DIGITIMES Semiconductors news

Apr 30

TSMC's AI chip plans remain on track; CoWoS capacity to double in 2025

TSMC's advanced packaging capacity for artificial intelligence (AI) chips remains within forecast ranges for 2025, contrary to recent market speculation about order reductions from key customers like Nvidia, according to industry supply chain sources.

Samsung reportedly exits HBM2E under Chinese price offensive, shifts focus to high-end market

Apr 30

China cracks EUV light source barrier, builds new experimental platform

Apr 30

Intel advances 18A, 14A nodes to anchor US foundry strategy

Apr 30

Outpaced and overbuilt: Intel’s $20B crisis

Apr 30

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MEMORY CHIPSDRAM process development challenges: DRAM structure in process miniaturization

May 1, 15:04

Since its 1970 debut, DRAM has supplanted magnetic core memory as an essential element in von Neumann's computer architecture. By the mid-1980s, fueled by the popularity of PCs and workstations, DRAM became the leading market share product in the semiconductor industry.

IC MANUFACTURINGTSMC Arizona expands: One fab, two tones

May 1, 07:42

TSMC has broken ground on its third semiconductor fabrication plant in Arizona, marking a major expansion of its U.S. operations and reinforcing the Biden-to-Trump continuity in onshoring advanced chipmaking capacity. The move was prominently highlighted by the U.S. Department of Commerce as part of its broader campaign to revive domestic manufacturing.

MEMORY CHIPSSamsung taps Llama 4 to close semiconductor gap with Hynix, Micron

May 1, 07:06

Samsung Electronics' Device Solutions (DS) division has begun deploying Meta's latest generative AI model, Llama 4, marking a strategic pivot to strengthen its internal AI capabilities and sharpen its competitive edge in the global memory and semiconductor race.

MEMORY CHIPSChina's DRAM surge could upend global memory prices and supply chains, warns Etron

May 1, 07:04

The global memory market is recovering from a downturn, with memory poised to become a key pillar of AI computing. However, Etron Technology Chairman Nicky Lu warned that Chinese manufacturers are rapidly expanding low- to mid-end DRAM capacity, potentially boosting China's market share to 40% within two years and disrupting global pricing and industry structure.

IC DESIGN, DISTRIBUTIONHuawei reportedly ships 910C AI supercluster, said to outpace Nvidia's NVL72; eyes 910D next

May 1, 07:03

Huawei has reportedly begun shipping its CloudMatrix 384 artificial intelligence (AI) system, powered by 384 Ascend 910C chips. The company claims the setup delivers 67% more computing power than Nvidia's NVL72 system but at the expense of significantly higher energy use and staffing requirements.

IC DESIGN, DISTRIBUTIONMediaTek posts 48% gross margin in 1Q25, eyes custom chip revenue lift from 2026

May 1, 07:03

MediaTek released its first-quarter 2025 earnings on April 30, with CEO Rick Tsai reaffirming confidence in the long-term growth potential of AI, describing it as an enduring and expanding market trend.

IC MANUFACTURINGArdentec eyes IDM outsourcing gains as auto, industrial demand stay weak

Apr 30

Ardentec Corporation reported in its first-quarter 2025 earnings call that strong demand for AI- and HPC-related communications products, along with gains from back-end packaging "white list" transfers, has provided solid momentum for first-half growth. However, demand from international IDM customers in the automotive and industrial sectors remains sluggish, with no clear signs of recovery.

IC MANUFACTURINGSmartphone strength cushions Samsung's 1Q25 chip slump

Apr 30

Samsung Electronics reported its financial results for the first quarter of 2025, revealing revenue of KRW79.1 trillion (US$55.4 billion) and an operating profit of KRW6.7 trillion. Despite ongoing struggles in its semiconductor business, strong smartphone sales significantly contributed to the company's quarterly performance.

IC MANUFACTURINGIntel CEO's four turnaround strategies unveiled

Apr 30

Facing the biggest crisis in Intel's history, CEO Lip-Bu Tan brings his extensive semiconductor supply chain and competitive landscape expertise to bear. Since taking office, he has swiftly implemented a comprehensive organizational overhaul while pinpointing the critical issues hampering Intel Foundry's progress.

IC MANUFACTURINGCR Micro semiconductor upcycle soars on SiC, GaN breakthroughs amid strong 2024 results

Apr 30

China Resources Microelectronics Ltd. (CR Micro) reported steady gains in its 2024 annual and 2025 first-quarter results, underscoring resilience in a volatile chip market. Full-year revenue rose 2.2% to CNY10.119 billion (US$1.39 billion), with net profit reaching CNY762 million. In the fourth quarter of 2024, revenue grew 11.65% year-over-year to CNY2.647 billion, while net profit jumped 20.18% quarter-over-quarter to CNY263 million.

IC DESIGN, DISTRIBUTIONChina's GalaxyCore rides high-pixel boom to triple profit, targets AI glasses, automotive vision next

Apr 30

GalaxyCore Inc. reported its 2024 earnings on April 28, posting annual revenue of CNY6.383 billion (approx. US$875 million), a 35.9% increase from the previous year. Net profit attributable to shareholders soared 287.2% to CNY187 million, while EBITDA rose 107.1% to CNY1.415 billion.

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K&S partners with Taiwanese semiconductor leaders in advanced packaging push

Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's semiconductor packaging equipment giant Kulicke & Soffa (K&S) has confirmed its close collaboration with Taiwan's semiconductor foundry leaders in the advanced packaging field for high-end chips.

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