MSI, a global leader in high-performance computing and industrial solutions, returns to COMPUTEX 2026 (Booth #J0605a) to unveil its strategic AI roadmap. This year's showcase centers on a seamless continuum from data center scale to autonomous edge execution, featuring liquid-cooled AI platforms and supercomputers built on NVIDIA MGX, NVIDIA DGX Station, and NVIDIA DGX Spark architectures.Cloud Foundation: Liquid-Cooled Infrastructure for Hyperscale AITo meet the demands of modern AI data centers, MSI is introducing high-density platforms that prioritize thermal efficiency and performance: CG681-S6093 6U Liquid-Cooled AI Server (based on NVIDIA MGX): Built on NVIDIA MGX architecture, this server supports dual AMD EPYC processors and up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition Liquid Cooled GPUs. It delivers the compute density required for large-scale AI inference - with support for a wide range of agentic, physical AI, scientific computing, simulation, graphics, and video workloads.High-Speed Connectivity: The platform is equipped with NVIDIA ConnectX-8 SuperNICs, providing up to 8×400Gbps Ethernet connectivity for distributed AI environments.    Rack-Scale Scalability: MSI's liquid-cooled rack-scale architecture supports up to four CG681-S6093 GPU systems within a 48RU configuration. Networking is anchored by NVIDIA Spectrum-4 SN5600 Ethernet switches and SN2201 out-of-band switches for high-performance AI cluster connectivity.Deskside Development: The Desktop AI SupercomputerBridging the gap between the data center and the developer's desk, MSI presents high-performance AI computing for local workflows: XpertStation WS300 (NVIDIA DGX Station): Powered by NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip with up to 748GB coherent memory and 7.1TB/s HBM3e bandwidth, supporting Windows-based AI development while enabling high-speed CPU-GPU data sharing for large AI models and data-intensive workflows.Efficient AI Refinement: The WS300 is designed for AI model development, fine-tuning, and inference, utilizing a compact, liquid-cooled design with dual 400GbE networking powered by NVIDIA ConnectX-8 SuperNICs to sustain peak performance. (Recently showcased at GTC Taipei).Edge Execution: EdgeXpert and Autonomous IntelligenceMSI is bringing data center-level performance directly to real-world environments through the debut of its edge supercomputing platform: EdgeXpert AI Supercomputer: Built on the NVIDIA DGX Spark platform, EdgeXpert enables enterprises to deploy smarter, faster, and more scalable AI agents and applications at the edge.OpenClaw/Hermes Agent on MSI EdgeXpert: MSI showcases prominent AI Agent frameworks, providing open-source Agentic AI structures that support sustainable local operations and self-optimization capabilities.EU CRA Compliant Agentic AI with Galene Elettra: Powered by a Multi-Agent System (MAS), this solution enables intelligent decision-making across complex workflows while maintaining compliance with the European Cyber Resilience Act (CRA). Legal AI Suite: A specialized platform for enterprise AI, streamlining legal research, document analysis, and IP governance. Smart Campus Patrol: The Smart Campus Patrol Vehicle demonstrates real-time computer vision for precision inspection and smarter industrial operations. Tarot AI Experience with Reachy Mini: An interactive demonstration of Agentic AI, blending robotics with generative AI to deliver personalized engagement. End-to-End AI in Action Across IndustriesMSI delivers purpose-built Edge AI solutions developed with leading industry partners across diverse vertical markets:Smart Manufacturing & Semiconductor:The Edge AI Box MS-C910E with Memorence AI enables real-time machine vision. Partnering with Qiming Tech, MSI leverages the Edge AI Box MS-C939 to deliver real-time, high-precision automated optical inspection (AOI) to optimize semiconductor production yield.Voice AI & Driver Safety: Powered by Ubestream, the Slim Box MS-C926 provides real-time translation, while the Embedded Box MS-C927 enables instant voice-to-order experiences for retail. For driver safety, the In-vehicle Box MS-C932 runs real-time AI Driver Fatigue Detection to enhance on-road security.Smart Transportation & Precision AgricultureIntegrating edge inference with frontline mobility and field operations, MSI optimizes commercial transit and smart farming workflows:Smart Transportation × AI Vision Solutions:MSI is expanding its smart transportation portfolio with mobility solutions powered by Edge AI and in-vehicle vision. The lineup features fleet management tablets, telematics boxes, smart rearview mirrors, and AI-enabled ADAS and DMS systems for fleet monitoring and video analytics. Utilizing real-time AI processing, MSI helps logistics and fleet operators improve management efficiency and strengthen road safety.Smart Agriculture & Drone Integration: MSI introduces an intelligent agricultural solution that seamlessly integrates autonomous drone technology, Edge AI computing, and ground control systems.Built for harsh environments, this comprehensive platform combines drone ground control stations, rugged tablets, T-Box connectivity modules, and centralized multi-drone management platforms. It is engineered for critical use cases including automated field inspection, precision spraying, crop monitoring, and pest/disease identification. By leveraging real-time video analytics, edge inference, and cloud data synchronization, the solution empowers agricultural operators to boost efficiency, streamline operational workflows, and accelerate the transition to smart farming.Extreme Field Mobility (MS-NE21): The NE21 Rugged Industrial Tablet features an Intel 13th Gen Core i Series (Raptor Lake-U) processor, supporting up to 32GB LPDDR5/LPDDR5X memory and 2TB PCIe SSD. Built to MIL-STD-810G standards with an IP65 rating, it survives 4-foot drops and functions from -10°C to 50°C. It offers a 650-nit sunlight-readable 11.6" display with glove/wet-touch modes and a continuous hot-swappable battery system (64Wh to 98.1Wh).Industrial Panel PCs & Robust Hardware FoundationTo support heavy enterprise workloads, MSI highlights its high-reliability industrial hardware portfolio:Industrial Panel PCs: Features include the MS-1A81 (21.5") for Smart Healthcare clinical workflows; the MS-1A22 (12.1") and MS-1A32 (15") for factory floor monitoring; and the MS-1A91 (10.1") and MS-OP01 (15.6") for secure Smart Locker Systems.Hardware Backbone: For multi-industry infrastructure durability, MSI showcases its robust hardware portfolio featuring the Intel Wildcat Lake, NXP, and NVIDIA Jetson Thor series platforms, alongside industrial 4U rackmount systems.Sustainability & EV Charging InfrastructureBringing intelligent infrastructure to the energy transition, MSI presents its smart EV charging solutions:Eco Series Home EV Charger: Awarded the Taiwan Excellence Award, this residential smart charger delivers up to 22kW three-phase output. Powered by NXP industrial MCUs and AI smart control, it integrates with solar storage. Featuring a UL94-V0 fire-rated enclosure (extinguishing over-heat sources in 10 seconds) and RDC-DD leakage detection for underground parking safety, it holds global safety certifications, RPC certification in Taiwan, and $5M USD product liability insurance.MSI Hyper 80 Dual Fast Charger: Designed for urban commercial hubs, this DC fast charger delivers 80kW power distribution within an industry-leading 30cm ultra-slim chassis to maximize space efficiency.Visit MSI at COMPUTEX 2026, Booth #J0605a, Hall 1 (1F), to experience the future of the cloud-to-edge AI ecosystem.Credit: MSICredit: MSI

As AI data center rapidly scales toward the gigawatt (GW) level, energy management is evolving from a supporting function into a defining strategic pillar. Against this backdrop, Infineon Technologies is redefining power infrastructure of AI era through its comprehensive "From Grid to Core" strategy, integrating energy efficiency, power density, and system resilience from the electrical grid to the processor core.Scaling AI: Strategic Power Solutions MatterThe evolution of artificial intelligence (AI) has accelerated far beyond the trajectory once predicted by Moore's Law. As AI models continue to expand in parameter scale and real-time inference becomes increasingly critical, demand for computing power is rising at an unprecedented pace.Today, the power consumption of a single GPU is rapidly approaching the kilowatt level, and the power density of a server rack has increased significantly from less than 60kW in the past to exceeding 100kW, now moving toward a new threshold in the megawatt range.This is not just numerical growth; it represents a fundamental shift in power architecture. As AI computing clusters expand rapidly, traditional 48V busbars and AC power distribution architectures are quickly approaching their physical limits in terms of power loss, thermal management, and spatial constraints.Adam White, President of Infineon's Power & Sensor Systems Division, emphasized that future competition in AI infrastructure will no longer be limited to chip performance. Instead, it will be a cross-disciplinary integration battle encompassing power electronics, materials technology, and system architecture.From Grid to Core: Rethinking the power delivery architectureAt this critical turning point for the industry, Infineon's competitive advantage lies not in a single breakthrough product, but in its ability to orchestrate and optimize the entire power delivery chain at the system level."From Grid to Core" is more than a product strategy - it is a multi-phase architectural framework designed to reshape the future AI energy chain. Developed through early collaboration with global hyperscalers and ecosystem partners, the strategy enables Infineon to address evolving AI power demands across every phase of infrastructure, from utility grids to processor-level power management.Power grid: Enabling a sustainable, high-efficiency power with HVDCAt the front end of the data center, power infrastructure is transitioning from traditional mechanical systems to highly integrated solid-state solutions. Future AI facilities are expected to increasingly adopt decentralized DC microgrids, enabling greater efficiency, flexibility, and resilience in energy management.By leveraging silicon carbide (SiC) technology in solid-state transformers (SSTs), system weight can be dramatically reduced - from nearly 20 tons to approximately 500 kilograms—while simultaneously improving overall energy efficiency by more than 1%. Beyond optimizing space utilization and operational costs, this advancement signals a broader industry migration from electromechanical infrastructure toward semiconductor-driven power systems.As SSTs and related technologies become integrated into AI power infrastructure, a multi-billion-dollar semiconductor opportunity is emerging across next-generation energy systems.At the same time, the power grid is evolving beyond its traditional role as just an energy source. Through digitally controlled power systems with real-time monitoring and remote management capabilities, combined with solid-state circuit breakers (SSCBs) featuring microsecond-level response times, the grid is becoming an intelligent energy platform capable of continuous optimization and predictive management.Server rack: Reshaping power density and maximizing efficiencyAs data centers advance toward GW-scale deployments, power distribution architecture is undergoing a fundamental redesign. Infineon is driving the industry's transition from traditional 48V systems to ±400V and 800V high-voltage DC architectures. Through the design of three-phase power sidecars, Infineon is restructuring power supply and computing systems to establish a more efficient and flexible power distribution model.At the same time, the power architecture of AI data centers is following a clear evolutionary path: moving from integrated server rack designs to high-voltage DC and sidecar power supply configurations, and ultimately advancing to gigawatt-scale infrastructures that incorporate DC microgrids.Meanwhile, The high-frequency characteristics of gallium nitride (GaN) components enable intermediate bus converters (IBCs) to achieve over 98% conversion efficiency and exceptionally high power density in an extremely compact form factor, significantly reducing power transmission losses and freeing up more space for AI computing resources.Processor core: Power density and new architectures for next-gen AI computeAt the processor core—the final stage of power delivery—the challenge shifts toward managing extreme current density and ultra-fast transient response.To support next-generation GPUs requiring massive current delivery and rapid load transitions, Infineon has introduced a digital multiphase PWM controller alongside the industry's first TLVR four-phase power module. These technologies are engineered to provide highly stable, efficient, and responsive power delivery for AI processors operating under increasingly demanding workloads.In response to the next generation of GPUs demanding ultra-high current and rapid load changes, Infineon has introduced digital multiphase PWM controllers and the industry's first TLVR quad-phase module. By leveraging high-precision telemetry and digital control technologies, power systems have transformed from energy suppliers into intelligent platforms capable of real-time monitoring, prediction, and optimization.From AI data center to physical AIIf data centers form the foundation of AI computing power, the physical world will be where AI's true value is ultimately realized. As AI increasingly expands into humanoid robots, autonomous systems, and intelligent manufacturing equipment, demands for energy efficiency, real-time responsiveness, and system reliability will become even more critical.Infineon is extending its long-established expertise in power management beyond data centers into the emerging era of Physical AI. By integrating sensing technologies, actuate, security and connectivity solutions, and high-efficiency power modules, the company is enabling a comprehensive functional blocks that empower humanoid robots to perceive, think, act and connect, safely and secured in a real-world environment.Push the boundaries of power technology in AI era"We Power AI" is not just a slogan for Infineon—it is a concrete commitment to the future of the industry. From gigawatt-scale data centers to physical AI, Infineon continues to push the boundaries of power technology, ensuring that every watt of energy is transformed into the greatest possible value for AI.As the industry advances toward the next generation of computing, energy management will become the decisive key to truly unlocking the full potential of AI. In this wave of transformation, Infineon is joining forces with ecosystem partners to stand at the forefront of defining the future.Editor's Note: Adam White will deliver a keynote address at COMPUTEX 2026 on June 4 titled  "Infineon Powering AI from Grid to Core to Physical AI."  The session will explore emerging trends and strategic opportunities in power infrastructure of AI era.Credit: Infineon

At COMPUTEX 2026, Fibocom outlined its perspective on the deployment path of edge AI: as AI moves from the cloud to end devices, the key to large-scale adoption lies not only in model performance, but also in the synergy between stable connectivity and local computing power.Based on this insight, Fibocom continues to strengthen its "Connectivity + AI" capability. On one hand, with wireless modules at its core, Fibocom has built a connectivity product portfolio covering FWA, AI CPE, and next-generation Wi-Fi 8, providing a high-speed, low-latency, and highly reliable connectivity foundation. On the other hand, by leveraging its full-stack AI solutions, Fibocom enhances on-device AI capabilities, enabling terminals with local perception and processing power to improve the stability and responsiveness of AI applications in complex environments.For intelligent edge scenarios, Fibocom launched the Fibocom ClawBox, a high-efficiency AI computing terminal natively compatible with intelligent agents such as OpenClaw and Hermes Agent. Built on a high-performance heterogeneous computing architecture, the product integrates CPU, GPU, and NPU, delivering up to 18 TOPS @ INT8 hybrid precision computing power. With typical power consumption at around 5W, it enables high-density, multi-task parallel inference. It supports multi-stream video analytics, complex visual structuring, voice, and multimodal model inference, while offering low latency, high reliability, and localized deployment capabilities. Combined with Fibocom's Skill Hub, it is widely applicable in security, transportation, robotics, and other intelligent edge scenarios, supporting the large-scale deployment of smart industry applications.At COMPUTEX 2026, Fibocom will showcase a range of innovations at Booth K1022, including AI companion solutions, robotic lawn mower solutions, mobile robotics solutions, and more, demonstrating how "Connectivity + AI" is creating value in high value scenarios. Industry partners are warmly welcome to visit and connect with us.

ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting the growing role of quality in scaling AI hardware.As demand for AI infrastructure accelerates, quality is shifting from a manufacturing support function to a direct driver of performance, yield and delivery readiness. While public attention often centers on AI models, ZEISS says reliable hardware execution is becoming a decisive factor in AI deployment.Behind every AI interaction are massive data centers powered by thousands of GPUs. As systems scale from chip to rack, defects in semiconductor packaging, printed circuit boards (PCB/A), cooling systems and high-speed interconnects can affect uptime, deployment speed and total cost."With compute demand surging, manufacturers face record orders, but the challenge is delivering at scale with consistent quality," said Clive Yen, Global Head of Electronics Customer Segment, ZEISS Industrial Quality Solutions. "As systems grow more complex, quality becomes critical to reliable deployment. This is why we work across Taiwan's ODM ecosystem and the full AI server value chain to enable consistent, scalable quality.""At scale, even small defects can become major bottlenecks," said Tonmoy Kundu, Global Head of Sales, ZEISS Research Microscopy Solutions. "Manufacturers need faster insight, tighter process control and trusted failure analysis to accelerate next-generation AI hardware."ZEISS says it offers one of the industry's most comprehensive quality portfolios across the AI hardware value chain, supporting customers from semiconductor packaging and PCB inspection to liquid cooling, optical connectivity and final rack integration.At the forum, ZEISS will showcase solutions for advanced high-bandwidth memory (HBM), where rising stack heights and shrinking interconnect dimensions require high-resolution, non-destructive inspection and deep defect analysis.The company will also present metrology solutions for co-packaged optics (CPO), where ultra-tight tolerances for FAU and MPO connectors are essential to maintain alignment, coupling efficiency and long-term transmission reliability in 51.2T+ networks.At the exhibition hall (Booth J1109 | TaiNEX Hall 1, Taipei), ZEISS will showcase technologies spanning wafer process control, advanced packaging, X-ray inspection, electron microscopy, light and digital microscopy, and coordinate measuring machines. Applications will focus on chip manufacturing, PCB reliability, thermal management systems, connector quality and L10-L11 rack mechanical parts assembly.COMPUTEX 2026 runs June 2-5 in Taipei, where ZEISS will position quality as a foundational enabler of the next wave of AI growth. ZEISS will speak at the official COMPUTEX 2026 Forum on June 4, 4:30 p.m. to 4:55 p.m. at TaiNEX 2, Room 701, presenting "Quality Innovation Across the AI Chip-to-Rack Stack." The session will feature Tonmoy Kundu and Clive Yen. 

As generative AI and intelligent applications continue expanding from cloud infrastructure into real-world environments, demand is rapidly increasing for Edge AI platforms capable of delivering real-time computing, low latency, space efficiency, and long-term operational stability. At COMPUTEX 2026, Shuttle Inc. will showcase a series of Edge AI computing platforms powered by Intel Core Ultra processors, highlighting AI-ready edge computing systems designed to accelerate practical AI deployment across commercial and industrial environments.As AI applications continue expanding into retail, healthcare, smart manufacturing, and visual computing environments, Shuttle continues to focus on compact and deployment-ready Edge AI platforms designed for different spaces and operational requirements.At COMPUTEX 2026, Shuttle will present Edge AI platforms ranging from compact 1-liter systems to expandable 5-liter AI workstations, supporting workloads including visual AI, intelligent analytics, digital signage, healthcare applications, agentic AI workflows, and industrial automation.Among the featured systems, the DB860 supports multi-display output and rich I/O connectivity for digital signage, retail analytics, and control center applications. The XB860G2 provides PCIe Gen5 expansion capability for GPU and AI accelerator integration targeting advanced visual analytics workloads. The ultra-compact NT20H delivers up to 99 TOPS AI performance for space-constrained edge deployments, while the fanless BPCAR03 industrial platform is designed for smart factory and AIoT environments requiring wide-temperature support and long-term reliability.In addition to hardware platforms, Shuttle will also demonstrate several Edge AI deployment scenarios across commercial and industrial environments during COMPUTEX 2026.Experience the future of Edge AI with Shuttle at COMPUTEX 2026! We warmly invite our industry partners to join us from June 2–5 at the Taipei Nangang Exhibition Center, Hall 2, 4F (Booth R0114). Connect with our team and explore our latest solutions in action. Click here to book your exclusive meeting or download our newest product highlights today!

As Artificial Intelligence (AI) applications rapidly expand from cloud computing to edge computing, smart manufacturing, networking equipment, and AI PCs, stable and high-efficiency power supply has become the critical foundation for AI system operations. FSP Group will make a major appearance at COMPUTEX 2026 under the theme "Powering AI Together," showcase to  comprehensively demonstrate its AI power solution layout from data centers to end-user devices.Collaborating with Global ICT LeadersThis year, FSP Group has joined forces with multiple AI and Information and Communications Technology (ICT) leaders to demonstrate application results. Partners include Advantech, AIC, ARBOR, Chenbro, CyberTAN, UNEEC, Intel, SPARKLE, Trust5 intelligence and Uniwill.Through live system demonstrations, FSP will showcase how its power solutions are successfully integrated into AI servers, industrial PCs, and smart devices, further driving the rapid implementation of AI business applications.Focusing on Critical Power Infrastructure in the AI EraThis exhibition showcases FSP's AI power solution portfolio spanning from data centers to end devices, focusing on the critical power infrastructure driving the AI era, including: Data Center Power Shelf, Battery Backup Unit (BBU) Shelf, Networking Power Solutions, CRPS Solutions, Industrial PC (IPC) Power Solutions, USB PD Fast Charging Solutions, Grid Resilience Solutions, AI PC Power Solutions.These exhibits fully demonstrate FSP's comprehensive technical strength from core infrastructure to terminal applications.High-Performance Computing and Edge AI ApplicationsData center solutions focus on AI servers and High-Performance Computing (HPC) applications, providing high-efficiency and reliable power support tailored for high-power, high-density, and redundancy requirements. Meanwhile, networking and edge computing applications cover diverse scenarios including PoE switches, network switches, embedded systems, and edge AI servers, aiming to meet the power demands of various AI architectures."Micro Customization" as a Core Competitive EdgeFSP stated that in the face of rapid AI market development and diversified application needs, the company continues to leverage "Micro Customization" as its core competitive advantage. By providing highly flexible and reliable power solutions tailored to different application scenarios, FSP helps customers shorten development cycles and enhance system stability and market competitiveness.Complete Layout for High-End Consumer and Retail MarketsIn addition, FSP showcased a variety of products tailored for AI workstations. This impressive lineup features high-wattage power supplies such as the CANNON 3300W, the TWINS PRO 1400W ATX(PS2) redundant power supply, the high-power TWINS CRPS 3200W redundant power supply, and the 80 PLUS Titanium-certified MEGA TI 1650W White Edition. On the chassis front, FSP introduced multiple 4U Tower/Rack hybrid AI chassis, alongside the S210 chassis, specifically designed for compact performance and certified with NVIDIA SFF READY.  Providing a complete solution from power supply to chassis cooling, this display fully demonstrates FSP's comprehensive product layout in both enterprise-level applications and high-end consumer markets.With the rapid advancement of AI applications, power supplies have evolved from backstage components to the critical core of system performance and stability. Through COMPUTEX 2026, FSP Group will further demonstrate its technical prowess and industrial layout in the AI power sector.For more information on FSP products, please visit.

iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical AI platforms. At COMPUTEX 2026 (June 2–5), iCatch will showcase its latest PAISB solutions at Booth #R0826, Nangang Exhibition Center Hall 2, 4F.As Physical AI systems rapidly evolve, developers are increasingly challenged by the complexity of multi-sensor synchronization, high-bandwidth data ingest, and image quality tuning, which often diverts resources away from core AI development. iCatch's PAISB platform directly addresses this challenge by introducing a hardware-accelerated, HSB-aligned imaging pipeline that enables deterministic, low-latency data transfer into NVIDIA GPU platforms. By offloading sensor ingest, synchronization, and imaging processing into a dedicated ASIC, PAISB allows developers to focus on AI model innovation and system-level applications, positioning iCatch as a key enabler within the NVIDIA Holoscan ecosystem for next-generation robotics, autonomous systems, and Physical AI deployments.At COMPUTEX 2026, iCatch will demonstrate two key PAISB platforms that highlight this capability. The PAISB-E1 (1GbE) can run stereo vision applications on NVIDIA platforms, designed for smart actuators and dexterous robotic manipulation requiring precise depth perception and real-time responsiveness. In parallel, the PAISB-E10 Proto-ES (10GbE) will showcase Tele/Wide imaging with EIS on NVIDIA platforms, targeting humanoid robot edge platforms and robotic factory simulation server environments. These demonstrations illustrate how PAISB enables time-aligned, high-bandwidth multi-sensor streaming while simplifying system integration."PAISB represents a key milestone in iCatch's Physical AI platform strategy," said Weber Hsu, President of iCatch Technology. "As the first HSB-aligned Imaging ASIC, PAISB enables AI developers to focus on model innovation by abstracting sensor-level complexity. We are committed to building the sensor infrastructure layer that accelerates Physical AI deployment across robotics and autonomous systems."iCatch invites industry partners and developers to visit the booth at COMPUTEX 2026 to experience live PAISB demonstrations and explore collaboration opportunities. Learn more about PAISB and Schedule a meeting or request information.

The perfect fusion of the world’s smallest fan and advanced thermal-optimized SSD technology for AI computing applications.Datotek Inc., a provider of high-performance storage and memory solutions, will showcase its latest AI-driven storage technologies at COMPUTEX 2026 in Taipei. As one of the SSD manufacturers and DRAM manufacturers focusing on AI storage innovation, Datotek will present PCIe Gen5 NVMe SSDs, memory modules, portable SSDs, and advanced SSD heatsink innovations designed for AI computing, edge AI applications, and high-performance systems.The company continues to strengthen the integration between AI technologies and high-speed storage architecture. By combining PCIe Gen5 SSD, NVMe SSD, memory modules, and intelligent thermal management technologies, Datotek aims to deliver faster, smarter, and more intuitive storage experiences for creators, professionals, gamers, and AI users.At COMPUTEX 2026, Datotek will present a wide range of AI storage and high-performance computing solutions, including PCIe Gen5 NVMe SSDs, portable SSD solutions, memory module technologies, and SSD heatsink designs optimized for AI PCs, gaming systems, creator workflows, and edge AI environments.New M.2 2280 PCIe Gen5 SSD Active Cooler: 1cm thin with extreme cooling. Credit: Datotek Inc.One of the key highlights of this year's exhibition is the debut of the "ARES AEROFIN" active SSD Heatsink solution, designed for the extreme thermal demands generated by PCIe Gen5 NVMe SSD platforms and AI-intensive workloads. The advanced cooling system combines an ultra-slim active cooling architecture, Skived Fin high-density fin technology, and a micro cooling fan to effectively reduce thermal throttling, maintain SSD stability, and improve long-term system reliability under sustained high-load operation.With an industry-leading thickness of only 1 cm and a lightweight 20 g design, ARES AEROFIN delivers a compact yet highly efficient SSD cooling solution for high-performance PCs, gaming platforms, AI computing systems, and content creation environments. Designed for AI workloads, 8K video editing, AAA gaming, and professional creator applications, the active heatsink significantly improves thermal efficiency while maintaining stable PCIe Gen5 NVMe SSD performance.Exploded view detailing the cooler module's tech & specs. Credit: Datotek Inc.In addition to performance innovation, Datotek continues to advance intuitive AI storage and portable SSD solutions that simplify data management and improve accessibility. By integrating user-centric design with high-speed storage and memory module technologies, the company aims to accelerate the adoption of AI-powered storage in everyday applications.Under intensive operating conditions, Gen5 NVMe SSD temperatures can rapidly increase and impact system stability. Equipped with the ARES AEROFIN heatsink, SSD peak temperatures can be reduced to as low as 42.6°C and stabilized at approximately 38°C during extended operation. This thermal performance enables PCIe Gen5 NVMe SSDs to sustain ultra-high-speed performance of up to 14,000 MB/s read and 12,000 MB/s write speeds without throttling, helping extend SSD lifespan and supporting more sustainable storage operation.Datotek remains committed to its core philosophy of "Technology Innovation" and "Sustainable Development." In addition to advancing SSD, NVMe, PCIe, memory module, and AI storage technologies, the company continues to promote green supply chain practices, intelligent cooling innovation, and environmentally responsible product development. Moving forward, Datotek will collaborate with global ecosystem partners to accelerate smarter and more sustainable digital transformation in the AI era.Visitors are welcome to explore Datotek's latest AI storage, PCIe Gen5 NVMe SSD, portable SSD, memory module, and advanced SSD heatsink innovations at Booth I1124, Taipei Nangang Exhibition Center, from June 2-5, 2026 during COMPUTEX 2026. For more information, please visit Datotek Official Website and Datotek Facebook Page.

As global electricity demand accelerates - driven by rapid AI computing growth, rising corporate decarbonization commitments, and increasing focus on grid stability - the power supply industry is evolving from standalone components into a foundational enabler of energy efficiency and intelligent system management. In response to this transformation, MEAN WELL, a leading global brand in standard power supplies, will present a comprehensive portfolio of solutions at COMPUTEX 2026. The showcase will extend beyond traditional power products to include smart lighting and integrated energy management systems, designed to help enterprises enhance energy efficiency, strengthen operational resilience, and advance intelligent and sustainable development.A key highlight of MEAN WELL's exhibition is system integration. In addition to power supply solutions, the company integrates controllers, communication interfaces, sensors, and energy management platforms into a unified hardware–software architecture. This holistic approach addresses diverse application needs across smart manufacturing, energy management, device networking, and operational optimization. Among the featured products, the BIC-5K series of bidirectional power supplies will stand out. Compared with the previous 2.2kW model, the BIC-5K significantly enhances power capacity to meet the growing demands of high-capacity residential energy storage systems as well as small- to medium-scale commercial storage applications. It is designed to support evolving grid compliance requirements, enabling bidirectional energy flow and Vehicle-to-Grid (V2G) applications. By facilitating flexible energy exchange among electric vehicles, energy storage systems, and the power grid, the series contributes to a more adaptive and resilient power distribution framework.Historically, bidirectional power supplies were primarily used in battery manufacturing for formation and capacity testing, enabling energy recovery during charge–discharge cycles and reducing energy waste in production environments. However, as global energy demand rises - particularly from AI data centers and other high-power applications—the role of bidirectional solutions is expanding beyond manufacturing into buildings, commercial facilities, and distributed energy systems. The introduction of the BIC-5K series reflects this shift, addressing the growing need for energy storage infrastructure, power distribution flexibility, and integrated energy management while enhancing overall system efficiency and adaptability.MEAN WELL will also showcase the XDR series rail power supplies and NSP series chassis power supplies, designed for applications in industrial machinery, automated production lines, medical equipment, and intelligent building systems. Both product lines emphasize high efficiency, wide operating temperature ranges, compact design, and robust peak power capability. These characteristics ensure stable and reliable power delivery in space-constrained environments while maintaining performance under extreme temperatures and sudden high-load conditions.Key advantages: (1)High efficiency, reducing power conversion losses and heat generation, thereby lowering overall electricity costs. (2)Wide operating temperature ranges, ensuring reliable performance in demanding environments such as industrial sites, outdoor installations, and high-temperature control cabinets. (3)Compact design, enabling system designers to optimize space utilization, increase layout flexibility and reduce material consumption. (4)Peak power capability, supporting short-term high-load demands—such as motor startup or sudden load surges—without requiring oversized power systems, thereby improving cost efficiency.By reducing energy consumption and enhancing conversion efficiency, these solutions help organizations lower carbon emissions and operational costs, aligning with ESG objectives and global sustainability trends. The design philosophy also contributes to reduced procurement expenses and lower lifecycle operating costs for end users. In this context, the XDR and NSP series represent more than incremental advancements in power supply technology; they offer a practical pathway for enterprises to strengthen competitiveness while advancing sustainable development goals.MEAN WELL will further demonstrate its solution-oriented strategy through a smart lighting kit based on the DALI-2 standard. The system integrates LED drivers, controllers, touch panels, and sensors to enable dimming control, color temperature adjustment, group management, scene configuration, and automated functions such as occupancy-based activation and automatic shutoff. This integrated approach supports both energy conservation and user comfort, making a well-suited for commercial offices, public facilities, and smart building environments.In addition to lighting solutions, MEAN WELL - together with its ESG partners - has introduced the EOS (Energy Operating System) energy management platform to provide organizations with intelligent power management capabilities. The platform integrates power supply equipment, smart meters, environmental sensors, and energy storage systems, enabling enterprises to monitor electricity consumption by floor, production line, and time period. Through comprehensive data analysis, organizations can develop optimized energy strategies, refine consumption behaviors, and improve overall operational efficiency. From system planning and equipment deployment to performance optimization and execution, MEAN WELL delivers integrated power, energy storage, and energy management solutions to support the establishment of a complete smart energy framework.Driven by the increasing global demand for electricity - particularly from AI applications - alongside the growing imperatives of energy conservation, carbon reduction, and sustainable development, MEAN WELL remains committed to advancing power technology innovation. By integrating control systems, communication interfaces, smart lighting, and energy management platforms, the company provides comprehensive, high-efficiency solutions that enhance enterprise competitiveness and energy performance.At COMPUTEX 2026, MEAN WELL will showcase the BIC-5K, XDR, and NSP product lines, along with integrated system solutions, highlighting the company's latest advancements in intelligent energy services and high-value-added technologies.

National Yang Ming Chiao Tung University (NYCU) successfully hosted the 2026 Global Consortium for Innovation and Engineering in Medicine (GCIEM) Global Summit. This international academic exchange highlighted that the cross-disciplinary integration of medicine and engineering has entered a stage of systematic development. Dr. Albert C. Yang, Chairman of the Department of Medicine and Director of the Center for Digital Medicine and Smart Healthcare at NYCU, pointed out that Taiwan is progressively stepping outside traditional medical education frameworks to cultivate interdisciplinary talent bridging engineering and healthcare. The summit served as a crucial opportunity to showcase the results of these long-term investments to a global audience.ASUS showcased its smart healthcare strategic layoutroadmap at the summit. Joe Hsieh, Chief Operating Officer of ASUS, stated that in addition to its talent pool, Taiwan possesses key foundational advantages such as comprehensive medical data, industry agility, and system integration capabilities. While these factors have accelerated the real-world deployment of related applications, ASUS remains committed to further elevating Taiwan's global visibility through ongoing industry-academia collaborations and continuous international platform connections.GCIEM Strengthens International Ties; ASUS Showcases Smart Healthcare SolutionsThe inception of GCIEM traces back to post-pandemic international exchanges. In 2022, an NYCU delegation visited the University of Illinois Urbana-Champaign (UIUC) and observed that certain academic and research institutions had already integrated engineering into medical education. This catalyzed the joint efforts to establish GCIEM and its annual summit mechanism. Following the inaugural summit in the U.S., Taiwan was selected to host the second edition. Dr. Yang believes that hosting the summit in Taiwan allowed the international community to witness Taiwan’s departure from traditional medical education, systematically demonstrating its achievements in med-tech integration while strengthening global ties.As a global leader in smart healthcare, ASUS participated in GCIEM 2026. At the summit, the company aimed not only to demonstrate its technical expertise but also to validate Taiwan's integration capabilities in engineering medicine. Joe Hsieh noted that ASUS has long been strategically positioned in medical applications. Its technological focus has evolved from early physiological data collection via the ASUS VivoWatch smart health watch and medical imaging utilizing the ASUS Handheld Ultrasound, to advanced AI applications. Progressing from sensor technology and medical image processing to model-driven AI, ASUS is now advancing toward No-Code AI platforms and Agentic AI, showcasing the evolution of medical technology from assistive tools to intelligent decision-making systems.NYCU and ASUS have collaborated extensively in recent years to integrate smart healthcare systems. A prime example is the clinical application of the ASUS VivoWatch smart health watch, which collects physiological signals to assess risks related to sleep, stress, and sleep apnea. Additionally, the introduction of Ambient AI-powered voice recognition technology has significantly enhanced clinical documentation efficiency and optimized medical workflows. Reflecting on these collaborative experiences, Dr. Yang asserted that Taiwan’s smart healthcare capabilities, in terms of both clinical techniques and medical quality, are on par with those of other advanced nations. He believes that international platforms like GCIEM will continue to expand Taiwan's global visibility, systematically presenting its achievements and advantages in the smart healthcare sector.NYCU Highlights Physician-Engineer Program to Deepen MedTech IntegrationDr. Yang further pointed out that the integration of medicine and engineering has progressed from the application layer to the talent cultivation system. To address this, NYCU has implemented a six-year Physician-Engineer Program within its Department of Medicine. The program equips medical students with a solid foundation in electrical engineering and computer science, fostering the cross-disciplinary expertise needed to drive medical innovation and bolster Taiwan's talent advantage in both fields. Joe Hsieh added that beyond talent, Taiwan possesses critical competitive advantages, including comprehensive medical data, industry speed, and exceptional system integration capabilities. [1] Joe Hsieh stated that in addition to talent, Taiwan possesses key competitive advantages such as data, speed, and system integration capabilities.He noted that Taiwan's highly concentrated industrial supply chain enables rapid technical integration and product deployment, while its long-accumulated data provides ideal conditions for AI model training.[2] Regarding medical data, Taiwan's long-accumulated data foundation provides optimal conditions for AI applications. Furthermore, the high concentration of Taiwan’s industrial supply chain enables rapid technical integration and product deployment, ensuring extraordinary industrial responsiveness. In terms of system integration, the capability to transform systems into total solutions remains a core advantage of Taiwan's MedTech ecosystem.Addressing collaborations with academic and research institutions, Joe Hsieh pointed out that as AI enters a phase of high specialization, healthcare is a field with significant barriers to entry. This requires deep, tripartite collaboration between enterprises, academia, and medical institutions to effectively bridge technology with clinical needs. He stated that Taiwan's unique geographical and industrial concentration accelerates the verification and deployment of medical research findings. ASUS has currently deployed hundreds of engineers to develop medical AI, utilizing industry-academia-research collaborations to streamline the path to bringing efficient and high-impact results to real-world clinical applications.AI Enters Clinical Decision-Making; Trust Remains the Key to Healthcare SystemsJoe Hsieh further noted that AI's role in the medical field is rapidly transforming. Medical AI has progressed from the early AI 1.0, which focused on image recognition, to AI 2.0, capable of integrating multimodal data. Moving forward, it will transition into Agentic AI featuring task execution and proactive collaboration capabilities, gradually entering the core of medical workflows.Dr. Yang emphasized that AI's clinical positioning is not to replace physicians, but rather to serve as a support system for preliminary screening and alerts. In areas such as image interpretation, endoscopy, and critical care decision-making, AI assists in improving efficiency and reducing the risk of human omission.As AI evolves from assisting in interpretation to participating in workflows, the depth of its application increases. However, the high requirements for accuracy and accountability in healthcare make trust a critical factor for adoption. Joe Hsieh pointed out that due to the inherent uncertainty in AI judgments, reliability must be enhanced through foundational computing power, trustworthy models, and multi-model cross-validation mechanisms.The question of whether Taiwan can transition from a technology adopter to a standard-setter against the backdrop of rapid medical AI development has become a key focus for both the medical and tech industries. Dr. Yang mentioned that standards are not formed through a top-down approach; instead, they emerge from applications recognized by frontline medical staff. These practical experiences are gradually refined and accumulated, eventually transforming into followable guidelines. Joe Hsieh added that the core of standardization lies in verifiability. Establishing consistent workflows through multi-model cross-validation to drive the standardization of decision-making mechanisms will be an essential foundation for developing medical Agentic AI. Throughout this process, Sovereign AI serves as the critical foundation for ensuring data and model autonomy. By leveraging its existing advantages in medical data to build sovereign models and application ecosystems, Taiwan has the opportunity to secure a stronger voice and greater strategic influence in the global development of medical AI.Refocusing on the Patient-Physician Relationship in the Era of AI WorkflowsRegarding the future development of smart healthcare in Taiwan, Dr. Yang suggested starting by enhancing patient-physician interactions. He cited the concept of a "computerless clinic," powered by Ambient Clinical Intelligence (ACI), as a prime example. In this scenario, wearable sensors and Ambient AI systems collect and analyze patient physiological data in real time, while automatically generating electronic health records (EHRs), ordering tests, and entering data into backend systems. This innovation ultimately frees the consultation process from the distractions of manual computer operations.Joe Hsieh concurred, adding from the perspective of real-world deployment that multiple Agentic AI systems featuring voice recognition, image analysis, and sensory capabilities could operate synergistically in the future. This collaborative approach establishes a digital assistant architecture with a clear division of labor. Combined with wearable devices and smart glasses, technology can be integrated seamlessly and invisibly into medical workflows to provide real-time information. This ultimately allows physicians to focus entirely on clinical judgments and patient interactions, thereby elevating overall efficiency and quality of care.Dr. Yang concluded by pointing out that hosting GCIEM 2026 has allowed Taiwan to transition its role in med-tech integration from a mere participant to an active practitioner. As AI advances from a supportive tool to decision-making and execution, the competitive focus within the healthcare industry is shifting from singular technical capabilities to system integration and the establishment of trust mechanisms. The collaboration between ASUS and NYCU demonstrates the pathway from talent cultivation and data accumulation to real-world deployment, gradually forming a replicable and scalable development trajectory. With cross-disciplinary capabilities serving as a solid foundation, Taiwan is poised not only to participate in this smart healthcare transformation but also to define its future direction.