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NEWS & VIEWS |
Taipei,
Saturday, May 17, 2008 11:59 (GMT+8)
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Well-positioned for an audio IC boom: Q&A with Wolfson CEO Dave Shrigley Design | May 16, 15:20
 Seeing demand for good quality audio performance penetrating a wide array of consumer electronics, Wolfson Microelectronics, a leading-player in the high-end audio solution market, is confident it has secured a solid position to grab the substantial business potential ahead. Read more |
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TSC polysilicon subsidiary starts operation Solar | May 16, 12:07
 The Taiwan Semiconductor Company (TSC) polysilicon subsidiary, Shan Yang (transliterated from Chinese) has already started operations in eastern Taiwan, with its sampled products achieving a highest rating of 9N-grade purity, according to the company. Read more |
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Kinsus trims 2Q sales guidance on weaker-than-expected handset substrate sales Passive, PCB, other | May 15, 12:34 | | In light of a lower-than-expected ordering amount that is expected to lead to flat chip-scale package (CSP) substrate sales, Kinsus Interconnect Technology has trimmed its second-quarter sales growth guidance to only 3%. Being uncertain about sales prospect for the third quarter, only a single-digit sequential sales growth is projected. Read more | |  |
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IC distributors confident over China white-box handsets sales in 3Q Passive, PCB, other | May 15, 01:15 | | After going through an industry trough in the first quarter, IC distributors recently expressed confidence over the sales prospects of white-box handsets in the third quarter, following advanced component bookings in the second quarter, according to sources at distributors. Read more | |  |
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Green Energy to progress with solar wafer plant investment in China Solar | May 15, 01:00 | | Green Energy Technology will soon host a shareholders meeting to discuss its investment plans in China. If shareholders approve, the solar wafer maker is likely to establish a plant at Shangdong, China, according to industry sources. Read more | |  |
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 |  |  |  | VIA to adopt 45nm process and launch dual-core CPU by the end of 2009 Manufacturing | May 15, 15:39 Taiwan-based VIA Technologies is planning to adopt a 45nm process for the manufacture of its processors, and expects to launch dual-core CPUs by the... Read more |  | IC design houses seeing stronger PC component inventory correction in June Design | May 15, 12:22 Global PC demand seems to be showing signs of weakening in the second half of May, with some IC design houses in Taiwan that have a relatively heavy... Read more | Handset PCB sales expected to post mild growth in 2Q Passive, PCB, other | May 15, 11:49 Despite the second-quarter being the traditional slow season for handset sales, printed circuit board (PCB) makers project that their quarterly sales... Read more |  | GSMC looking to take over IC Spectrum Manufacturing | May 15, 01:10 Pressured by tight 8-inch wafer capacity, Grace Semiconductor Manufacturing Corporation (GSMC) is said to looking to acquire Kunshan-based IC Spectrum,... Read more |
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Pursuit of a 100% on-year sales growth in 2008: Q&A with PTMD general manager Tom Lei Memory | May 14, 15:21
 Despite the price plunge in NAND flash dragging PTMD, a joint-venture between ProMOS Technologies and China Potevio Company on memory card sales, into losses in the first quarter of 2008, company general manager Tom Lei stated that the company aims for a 100% on-year sales growth in 2008 on substantial potential from a new China ATM card. Read more |
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Taiwan packaging and testing companies caution against quake-impact overreaction Manufacturing | May 14, 14:55 | | Despite concerns the 7.8-magnitude earthquake in Sichuan, China may have a possible impact over ongoing IC supply as Intel and Semiconductor Manufacturing International Corporation (SMIC) both run IC backend facilities in the region, industry players from Taiwan caution against overreacting. Read more | |  |
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AMD planning to outsource CPU production to TSMC in 2H08, say sources Manufacturing | May 13, 14:40 | | In addition to its GPU production, AMD is planning to also outsource CPU production to Taiwan Semiconductor Manufacturing Company (TSMC) in the second half of this year, according to industry sources. Read more | |  |
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SMIC China fabs not affected by quake Manufacturing - Newswatch | May 13, 12:27 | | Semiconductor Manufacturing International Corporation (SMIC), which runs a packaging and testing operation and an 8-inch fab in Chengdu as well as a 12-inch fab in Wuhan, said its operations are not being affected by an earthquake that took place in China's Sichuan province on May 12. Read more | |  |
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 |  |  |  | Chipond echoes Novatek with optimistic LCD driver IC outlook for 2Q Manufacturing | May 13, 16:16 Following Novatek Microelectronics' projection for a warming up LCD driver IC in the second quarter, Chipbond Technology chairman Fei-Jain Wu echoed... Read more |  | Chang Wha adjusts strategy to tap in LED leadframe production Passive, PCB, other | May 13, 15:22 Instead of the planned deployment into the LED packaging segment, Chang Wha Electromaterials has decided to adjust its strategy by tapping into LED leadframe... Read more | IC packaging and testing industry braces for a slow growth in 2Q, say sources Manufacturing | May 13, 01:15 The growth prospects for the IC packaging and testing industry, including packaging and testing materials, in the second quarter of this year will be... Read more |  | Samsung beats out STMicroelectronics for Nokia 5-megapixel CMOS image sensor orders Manufacturing | May 13, 01:10 Nokia has chosen Samsung Electronics over STMicroelectronics as an additional supplier for high-end 5-megapixel CMOS image sensors, as the South Korea... Read more |
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Intel gains SSD orders from Google, say sources Memory | May 12, 11:59 | | Google plans to switch some of its servers over to solid-state drive-based (SSD-based) storage supplied by Intel in order to lower electricity consumption, according to sources at memory makers. Read more | |  |
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ProMOS chairman explains selection of Hynix for partnership Memory | May 9, 11:24
 ProMOS Technologies has chosen Hynix Semiconductor over Elpida Memory for collaboration in sub-70nm processes because extending the existing partnership with Hynix will save a lot of investment in equipment, explained ProMOS chairman ML Chen. Read more |
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MediaTek sees moderate revenues increase in April thanks to handset performance in China Manufacturing | May 9, 01:15 | | MediaTek has announced revenues of NT$8.33 billion (US$268.88 million) for April 2008, increasing by 7.44% on month and 36.05% on year due largely to orders from China handset makers. Read more | |  |
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 |  |  |  | Pixart to market PC cam and handset CIS controller chips in 2H08 Manufacturing | May 9, 14:36 Pixart Imaging, a Taiwan-based IC design house that supplies solutions for Nintendo Wii remote controllers, expects its revenues will expand substantially... Read more |  | MediaTek and Spreadtrum ready to enter mobile TV solution segment Manufacturing | May 9, 12:25 Eyeing the potential mobile TV market in China, the leading handset chip makers in Taiwan and China are ready to enter the mobile TV solution segment... Read more | UMC revenues up 4.8% on year in April Manufacturing - Newswatch | May 9, 11:29 United Microelectronics Corporation (UMC) posted revenues of NT$8.52 billion (US$274 million) in April, up 0.2% sequentially and up 4.8% on year, according... Read more |  | Third-party DRAM module market to rebound in 2008, says iSuppli Memory | May 9, 10:43 Following a miserable 2007, the global DRAM module market is expected to rebound gradually in 2008 due to the projected recovery in the overall memory... Read more |
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Asia Pacific Microsystems to upgrade MEMS fabs Manufacturing | May 8, 15:58 | | Taiwan-based Asia Pacific Microsystems (APM), a micro electro-mechanical systems (MEMS) foundry and affiliate of United Microelectronics Corporation (UMC), plans to upgrade its two 6-inch fabs into 8-inch ones in order to cope with rising demand from the MEMS sector, according to market sources. Read more | |  |
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ProMOS and Elpida call end to planned partnership Manufacturing | May 8, 11:35 | | Taiwan-based ProMOS Technologies and Japan's Elpida Memory have called an end to their planned cooperation in the development of next-generation DRAM technology, causing the Taiwan DRAM maker to renew cooperation talks with South Korea's Hynix, according to market sources in Taiwan. Read more | |  |
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IC packaging houses looking to copper due to high price of gold Manufacturing | May 7, 16:35 | | Taiwan-based IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) as well as Amkor and STATS ChipPAC are developing copper-wire bonding processes to replace conventional processes based on gold wire because of the increasing price of gold, according to industry sources in Taiwan. Read more | |  |
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DRAM contract prices reportedly rise by 10% in 1H May Memory | May 7, 11:18 | | Following a price hike in the latter half of April, DRAM makers have once again raised contract prices for computer memory chips by 10% for the first half of May, according to market sources in Taiwan. Read more | |  |
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Intel, Samsung and TSMC reach agreement for 450mm wafer manufacturing transition Manufacturing | May 6, 15:07 | | Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and help maintain a reasonable cost structure for future integrated circuit manufacturing and applications. Read more | |  |
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Notes and corrections |
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A May 15 article incorrectly stated that VIA Technologies has forecast CPU shipments in 2008 will increase around 20-30% on year. The actual forecast is for double or triple on-year growth. |
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