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NEWS TAGGED POWER ASE
Friday 11 November 2011
ASE to acquire 100% stake in Power ASE
IC packager Advanced Semiconductor Engineering (ASE) has announced plans to acquire up to 107 million shares of Power ASE Technology, a joint venture with memory chipmaker Powerchip...
Monday 2 May 2011
ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising
Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...
Monday 14 June 2010
ASE optimistic about 3Q10
Advanced Semiconductor Engineering (ASE) expects June revenues to increase sequentially, according to the company. The chip packaging and testing house also expressed optimism that...
Monday 27 July 2009
PSC to receive NT$450 million loan from ASE
IC packaging and testing house Advanced Engineering Semiconductor (ASE) has announced that its board of directors has approved a NT$450 million (US$13.7 million) loan to DRAM maker...
Wednesday 7 January 2009
DRAM production cutbacks lead to lower utilization at packaging and testing firms in early 2009
Memory IC packaging and testing houses ChipMOS Technologies, Formosa Advanced Technologies Company (FATC), Power ASE Technology and United Test and Assembly Center (UTAC) are said...
Tuesday 14 October 2008
Taiwan memory IC packaging and testing firms to benefit from Micron-Qimonda deal
Taiwan-based memory IC packaging and testing companies are likely to benefit from the Micron-Qimonda deal, according...
Monday 1 September 2008
Power ASE leads in 1H08 profitability
Despite a listless memory industry status in 2008, Power ASE Technology managed to maintain its gross margin above 40% in the first half of 2008 thanks to aggressive expansion of...