Taipei, Friday, May 24, 2013 17:06 (GMT+8)
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Samsung 8GB RDIMM utilizing 3D TSV technology
Photo: Company [Dec 9, 2010]
Samsung Electronics has announced its new 8GB DDR3 module was developed using 3D chip stacking technology, which is also referred to as through silicon via (TSV).

Samsung claimed its TSV technology is a key to solving the paradox of driving lower power consumption in servers, while increasing memory capacity and improving performance.

The new 8GB RDIMM utilizing its 3D TSV technology saves up to 40% of power as compared to a conventional RDIMM, the vendor said. Also, the TSV technology allows for improvement in memory chip density that is expected to offset the decrease of memory sockets in next-generation server systems. In the face of a 30% decrease in memory slots in next-generation servers, Samsung said its TSV technology will be able to raise the DRAM density by more than 50% making it highly attractive for high-density, high-performance server systems.

Samsung also plans to apply the features of its TSV technology to 30nm-class and finer process nodes. The company expects the widespread adoption of 3D TSV technology to take place from 2012.
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24-May-2013 markets closed

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COMPUTEX TAIPEI Summit Forum 2013
Trends and forecast for 2013 touch panel market
Trends in China LED chip and packaging sector
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    Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.

  • Trends in the China video market

    In addition to strong potential video content demand in China, the market has developed rapidly due to government intervention and delays in establishing copyright protections.

  • 4Q12 trends in the Greater China touch panel industry

    In the second half of 2012, the market focus is on the iPhone 5, which uses in-cell touch screen technology. Due to the integration of display panels and touch panel functions, the high technological threshold will mean Taiwan touch panel makers are unable to enter the iPhone supply chain.