DIGITIMES Semiconductors news

Apr 1

TSMC eyes SiPh breakthrough as industry consensus forms

TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC vice president and co-chair of the SEMI Silicon Photonics Industry Alliance (SiPhIA), K.C. Hsu, said that over the past 3-6 months, the industry has gradually reached a consensus on the technology roadmap and direction for the next 3-5 years. SiPh has also been designated by the government as a key policy focus in this new era.

Nexchip applies for HK listing amid mature-node expansion

Apr 1

Fujitsu plans 1.4nm AI chip Japan-based production with Rapidus

Apr 1

Micron reportedly developing stacked GDDR to address shifting AI memory demand

Apr 1

Nvidia's US$2 billion bet on Marvell turns rivals into ecosystem partners

Apr 1

MORE NEWS

IC DESIGN, DISTRIBUTIONDenso targets US$54 billion revenue, Rohm deal faces Toshiba-Mitsubishi alliance hurdle

Apr 2, 08:05

Japan's auto parts supplier Denso on March 31 unveiled a mid-term business plan through March 2031, targeting revenue of JPY8 trillion (approx. US$54 billion) and a return on equity (ROE) of 11%. The strategy underscores a shift toward semiconductors as a core growth driver, alongside vehicle electrification and intelligent systems, signaling ambitions beyond its traditional role as an automotive supplier.

PASSIVE, PCB, OTHER IC COMPONENTSACME sees AI-driven shipment growth; oil price surge boosting EV demand turnaround

Apr 2, 08:05

Benefiting from the AI infrastructure boom, Taiwan-based soft magnetic ferrite core and silicon carbide (SiC) powder supplier Acme Electronics Corporation (ACME) expects growth in its soft magnetic core business in 2026, as AI servers drive demand for high-performance passive components and SiC-based power devices.

MEMORY CHIPSInterview: How Europe's two-year AI lag is becoming a security liability

Apr 2, 08:04

While North America and Asia race to deploy "physics-bending" AI hardware, Europe has opted for a "wait-and-see" approach, shielded by thick layers of regulation. In a DIGITIMES Asia interview, CONTEXT World senior analyst Aaron Smith argues this is creating a vulnerability window. As Europe moves cautiously to ensure regulatory compliance, it is inadvertently extending the life of aging, insecure legacy systems. Meanwhile, advanced AI cyberattacks are intensifying, adding pressure to European enterprises.

MEMORY CHIPSKioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026

Apr 2, 08:04

Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D architectures and tighter capacity allocation.

IC MANUFACTURINGTop 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Apr 2, 08:04

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior suggests a far more significant structural shift is underway.

IC MANUFACTURINGTSMC says COUPE platform set for production as Samsung outlines SiPh push

Apr 2, 08:03

TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects in AI data centers pushes optical technologies closer to commercial deployment.

IC DESIGN, DISTRIBUTIONTop 10 Chart: Markets signal AI shift as Taiwan IC designers decouple from early-year revenues

Apr 2, 08:02

Taiwan's IC design sector is undergoing a decisive shift in 2026, with capital markets effectively validating an industry transition toward artificial intelligence (AI), even as recent revenue data still reflects older demand cycles.

IC MANUFACTURINGSamsung auctions 123 chip tools during Xi'an NAND upgrade to V8

Apr 1

Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process technologies.

IC MANUFACTURINGSiPh and advanced packaging shine at Touch Taiwan

Apr 1

The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that with the panel industry undergoing a full transformation, half of the exhibitors this year are non-display manufacturers. The event focuses heavily on new business opportunities in silicon photonics (SiPh) and advanced packaging amid the arrival of the "light over copper" era.

IC MANUFACTURINGAMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy

Apr 1

Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment firm Sizone through a combination of share issuance and cash. This move could mark AMEC's entry into the wet process segment, an area where it previously had limited presence.

MEMORY CHIPSSouth Korean chipmakers stockpile helium, diversify supply beyond Qatar

Apr 1

South Korean semiconductor manufacturers hold enough helium inventory to sustain production through at least June, easing concerns over potential supply disruptions, according to government and industry sources.

More coverage