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NEWS TAGGED CHINA WAFER LEVEL CSP
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Friday 15 May 2020
Chinese IC equipment makers revving up to serve domestic demand
China's homegrown semiconductor equipment makers are gearing up to develop diverse frontend and backend IC process equipment in line with the government efforts to boost self-sufficiency...
Thursday 30 April 2020
China Wafer Level CSP sees huge on-year growth in 1Q20 business
China-based CIS (CMOS image sensor) packaging service provider China Wafer Level CSP has posted consolidated revenues of CNY191 million (US$27.4 million) and net profit of CNY62 million...