SanDisk has announced that the iNAND Ultra line of products will be the first of its embedded flash memory products to move to 19nm manufacturing technology.
Shrinking the size of electronic circuitry allows equipment makers to develop products with larger storage capacities, providing consumers the ability to enjoy more content on smartphones, tablets and other electronic devices. A nanometer measures one-billionth of a meter, meaning that 19nm circuit lines are so small that about 3,000 of them could fit across the width of a human hair.
iNAND Ultra solutions are used by leading mobile device makers around the world. The e.MMC (standards-based embedded mobile interface) devices built on SanDisk's 19nm technology will use the company's two-bit per cell technology-SanDisk's 10th generation of multi-level cell products. Sleeker, slim form factor product designs are also enabled by SanDisk's innovative packaging technology that provides up to 64GB of storage capacity in a package just 11.5x13mm in size. Advanced packaging techniques allow SanDisk to offer certain capacities in packages as thin as 1mm.
iNAND Ultra products are optimized for current and future generations of mobile operating systems such as Google Android and Windows Mobile.
The new products feature up to 20 megabyte per second (MB/sec) sequential write and up to 80MB/sec sequential read performance for faster file transfers. In addition, SanDisk works closely with major OEMs and chipset vendors to ensure the tight integration required between the host device and embedded flash memory.
SanDisk's iNAND Ultra products will initially be available in 8GB to 64GB capacities with samples expected to be available to customers in the first quarter of 2012. Volume production is expected in the second quarter.