US semiconductor giant Nvidia has recruited two leading artificial intelligence (AI) specialists from China as part of its ongoing efforts to broaden its research team, according to a report by the South China Morning Post on June 29.

ThinTech Materials Technology (TTMC), a subsidiary of China Steel Corporation, experienced conservative shipment momentum in the first quarter of 2025 due to delays in customer verification schedules from IDM giants and panel manufacturers, as well as the recycling use of FOPLP (Fan-Out Panel Level Packaging) carriers.

Samsung Electronics has secured a broad license to a portfolio of semiconductor patents originally developed by Intel, a move industry analysts view as both a defensive strategy against potential litigation and a step toward strengthening its global technological competitiveness.

Facing external challenges such as US tariffs, exchange rates, and interest rates, IC distributor GMI stated that despite numerous market uncertainties, it expects its operational performance in the second half of 2025 to be on par with the first half. The company is striving for full-year revenue growth, particularly targeting double-digit increases in new projects within the AI servers and automotive markets.

Samsung is pushing its second-generation 2nm process, SF2P, promising notable performance and efficiency gains. As its chip business faces mounting pressure, the company is betting on advanced AI and mobile applications to revive its foundry momentum and attract major clients amid stalled 3nm adoption and scaled-back capital investment.

CoAsia, a Taiwan-based semiconductor company, announced that its subsidiary, CoAsia SEMI, will partner with Rebellions, a South Korean AI chipmaker, to co-develop a next-generation Processing-In-Memory (PIM) server-grade semiconductor as part of a national-level research and development initiative led by South Korea.

IBM is seeking a long-term partnership with Japan's Rapidus to develop sub-1nm chips, according to Yomiuri Shimbun. Building on their 2nm collaboration, IBM has deployed engineers to Rapidus's Hokkaido site, signaling deeper ties as both companies pursue next-generation semiconductor production and Japan ramps up investment in chip innovation.

South Korean artificial intelligence chip startup Rebellions has unveiled a prototype of its next-generation neural processing unit (NPU), integrating Samsung Electronics' 12-stack HBM3E high-bandwidth memory in a strategic move to challenge Nvidia's high-end accelerators.

China's main chip investment fund is planning to focus on the country's key shortcomings in sectors like lithography and semiconductor design software, adjusting its approach to better overcome US efforts to stop its technological advances.

Taiwan Semiconductor Manufacturing Co.’s smaller affiliate Vanguard International Semiconductor Corp. may accelerate the chip production schedule at its new US$7.8 billion joint venture in Singapore on greater customer demand for hedging against geopolitical risks.
VIS may be able to push production at the new plant, which makes mature chips, to as soon as late 2026 versus the originally announced schedule of the first half of 2027, VIS Chairman Fang Leuh told reporters at a company event on Saturday in Taoyuan, Taiwan. VIS broke ground for the facility in the fourth quarter of 2024.

Sino-American Silicon Products Group (SAS) is accelerating its push into integrated semiconductor materials and equipment services through strategic acquisitions. On June 27, 2025, the group announced that its subsidiary, Taiwan Speciality Chemicals Corp. (TSCC), will acquire a 65.22% stake in semiconductor equipment service provider Hong Jie Technology Co., Ltd. in a cash transaction.