As NAND leaders recalibrate production allocation, Taiwan's Winbond Electronics and Macronix International are doubling down on specialized segments. Both are expanding their presence in embedded and automotive applications, betting that shortages in low-capacity eMMC will open lucrative opportunities.
Following Yageo's announcement on August 21, 2025, that it has increased its tender offer bid (TOB) for Shibaura Electronics to JPY6,635 (US$44.64) per share, up from JPY6,200, Japanese competitor MinebeaMitsumi declared it will not raise its offer beyond JPY6,200 per share, report Nikkei and Reuters.
Google has officially launched its latest lineup of Pixel devices, all powered by the next-generation Tensor G5 chip, built using TSMC's cutting-edge 3nm process. In a rare move, Google's US headquarters publicly acknowledged its partnership with the Taiwanese chipmaker, underscoring the growing strategic importance of Taiwan's semiconductor supply chain.
Nvidia's H20 AI chip, once expected to anchor its sales in China, now faces an uncertain future as reports surface of halted production orders amid Beijing's push for local alternatives. The back-and-forth US export bans and policy shifts have left the chip's fate entangled in geopolitics and nationalism.
The US government has no plans to take equity stakes in major semiconductor companies like TSMC and Micron, despite speculation fueled by recent comments on potential investments in Intel
Nvidia CEO Jensen Huang made an unannounced visit to TSMC on August 22, arriving at Taipei airport early in the morning by private jet. Huang stated that the purpose of this trip to Taiwan was to meet with TSMC to further discuss production plans for the upcoming Rubin GPU chip entering trial production.
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach could significantly impact the semiconductor packaging supply chain, especially within the PCB industry.
Taiwan-based passive components giant Yageo announced it has increased its tender offer price for Japan's negative temperature coefficient (NTC) thermistor manufacturer Shibaura Electronics. The offer price was raised from JPY6,200 (US$41.86) per share to JPY6,635 per share, surpassing the expectations of competitor MinebeaMitsumi.
The high-bandwidth memory (HBM) supply landscape for Nvidia is expected to experience significant changes in 2026. Currently, about 90% of Nvidia's HBM is supplied by SK Hynix, but forecasts indicate that SK Hynix's share will drop to around 50% in 2026.
Samsung Electronics' foundry business plans to leverage its Hyper Cell technology to maintain its competitiveness in the 2nm semiconductor process. By adopting a more flexible chip design, the company aims to enhance both performance and power efficiency, with the goal of significantly expanding its presence in the high-performance computing (HPC) market.
The US International Trade Commission (ITC) has issued a preliminary ruling against China's BOE, banning its OLED panels from the US market for nearly 15 years. The decision opens opportunities for South Korean panel makers but raises risks for Taiwanese DDI suppliers closely tied to BOE, including Novatek.
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