packaging has become central to semiconductor strategy, with equipment suppliers forecasting robust growth through at least 2026.