Bits + chips
STMicroelectronics, STATS ChipPAC and Infineon to set new milestone in establishing wafer-level packaging standards
Press release, August 7; Esther Lam, DIGITIMES

STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB) technology, based on Infineon's first-generation technology, for...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.