We have recently changed our search engine. Check the Advanced options to learn the new search rules.
Bits + chips
STMicroelectronics, STATS ChipPAC and Infineon to set new milestone in establishing wafer-level packaging standards
Press release, August 7; Esther Lam, DIGITIMES
STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB) technology, based on Infineon's first-generation technology, for...
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.