At the recent Hot Chips 2025 conference, Nvidia detailed its latest GB10 system-on-chip (SoC) architecture, representing a miniaturized application of the Blackwell GPU architecture. Through collaboration with MediaTek, Nvidia integrated 20 Arm v9.2 CPU cores with a high-performance GPU into a single 2.5D package, creating a compact version of the Grace Blackwell platform.

Since taking over as CEO in March 2025, Lip-Bu Tan has rolled out sweeping organizational reforms at Intel, from business restructuring to large-scale layoffs. The overhaul has fueled an exodus of talent, spanning both junior employees and senior leadership, casting doubt on the company's future growth prospects.

Navitas Semiconductor is expanding its portfolio beyond consumer chargers to include advanced power solutions for solar inverters, motor drives, and AI data centers, Senior Field Applications Engineering Manager Rome Luo said. Speaking at SEMI-e 2025, Luo noted that the company has shipped over 300 million gallium nitride (GaN) devices, achieving high yields and very low failure rates in the field.

India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual shipments in less than a year.

At the packed China International Optoelectronic Exposition (CIOE) held at the Shenzhen World Exhibition & Convention Center, Taiwan's OtO Photonics stood out for its specialized focus on spectrometers. With over 3,800 exhibitors in attendance, OtO has carved out a leading role in the industry.

Talent has long been the defining currency in the global semiconductor race. For decades, Chinese-born engineers with deep overseas experience drove China's rapid catch-up, fueling its chip ambitions through a steady flow of returning expertise.

SK Hynix, a key supplier of HBM to Nvidia and other global clients, is reportedly scaling back its aggressive investment plans in thermo-compression bonders (TCB), equipment crucial for HBM production. Industry watchers say this shift could reshape the competitive landscape for suppliers such as Hanmi Semiconductor, even as the broader market for bonding equipment is set for strong growth in the coming years.

To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September 9, 2025. Co-chaired by TSMC and ASE Holding, the alliance brings together over thirty major companies, including Unimicron, Delta Electronics, Everlight Chemical, Scientech, Chroma ATE, GPTC, Allring, and GMM, to promote cross-domain collaboration and standardization, building a comprehensive global 3D IC ecosystem.

TSMC continues to advance its investment plan for the Pingtung Science Park, officially opening the site for vendors to begin construction. Arthur Chuang, vice president of Facility Division at TSMC, stated on September 11, 2025, that the Pingtung Science Park is Taiwan's first industrial zone focused on building fabs and related facilities.

Micron Technology is reportedly deepening its ties with the Trump administration to secure a stronger foothold in the global semiconductor market. According to South Korean media, this move could intensify competitive pressure on non-US rivals such as Samsung Electronics and SK Hynix.

South Korea's chipmakers are raising red flags as China accelerates in equipment, materials, components, and AI semiconductors. Analysts warn Beijing is no longer just closing the gap but could soon pull ahead, threatening South Korea's long-standing leadership in the global chip race.